The invention relates to a soldering tip assembly for an electric soldering device, in particular a soldering iron. The soldering tip assembly is designed to be releasably arranged on a soldering device handle which has a heating element, and the soldering tip assembly has a sleeve with a soldering tip provided on the distal end of the sleeve. The sleeve has an opening at the proximal end for introducing the heating element, wherein a holding element which at least partially surrounds the sleeve in an annular manner and a spring element which is provided between the holding element and the sleeve are provided, the spring element pushing the holding element in the distal direction. The sleeve has at least one stop arranged distally from the spring element. The stop secures the holding element against the soldering tip assembly in the distal direction.

A method of producing a vehicle glass assembly, includes (A) providing a connector made of metal plate and comprising a first flat portion, a second flat portion and a bridge portion connecting between the first and the second flat portions, each the flat portion having a respective surface to be soldered, (B) soldering lead-free solder onto the surfaces to form first and second blocks of lead-free solder on the surfaces of the first flat portion and the second flat portion, respectively, (C) providing a glass substrate layer on which an electrically conductive layer comprising a wire pattern and a busbar is formed, and (D) sandwiching the lead-free solder blocks between their respective surfaces and the busbar, and then melting the blocks to form solder connections between the connector and the busbar; wherein the amount of lead-free solder in each of the blocks is between 15 mg and 50 mg.

A melting tool control apparatus comprises a drive mechanism, a melt processing assembly configured to perform a melt process, a receiving module that receives input of three-dimensional coordinate information of a first point where the melt process is to be performed and input of a position information indicating a position different from the first point, and a process control module configured to control the melt processing assembly to perform the melt process when the distal end is at the first point.

A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.

A soldering tip for a soldering iron is presented. In one aspect, the soldering tip is used in a hand-held soldering iron for soldering an electrical connection element on an electrically conductive structure on a substrate. The soldering tip includes a substantially hemispherical end portion. Also presented is a method for producing a pane with an electrical connection element using the soldering tip with a hand-held soldering iron.

A soldering apparatus comprises a soldering mechanism and a management unit. The management unit converts operation history of the soldering mechanism into a numerical value, compares the numerical value to a predetermined threshold value, and generates a notifying signal if the numerical value exceeds the predetermined threshold value. The notifying signal may result in cessation of operation of the soldering mechanism. The notifying signal may result in a visual and/or audio reminder to the operator to inspect or replace a part of the soldering mechanism. With the management unit, the operator need not guess or rely on personal experience to determine when to perform an inspection or replacement. Reliance on personal experience can be error prone and lead to inefficiency. The management unit may reduce the possibility of soldering with a degraded soldering tip or other part, which may have an adverse effect on soldering quality.

A brush assembly for a device with a motor for cleaning soldering tools may include a base portion, a brush drive ring, and a locking assembly. The base portion may include a cylindrical core member and a cleaning brush. The cleaning brush may be disposed around a perimeter of the core member and may extend radially away from the core member. The locking assembly may include a first locking member, a second locking member, and an annular retention member. The first and second locking members may be configured to interface with one another. The annular retention member may define a resting state for the locking assembly, in which the first and second locking members may grip a shaft of the motor. The annular retention member may also define a transient state for the locking assembly, in which the first and second locking members may move out of the resting state.

A soldering apparatus has a soldering iron unit having a soldering tip for carrying out a soldering process to a printed circuit board, a heater unit for heating the soldering iron unit, and a gas supply device for operatively supplying a burning-assist gas to the soldering iron unit, when a cleaning process is carried out for the soldering iron unit. The cleaning process for the soldering iron unit is carried out when the soldering process to the printed circuit board is stopped. In the cleaning process, the soldering iron unit is heated by the heater unit and the burning-assist gas is supplied to the soldering iron unit, so that material attached to the soldering iron unit can be easily burnt out.

A soldering apparatus is provided with a soldering iron for soldering with a tip, a driving portion for moving the soldering iron, a storage portion that stores position information indicating a soldering position and identification information associated each other, a reading portion that reads target identification information attached to the work target, an acquiring portion that acquires position information in the storage portion matching the target identification information read by the reading portion, and a process control portion for controlling the driving portion and the soldering iron so as to perform soldering at the position indicated by the position information acquired by the acquiring portion.

A soldering apparatus is provided with a soldering iron for soldering with a tip, a driving portion for moving the soldering iron, a storage portion that stores position information indicating a soldering position and identification information associated each other, a reading portion that reads target identification information attached to the work target, an acquiring portion that acquires position information in the storage portion matching the target identification information read by the reading portion, and a process control portion for controlling the driving portion and the soldering iron so as to perform soldering at the position indicated by the position information acquired by the acquiring portion.