The present invention relates to inserts for hard facing substrates, and a method for hard facing substrates. An insert according to an embodiment of the present invention may comprise a body of ultra-hard material having a welding node located on a first surface thereof and at least one wire electrically connecting the first surface to a second, opposite, surface. In use, the inserts may be temporarily connected to a substrate by applying a resistance welding electrode to the welding node, thereby causing the wires on the second surface to melt and weld the insert to the substrate. A subsequent brazing step may firmly attach the inserts to the substrate.

A solder device includes a light source, a solder module, an optical guiding assembly, a sensor and a feedback controller. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The optical guiding assembly, the sensor and the feedback controller are integrated as a system controller. Therefore, the volume and weight of the solder module are compacted.

A reflow soldering system comprising one or a plurality of individually heatable soldering process zones. The reflow soldering system is configured to supply heat to a workpiece selectively through condensation or through convection or as a combination of convection and condensation.

An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.

A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.

A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.

A solder ball bonding (SBB) tool includes a rotatable feed plate for transporting solder balls from a translatable solder ball reservoir to a nozzle unit, which is a position at which a laser light source can irradiate and thus melt the solder balls. The SBB tool includes a gap between the reservoir and the feed plate positioned over the reservoir, and a feed mechanism coupled with the reservoir, where the feed mechanism is driven by a pressurized gas to translate the reservoir upward across at least a portion of the gap in preparation for movement of a solder ball to the feed plate and downward in preparation for rotation of the feed plate after a solder ball is moved to the feed plate. The gap may have a maximum size that exceeds a nominal size of the solder balls contained in the reservoir.

A solder ball bonding (SBB) tool includes a rotatable feed plate for transporting solder balls from a translatable solder ball reservoir to a nozzle unit, which is a position at which a laser light source can irradiate and thus melt the solder balls. The SBB tool includes a gap between the reservoir and the feed plate positioned over the reservoir, and a feed mechanism coupled with the reservoir, where the feed mechanism is driven by a pressurized gas to translate the reservoir upward across at least a portion of the gap in preparation for movement of a solder ball to the feed plate and downward in preparation for rotation of the feed plate after a solder ball is moved to the feed plate. The gap may have a maximum size that exceeds a nominal size of the solder balls contained in the reservoir.

A brazing apparatus to join a first component and a second component includes a heating element configured to melt a ring located at a joint between the first component and the second component, and a probe configured to contact the ring. A position of the probe is biased toward the ring. The probe is installed at a probe support. The probe is movable along a probe central axis relative to the probe support. A sensor is operably connected to the probe and is configured to determine movement of the probe along the probe central axis. The movement of the probe is indicative of melting of the ring.

A pressing area set on a main surface of a plate-shaped holding jig is arranged on contact parts. The contact parts are pressed against a multilayer board while heating the multilayer board and the pressing area of the holding jig is inclined with a warp of the multilayer board. In this way, when pressing for bonding the contact parts is performed, even if the multilayer board is warped by the heating and the contact parts are shifted, the contact parts are pressed against the multilayer board without fail.