A reflow device configured to perform reflow soldering on a substrate having a first component and a second component having a heat capacity larger than a heat capacity of the first component. The reflow device includes a plurality of heating sections applying gas to the substrate, a booth accommodating the heating sections, and a controller configured to perform, at least twice or more times, a heating control of controlling the heating sections to increase both of a temperature of the first component and a temperature of the second component, and then reduce the temperature of the first component while increasing the temperature of the second component.

A solar cell connecting method for manufacturing a solar cell string, includes placing first interconnectors on a working table by a first fixing member fixing both sides of the first interconnectors in a longitudinal direction and transporting the first interconnectors in a state that the first interconnectors are spaced apart from each other at intervals; placing a first solar cell on the first interconnectors, fixing the first solar cell and the first interconnectors by an exhaust adsorption, and releasing the first fixing member from the first interconnectors; and placing second interconnectors on the first solar cell and the working table by the first fixing member fixing both sides of the second interconnectors in a longitudinal direction and transporting the second interconnectors in a state that the second interconnectors are spaced apart from each other at intervals.

A solar cell connecting method for manufacturing a solar cell string, includes placing first interconnectors on a working table by a first fixing member fixing both sides of the first interconnectors in a longitudinal direction and transporting the first interconnectors in a state that the first interconnectors are spaced apart from each other at intervals; placing a first solar cell on the first interconnectors, fixing the first solar cell and the first interconnectors by an exhaust adsorption, and releasing the first fixing member from the first interconnectors; and placing second interconnectors on the first solar cell and the working table by the first fixing member fixing both sides of the second interconnectors in a longitudinal direction and transporting the second interconnectors in a state that the second interconnectors are spaced apart from each other at intervals.

A system controller includes a light source, an optical guiding assembly, a sensor and a feedback controller, and is applied to perform a solder operation with a solder module. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The system controller is a static part, and the solder module is a dynamic part.

Disclosed is a flame brazing control method for copper-aluminum welding, characterized by using a flame generated from the combustion of natural gas, air and oxygen as the heat source, the molar flow ratio of natural gas, air and oxygen is controlled within a range of 1:10-22:0.3-2.2. Further disclosed is an automatic brazing apparatus for copper-aluminum welding, characterized by using a flame generated from the combustion of natural gas, air and oxygen as the heat source, includes three gas delivery systems for natural gas, air and oxygen, a mixer for mixing the three gas, and integrated flow controllers for the electromagnetic valves and flow valves in the three gas delivery systems.

Disclosed is a method for attaching an interconnector of a solar cell panel. The method includes forming a first interconnector-jig coupling by fixing a plurality of first interconnectors to a jig, locating the first interconnector-jig coupling over a working table, fixing the first interconnectors and a first solar cell to each other, separating the jig from the first interconnectors, and attaching the first interconnectors to the first solar cell by applying heat to the first interconnectors and the first solar cell, which are thereby fixed to each other.

Disclosed is a method for attaching an interconnector of a solar cell panel. The method includes forming a first interconnector-jig coupling by fixing a plurality of first interconnectors to a jig, locating the first interconnector-jig coupling over a working table, fixing the first interconnectors and a first solar cell to each other, separating the jig from the first interconnectors, and attaching the first interconnectors to the first solar cell by applying heat to the first interconnectors and the first solar cell, which are thereby fixed to each other.

A component joining apparatus, which can realize positioning between a component and a substrate with high accuracy by avoiding influence of thermal expansion of the substrate at the time of joining the component to the substrate by heating at a high temperature, includes a component supply head holding a component and a heating stage heating and holding a substrate, in which a heating region where the heating stage contacts the substrate includes a joining region of the substrate in which the component is joined, and the substrate is larger than the heating stage and a peripheral part of the substrate does not contact the heating stage.

An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.