The present invention relates to inserts for hard facing substrates, and a method for hard facing substrates. An insert according to an embodiment of the present invention may comprise a body of ultra-hard material having a welding node located on a first surface thereof and at least one wire electrically connecting the first surface to a second, opposite, surface. In use, the inserts may be temporarily connected to a substrate by applying a resistance welding electrode to the welding node, thereby causing the wires on the second surface to melt and weld the insert to the substrate. A subsequent brazing step may firmly attach the inserts to the substrate.

The present invention relates to inserts for hard facing substrates, and a method for hard facing substrates. An insert according to an embodiment of the present invention may comprise a body of ultra-hard material having a welding node located on a first surface thereof and at least one wire electrically connecting the first surface to a second, opposite, surface. In use, the inserts may be temporarily connected to a substrate by applying a resistance welding electrode to the welding node, thereby causing the wires on the second surface to melt and weld the insert to the substrate. A subsequent brazing step may firmly attach the inserts to the substrate.

A heat-bonding apparatus and method of manufacturing a heat-bonded product not allowing the temperature of the object to be heat-bonded to overshoot greatly from a specified target temperature, and setting the temperature of the object to the target temperature in a shorter time and with higher efficiency and accuracy than the conventional when heat-bonding in vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for the buffer part in contact with the object in the chamber, a cooler for the buffer part, a sensor for detecting temperature of the object heated through the buffer part and a controller for controlling the temperature of the object to be the target temperature by adjusting heat discharge from the buffer part with the cooler based on the detected temperature of the object.

A heat-bonding apparatus and method of manufacturing a heat-bonded product not allowing the temperature of the object to be heat-bonded to overshoot greatly from a specified target temperature, and setting the temperature of the object to the target temperature in a shorter time and with higher efficiency and accuracy than the conventional when heat-bonding in vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for the buffer part in contact with the object in the chamber, a cooler for the buffer part, a sensor for detecting temperature of the object heated through the buffer part and a controller for controlling the temperature of the object to be the target temperature by adjusting heat discharge from the buffer part with the cooler based on the detected temperature of the object.

An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

The invention details the designs of cleaning pad assemblies for use with heating tools including for example soldering cartridges and soldering irons. The cleaning pads of the assembly are designed to effectively remove and clean the solder from heating tools during and at the end of soldering operations, and allow the collection of the removed solder.

A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.

A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.

Disclosed example systems include: a collecting device, a weighing device, and a control device. The collecting device is disposed in a cooling zone, and is configured to collect contaminants. The collecting device is mounted on the weighing device. The weighing device is configured to weigh the collecting device to obtain weight information of the collecting device. The control device is configured to determine whether the reflow oven needs to be cleaned based on the weight information of the collecting device. The method comprises collecting contaminants in a cooling zone by a collecting device, weighing the collecting device to obtain weight information of the collecting device, and determining whether the reflow oven needs to be cleaned based on the weight information of the collecting device.