A paste dispensing transfer system of a stencil printer is configured to print an assembly material on an electronic substrate. The transfer system includes a paste cartridge mechanism coupled to a print head assembly of the stencil printer, and a rotary indexing mechanism coupled to a frame of the stencil printer. The paste dispensing transfer system is configured to transfer a used paste cartridge from the print head assembly to the rotary indexing mechanism supported by the frame and to transfer a new paste cartridge from the rotary indexing mechanism to the print head assembly.

A method of attaching an electrical connector to a glass substrate, includes the steps of positioning a connector over a glass substrate in an area for attaching the connector, and extruding a soldering material over the connector. Where the glazing includes a busbar on the glass substrate, the busbar may be arranged in the area for attaching the connector.

An improved molten solder injection head having a vacuum filter and differential gauge system is provided. In one aspect, an injection head is provided. The injection head includes: a reservoir; an injection port on a bottom of the injection head connected to the reservoir; a vacuum port adjacent to the injection port on the bottom of the injection head connected to a vacuum source; and a filter disposed between the bottom of the injection head and the vacuum source. A method for molten solder injection using the present injection head is provided.

A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.

Disclosed are ball jumping apparatuses and ball absorption methods using the same. The ball jumping apparatus comprises a fixing part, a moving part spaced apart from the fixing part, and a resilient member that connects the fixing part and the moving part to each other. The resilient member extends upwardly from the fixing part and has a connection with the moving part. The fixing part includes a fixing plate that spreads in a horizontal direction. The moving part includes an oscillating vessel that has a ball receiving space in which a ball is received, and an oscillator coupled to the oscillating vessel. A bottom surface of the oscillating vessel is upwardly spaced apart from a top surface of the fixing plate.

The present invention provides a nozzle (201), which comprises a nozzle passage (512) and a fluid passage (511), wherein the nozzle passage has an airflow inlet (515) and an airflow outlet (516). The fluid passage has a fluid passage inlet (518) and a fluid passage outlet (514), wherein the fluid passage inlet communicates with a fluid source so that a fluid can enter the fluid passage, and the fluid passage outlet communicates with the nozzle passage so that the fluid can enter the nozzle passage, and the airflow exerted from the airflow inlet can press the fluid in the nozzle passage out of the airflow outlet. The nozzle provided by the present application can distribute a small volume of a viscous fluid and is not apt to get blocked.

A soldering system comprising a solder pot and a nozzle exchange unit. The solder pot is configured to detachably couple to a solder nozzle during a soldering operation. The nozzle exchange unit is arranged to: store a plurality of solder nozzles; detach a first nozzle from the nozzle coupling; and attach a stored second nozzle to the nozzle coupling.

The invention relates to a device (10) for the separate application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for separately conveying the solder material deposits from a solder material reservoir (12) toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas, and from which the solder material deposit is transferred to an application opening of an application nozzle (36) of the application device into an application position P3, wherein a detector device (69) is provided that serves to trigger a treatment of the solder material deposit arranged in the application position P3 with laser radiation emitted by a laser device, wherein the detector device has a reflection sensor (70) that detects reflection radiation (72) that is reflected by the solder material deposit arranged in the application position P3.

A soldering nozzle for directing solder during a multi-wave soldering operation, the soldering nozzle comprising outlets for solder and de-bridging gas. The solder outlet dispenses solder therefrom and receives a plurality of parts to be soldered. The de-bridging gas outlet directs de-bridging gas between a plurality of soldered parts after they exit the solder outlet. A solder pot comprising a soldering nozzle and a de-bridging gas outlet is further disclosed. The de-bridging gas outlet is arranged relative to the soldering nozzle such that de-bridging gas is directed between a plurality of soldered parts after they exit a solder outlet.

The present application provides a method for providing solder paste, for providing solder paste accommodated in a solder paste tub into a solder paste printer, the method comprising: inserting a solder paste nozzle into a housing of the solder paste tub through an opening of the solder paste tub, wherein solder paste is accommodated in the housing of the solder paste tub; bearing the solder paste tub, with the opening facing downward, on a working platform by means of the solder paste nozzle; holding the solder paste tub by mating a holder with an engagement means on an outer wall of the housing of the solder paste tub, the holder being capable of moving up and down with the housing of the solder paste tub; and pressing the housing of the solder paste tub, such that the housing of the solder paste tub moves relative to the solder paste nozzle, at the same time causing the holder to move as the housing of the solder paste tub moves, so as to extrude solder paste accommodated in the housing of the solder paste tub from the solder paste nozzle.