This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.

Aspects of the invention include receiving a printed circuit board (PCB) having one or more of mounting pads thereon, determining a stencil for applying a solder paste to the one or more mounting pads, the stencil having a smallest aperture for a component requiring a standoff, determining a maximum threshold size for standoff particles based on the smallest aperture, determining a first concentration of the standoff particles based on the smallest aperture, determining a minimum threshold size for standoff particles to create the standoff for the component, determining a second concentration of the standoff particles to create a three-standoff seating plane for the component, introducing the standoff particles to the solder paste, the standoff particles in the solder paste having a concentration between the first concentration and the second concentration, and a size between the maximum threshold size and the minimum threshold size.

Provided is an apparatus for attaching semiconductor parts. The apparatus includes a substrate loading unit, at least one semiconductor part loader, a first vision examination unit, at least one semiconductor part picker, at least one adhesive hardening unit, and a substrate unloading unit, wherein the substrate loading unit supplies a substrate on which semiconductor units are arranged, the at least one semiconductor part loader supplies semiconductor parts, the first vision examination unit examines arrangement states of the semiconductor units, the at least one semiconductor part picker mounts semiconductor parts in the semiconductor units, the at least one adhesive hardening unit hardens and attaches adhesives interposed between the semiconductor units and the semiconductor parts, and the substrate unloading unit releases the substrate on which semiconductor parts are mounted. The adhesive hardening units restrictively transmit a heat source only to at least one semiconductor unit, which is to be hardened.

Disclosed is a wire bonding apparatus comprising a capillary, a wire clamp assembly, and a support. The wire clamp assembly includes a first member, a second member, a first contact member, and a second contact member. The first member includes a first body and a first tilting member. The second member includes a second body and a second tilting member. The first contact member is coupled to an inner surface of the first tilting member and extends in an extending direction of the first tilting member. The second contact member is coupled to an inner surface of the second tilting member and extends in an extending direction of the second tilting member. The second member is movable in the second direction.

A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.

A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.

The invention relates to a soldering nozzle for the simultaneous selective wave soldering of at least two spaced-apart rows of solder joints in a soldering installation, with a base portion which can be arranged on a nozzle plate, and with a wave portion which forms the solder wave during operation and which has a peripheral wall having a free upper side, and with at least one separating strip which can be inserted into the wave portion and which can be wetted with solder, wherein the at least one separating strip is formed as a frameless separating strip. The invention also relates to a soldering installation having a nozzle plate and having at least one soldering nozzle.

Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

A solder processing method according to one or more embodiments may include: sequentially supplying at least two solder pieces into a substantially tubular iron tip that is extended vertically, such that the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides; and heating the substantially tubular iron tip in a state where the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides, to melt the flux to be flown out from at least one of the at least two solder pieces to a space between an inner wall of the iron tip and the at least two solder pieces.

Provided are a logic switching device and a method of manufacturing the same. The logic switching device may include a domain switching layer adjacent to a gate electrode. The domain switching layer may include a ferroelectric material region and an anti-ferroelectric material region. The domain switching layer may be a non-memory element. The logic switching device may include a channel, a source and a drain both connected to the channel, the gate electrode arranged to face the channel, and the domain switching layer provided between the channel and the gate electrode.