Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.

A bonding structure of dissimilar metal members, including a first metal member, a second metal member, and a brazing filler metal, wherein the brazing filler metal bonds a bonding end surface of the first metal member and a bonding end surface of the second metal member, and any one or both of the following conditions (1) and (2) are satisfied: (1) at least a part of the bonding end surface of the first metal member in a thickness direction of the first metal member is an inclined surface inclined with respect to a plane perpendicular to the thickness direction of the first metal member, and (2) at least a part of the bonding end surface of the second metal member in a thickness direction of the second metal member is an inclined surface inclined with respect to a plane perpendicular to the thickness direction of the second metal member.

A liquid metal (LM) dispensing apparatus and method for design and fabrication thereof. Components of the LM dispensing apparatus are designed and tooled based on a target pinout (e.g., a number of, arrangement of, and dimensions of, holes in a substrate to have LM injected therein) and desired LM material. Embodiments employ detachably attached needles using a locking means to provide leak-free interchangeability of the needles. The flexibility with needles makes replacing damaged needles more perfunctory. Embodiments contour the LM reservoir to enhance uniform LM flow to the needles and dispense or inject LM from multiple detachably attached needles concurrently.

The embodiment of the present disclosure provides a welding device, a welding method, and an installation and debugging method thereof. The welding device includes a baseboard, comprising: a left welding nozzle and a right welding nozzle, a power shaft, a bidirectional moving wheel, and two welding nozzle connecting shafts, wherein the welding nozzle connecting shafts are connected to the left welding nozzle and the right welding nozzle respectively, and the bidirectional moving wheel which is driven by the power shaft drives the two welding nozzle connecting shafts to move towards or away from each other.

A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

A flux tool allows the elastic pad to pressurize each flux pin individually in a process of dotting flux, so that even though a wafer or die may be deformed, high-quality flux dotting is achieved. Specifically, the flux tool allows the elastic pad pressurizing the flux pins to be made of rubber, especially silicone, so that primarily, the flux pins are entirely pressurized uniformly by means of the elastic force of the elastic pad, and secondarily, each flux pin is individually pressurized against the underside of the elastic pad, thereby adjusting the heights of the flux pins upon flux dotting according to the flatness or bent shape of the wafer or die to minimize the flux dotting defects.

A soldering apparatus 100 including: a chamber 120 configured to contain solder and include an opening 122 configured to discharge the solder in a bottom surface or a side surface; a pump 140 configured to transport the solder to the chamber 120; and an inner bath 160 configured to communicate with the opening 120 and perform soldering using the solder fed through the opening 120.

A dispensing system includes an optional pre-heat station configured to receive an electronic substrate, a dispense station configured to dispense material on the electronic substrate received from the optional pre-heat station, an optional post-heat station configured to receive the electronic substrate from the dispense station, and a non-contact sensor positioned above the electronic substrate on at least one of the optional pre-heat station, the dispense station, and the optional post-heat station.

A microwave heating method using a microwave, including: controlling a frequency of the microwave, to form a single-mode standing wave; disposing an object to be heated in a magnetic field region where a strength of a magnetic field formed by the single-mode standing wave is uniform and maximum; and heating the object to be heated by magnetic heat generation by magnetic loss caused by an action of the magnetic field of the magnetic field region, and/or induction heating by an induced current generated in the object to be heated due to the magnetic field of the magnetic field region.

A paste retainer system is disclosed for use in a paste printing system, said paste retainer system comprising a flexible attachment means for attaching a paste retainer to a squeegee holder via a flexible main body.