Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mount technology (SMT) pad can be coupled to a first end of the press-fit portion. The SMT pad can include a conductive material. The press-fit pin can further include a trace extension coupled to the SMT pad. The trace extension can extend from the SMT pad in a direction perpendicular to the press-fit portion. The press-fit pin can include a tip portion coupled to a second end of the press-fit portion.

An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.

An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.

To suppress waste of bonding material in a printing device. A printing device includes a dispenser, a squeegee, and a controller. The dispenser individually feeds bonding material to a plurality of apertures formed in a mask. The squeegee moves with an edge portion pressed against the mask and prints the bonding material fed to the apertures from the dispenser on a substrate. The controller drive-controls the dispenser and the squeegee.

The present invention relates to a reel-to-reel layer reflow method, which emits a uniformized laser beam, which can easily adjust the emission area, and which is for the purpose of improving productivity. An embodiment of the present invention provides a reel-to-reel layer reflow method comprising the steps of: a) transferring a substrate, which has been wound in a roll type, to one side while unwinding the same; b) forming a solder portion on the substrate; c) seating an emission target element on the solder portion and seating a non-emission target element on the substrate; d) surface-emitting a laser beam to the solder portion, on which the emission target element is seated, such that the emission target element is attached to the substrate; e) inspecting the substrate structure manufactured through said step d); and f) winding the substrate structure in a roll type.

A printing device includes a storage that stores allowable time for which use of solder supplied to a screen mask can be allowed, a timer that measures time for which the solder is supplied to the screen mask, a determination unit that determines whether or not the solder supplied to the screen mask has exceeded the allowable time based on time measured by the timer, and a notifier that notifies a worker in a case where the determination unit determines that the solder supplied to the screen mask has exceeded the allowable time. The timer measures time by weighting a measurement interval of time for which the solder is moved on the screen mask by a squeegee so as to become greater than a measurement interval of time for which the solder does not move on the screen mask.

Disclosed are ball jumping apparatuses and ball absorption methods using the same. The ball jumping apparatus comprises a fixing part, a moving part spaced apart from the fixing part, and a resilient member that connects the fixing part and the moving part to each other. The resilient member extends upwardly from the fixing part and has a connection with the moving part. The fixing part includes a fixing plate that spreads in a horizontal direction. The moving part includes an oscillating vessel that has a ball receiving space in which a ball is received, and an oscillator coupled to the oscillating vessel. A bottom surface of the oscillating vessel is upwardly spaced apart from a top surface of the fixing plate.

An apparatus for mounting solder balls comprises a stage to support a substrate thereon, a mounting unit to mount solder balls on the substrate, and a solder ball mask between the mounting unit and the substrate. The solder ball mask includes a first face facing the substrate and a second face opposite to the first face. The solder ball mask has inner surfaces defining through-holes extending through a thickness of the solder ball mask from the second face to the first face. The apparatus causes the solder balls to move through separate, respective through-holes. Each of the through-holes includes a first opening defined in the first face and a second opening defined in the second face. A first spacing between adjacent first openings of the plurality of through-holes is different from a second spacing between adjacent second openings of the through-holes.

A conductive ball mounting device is provided. The conductive ball mounting device includes: a mask having a thickness equal to or larger than a diameter of a conductive ball and having an opening formed therein, wherein the conductive ball is absorbed and desorbed into and from the opening; a frame having a vacuum hole formed therein and formed to enclose sides and an upper portion of the mask; and a porous member formed between the frame and the upper portion of the mask.

A solder supply device is provided with a solder cup housing liquid solder that is cylindrical and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; solder supplied from the tip of the nozzle section by the solder cup being moved; a magnet provided in the outer circumferential surface of the solder cup; and magnetic sensors able to detect the approaching of the magnet are provided at a position facing the outer circumferential surface of the solder container. Based on the positions of the magnet and the sensor, the post-movement position of the solder container is detected. Thus, it can be detected that solder has run out from inside the solder cup.