A method for filling a through hole with solder includes mounting a substrate having a through hole formed therein on a permeable barrier layer having pores that enable gas to flow through the permeable barrier. A solder source is positioned over the through hole. Molten solder is delivered in the through hole with a positive pressure from the solder source such that gas in the through holes passes the permeable barrier while the molten solder remains in the through hole.

An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head.

A method for controlling an ejector is disclosed, wherein the ejector comprises an actuator arrangement configured to eject a droplet of viscous medium onto a substrate, and wherein the droplet forms part of a sequence of a plurality of droplets. The method comprises obtaining a control parameter for controlling the operation of the actuator arrangement, and operating the actuator arrangement, using the control parameter, in order to eject the droplet. The obtained control parameter is based on at least one of: a time period between the droplet and a previous droplet in the sequence, a difference in target size of the droplet and a size of the previous droplet in the sequence, and the droplets position in the sequence.

A method for controlling an ejector is disclosed, wherein the ejector comprises an actuator arrangement configured to eject a droplet of viscous medium onto a substrate, and wherein the droplet forms part of a sequence of a plurality of droplets. The method comprises obtaining a control parameter for controlling the operation of the actuator arrangement, and operating the actuator arrangement, using the control parameter, in order to eject the droplet. The obtained control parameter is based on at least one of: a time period between the droplet and a previous droplet in the sequence, a difference in target size of the droplet and a size of the previous droplet in the sequence, and the droplets position in the sequence.

A soldering block for holding two electrical components in contact or proximity to facilitate their connection, such as by soldering. The soldering block utilizes a pair of fixation elements, such as spring tensioned clamps, to hold the first and second electrical elements in place, conveniently acting as a third hand for the electrician. The soldering block is especially well suited to connecting wires to the terminals of LED tape strip.

An assembly is provided. The assembly includes a component, a solder pin arranged on the component, an electrical structural unit, and a soldering point which is arranged on the electrical structural unit and forms an opening, into which the solder pin is insertable along an insertion direction in order to produce a soldered joint. The solder pin has an insertion portion which, on sides of the solder pin that face away from each other, forms insertion walls which are arranged at an acute angle to one another in such a way that the insertion portion tapers in the insertion direction. A part of the insertion portion is arranged outside the opening in such a way that one or more portions of the insertion walls extend inside the opening and one or more portions of the insertion walls extend outside the opening.

An arrangement includes a chamber, a heating element arranged in the chamber, wherein the heating element, when a first connection partner with a pre-connection layer formed thereon is arranged in the chamber, is configured to heat the first connection partner and the pre-connection layer, thereby melting the pre-connection layer, and a cooling trap. During the process of heating the first connection partner with the pre-connection layer formed thereon, the cooling trap has a temperature that is lower than the temperature of all other components of or in the chamber such that liquid evaporating from the pre-connection layer is attracted by and condenses on the cooling trap.

Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.

Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.

A radiative heat collective bonder or gangbonder for packaging a semiconductor die stack is provided. The bonder generally includes a shroud positioned at least partially around the die stack and a radiative heat source positioned inward of the shroud and configured to emit a radiative heat flux in a direction away from the shroud. The bonder may further include a bondhead configured to contact the backside of the topmost die in the die stack and optionally include another bondhead configured to contact a substrate beneath the die stack. The radiative heat source may be configured to direct the radiative heat flux to at least a portion of the die stack to reduce a vertical temperature gradient in the die stack. One or both of the bondheads may be configured to concurrently direct a conductive heat flux into the die stack.