The laser reflow apparatus of the present invention comprises a laser pressurization head module for pressing a bonding object, which includes a plurality of electronic components arranged on a substrate by a transmissive pressurization member while irradiating a laser beam through the pressurization member, to bond the electronic components to the substrate; and a bonding object transfer module for transferring the bonding object having transferred from one side of the laser pressurization head module to carry the bonding object to the other side thereof after passing through a reflow process of the laser pressurized head module.

in a method for producing a solder deposit in a metal sheet, a depression is made in a topside of the metal sheet through deep drawing, thereby causing material to protrude on a bottom side of the metal sheet. The metal sheet is then subjected to a material forming process to produce a collar such that the collar projects in relation to the topside. The collar is then at least partially pressed in a direction of the depression to reduce a cross-sectional area of a mouth of the depression, and the protruding material on the bottom side is completely pushed back so that the bottom side in a region of the depression is in one plane with neighboring regions of the bottom side.

in a method for producing a solder deposit in a metal sheet, a depression is made in a topside of the metal sheet through deep drawing, thereby causing material to protrude on a bottom side of the metal sheet. The metal sheet is then subjected to a material forming process to produce a collar such that the collar projects in relation to the topside. The collar is then at least partially pressed in a direction of the depression to reduce a cross-sectional area of a mouth of the depression, and the protruding material on the bottom side is completely pushed back so that the bottom side in a region of the depression is in one plane with neighboring regions of the bottom side.

A method and apparatus for manufacturing a brazed heat exchanger. The method includes the steps of: assembling the heat exchanger components to form at least one unbrazed heat exchanger core in a core builder machine; without removing the at least one heat exchanger core from the core builder machine, enclosing the heat exchanger core with a brazing tool arrangement adapted to form a chamber, optionally, evacuating the chamber and/or filling the chamber with a controlled atmosphere; brazing the heat exchanger core in the chamber to form a brazed heat exchanger.

Various embodiments of the teachings herein include a device for detecting process parameters during a pass through an assembly line for assembling electronic components and/or for applying joining materials. The device may include: a carrier for transport by a conveying system of the assembly line and configured to receive a test plate; a sensor for measuring a process parameter during the pass; and a force sensor arranged to detect a force acting on the test plate during the pass.

Various embodiments of the teachings herein include a device for detecting process parameters during a pass through an assembly line for assembling electronic components and/or for applying joining materials. The device may include: a carrier for transport by a conveying system of the assembly line and configured to receive a test plate; a sensor for measuring a process parameter during the pass; and a force sensor arranged to detect a force acting on the test plate during the pass.

A printing solder point quality identification and maintenance suggestion system and a method thereof are disclosed. In the system, when solder paste inspection data, component inspection data or circuit inspection data indicates presence of defect, an analysis and calculation device intercepts the operating data, the equipment data, the raw material data, the process data and the environment data from a time data stream, to generate a data feature portrait. The analysis and calculation device then sets a reliability value based on location association between the solder paste inspection data, the component inspection data, the circuit inspection data and the maintenance data in the location data stream, and performs similarity calculation on the data feature portrait and the comparison data feature portrait to calculate a similarity value, and then calculates a relative reliability value, and compares the relative reliability value with a reliability threshold value to generate maintenance suggestion information.

A heat assisted flip chip bonding apparatus includes a semiconductor assembly having a substrate and a chip, a heating source and a press and cover assembly having a cover element and press elements. The chip is disposed above the substrate and includes conductors which contact with conductive pads on the substrate. The heating source is provided to emit a heated light which illuminates the chip via an opening of the cover element. The press elements are located between the cover element and the semiconductor assembly and each includes an elastic unit and a pressing unit. Both ends of the elastic unit are connected to the cover element and the pressing unit respectively, and the pressing unit is provided to press a back surface of the chip.

A heat assisted flip chip bonding apparatus includes a semiconductor assembly having a substrate and a chip, a heating source and a press and cover assembly having a cover element and press elements. The chip is disposed above the substrate and includes conductors which contact with conductive pads on the substrate. The heating source is provided to emit a heated light which illuminates the chip via an opening of the cover element. The press elements are located between the cover element and the semiconductor assembly and each includes an elastic unit and a pressing unit. Both ends of the elastic unit are connected to the cover element and the pressing unit respectively, and the pressing unit is provided to press a back surface of the chip.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.