The invention details the designs of cleaning pad assemblies for use with heating tools including for example soldering cartridges and soldering irons. The cleaning pads of the assembly are designed to effectively remove and clean the solder from heating tools during and at the end of soldering operations, and allow the collection of the removed solder.

The invention details the designs of cleaning pad assemblies for use with heating tools including for example soldering cartridges and soldering irons. The cleaning pads of the assembly are designed to effectively remove and clean the solder from heating tools during and at the end of soldering operations, and allow the collection of the removed solder.

A soldering iron device includes a main body, where an end portion of the main body is provided with a tip, a heating core for heating the tip is provided in the main body, and a measuring element is provided in the main body; and the measuring element includes a mounting rod and a sensor, the sensor is provided on an end portion of the mounting rod, a measuring cavity is formed in the tip, the sensor is inserted into the measuring cavity, and the mounting rod extends toward a direction away from the tip. Compared with the prior art, since the sensor is not provided in the heating core, but is directly inserted into the tip, the present disclosure overcomes the heat transfer distance between the heating core and the tip and directly measures the temperature of the tip, which is highly accurate in measurement and strongly practicable.

A soldering iron device includes a main body, where an end portion of the main body is provided with a tip, a heating core for heating the tip is provided in the main body, and a measuring element is provided in the main body; and the measuring element includes a mounting rod and a sensor, the sensor is provided on an end portion of the mounting rod, a measuring cavity is formed in the tip, the sensor is inserted into the measuring cavity, and the mounting rod extends toward a direction away from the tip. Compared with the prior art, since the sensor is not provided in the heating core, but is directly inserted into the tip, the present disclosure overcomes the heat transfer distance between the heating core and the tip and directly measures the temperature of the tip, which is highly accurate in measurement and strongly practicable.

A jig apparatus is used for assembling a trunk lid including an upper panel, an extension panel, and a lower panel. The jig apparatus may include: a jig frame; a first activation jig unit configured to align and fix the upper panel and the extension panel and installed at the jig frame in front and rear directions to be tilting-rotatable; and a second activation jig unit aligning and fixing the lower panel and installed at the jig frame to be linearly movable in the front and rear directions with respect to the first activation jig unit.

A uniform pressure gang bonding device and fabrication method are presented using an expandable upper chamber with an elastic surface. Typically, the elastic surface is an elastomer material having a Young's modulus in a range of 40 to 1000 kilo-Pascal (kPA). After depositing a plurality of components overlying a substrate top surface, the substrate is positioned over the lower plate, with the top surface underlying and adjacent (in close proximity) to the elastic surface. The method creates a positive upper chamber medium pressure differential in the expandable upper chamber, causing the elastic surface to deform. For example, the positive upper chamber medium pressure differential may be in the range of 0.05 atmospheres (atm) and 10 atm. Typically, the elastic surface deforms between 0.5 millimeters (mm) and 20 mm, in response to the positive upper chamber medium pressure differential.

A method to set up the parameters of solder paste screen printer while in a new product introduction (NPI). The method includes establishing a solder-printing database of a predetermined product and a database of different specifications of products, and training a first prediction model by reference to a solder paste screen printer (SPSP) and a solder paste inspection (SPI) based on the solder-printing database. A second prediction model is trained by reference to the SPI based on the database of different products. The method further includes predicting parameters for products with different specifications under multiple sets of printing parameters based on the first and second prediction models. An objective function based on the predicted measurements is established, and a specification of a product and a printing expectation parameters are input to the objective function for outputting many sets of printing-suggestion parameters of the new product.

A method to set up the parameters of solder paste screen printer while in a new product introduction (NPI). The method includes establishing a solder-printing database of a predetermined product and a database of different specifications of products, and training a first prediction model by reference to a solder paste screen printer (SPSP) and a solder paste inspection (SPI) based on the solder-printing database. A second prediction model is trained by reference to the SPI based on the database of different products. The method further includes predicting parameters for products with different specifications under multiple sets of printing parameters based on the first and second prediction models. An objective function based on the predicted measurements is established, and a specification of a product and a printing expectation parameters are input to the objective function for outputting many sets of printing-suggestion parameters of the new product.

An apparatus includes a lifting device and a motor assembly. The lifting device is disposed in a lifting device housing and is configured to adjust a vertical position of an optical component connected to the lifting device. The motor assembly is disposed in a motor housing and is configured to drive the lifting device to adjust the vertical position of the optical component. The lifting device housing, the motor housing, and the optical component are disposed in an ultra-high vacuum chamber of an enclosure. In the case of motor failure, the motor housing can be disconnected from the lifting device housing, and the motor assembly can be decoupled from the lifting device, such that the motor assembly can be replaced.

An apparatus includes a lifting device and a motor assembly. The lifting device is disposed in a lifting device housing and is configured to adjust a vertical position of an optical component connected to the lifting device. The motor assembly is disposed in a motor housing and is configured to drive the lifting device to adjust the vertical position of the optical component. The lifting device housing, the motor housing, and the optical component are disposed in an ultra-high vacuum chamber of an enclosure. In the case of motor failure, the motor housing can be disconnected from the lifting device housing, and the motor assembly can be decoupled from the lifting device, such that the motor assembly can be replaced.