An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements

A manufacturing method of a hot forming mold of a center pillar including a cooling unit is provided. The method includes a step of preparing a material by dividing the material, a cooling channel processing step of processing cooling channels on a front surface and a rear surface within a contour line by center pillar design information input in advance to an NC processor and cooling channel design information, a solid phase diffusion bonding step, a mold material processing step of processing along the contour line by the center pillar design information input in advance through the NC processor to manufacture a mold material, and a thermal processing step of heating the mold material at a predetermined temperature.

A method of manufacturing a mechanical part of the present invention includes a first process of forming, by performing a folding processing to an end portion of the material, a portion to be processed having a structure, in which a plurality of layers respectively having a thickness corresponding to a plate thickness of a material overlap each other, in the material such that a plate thickness direction of the layer is orthogonal to a plate thickness direction of the material; and a second process of changing, by performing a forging processing to the portion to be processed, a shape of the portion to be processed to a target shape while press-welding the layers of the portion to be processed to each other by plastic deformation.

Described is a design and method for producing a sputtering target assembly with low deflection made from target material solder bonded to composite backing plate with coefficient of thermal expansion (CTE) matching the target material. The composite backing plate is composite configuration composed of at least two different materials with different CTE. The composite backing plate, after plastic deformation, if necessary, has a CTE matching the target material and low and desirable deflection in the bonding process, and therefore, resulting in a low deflection and low stress target material bonded to composite backing plate assembly. The method includes manufacturing composite backing plate with a flat bond surface, heat treating of target blank and composite backing plate to achieve desirable shape of bond surfaces, solder bonding target to a backing plate, and slowly cooling the assembly to room temperature. Matching CTE in both target material and backing plate eliminates the problem of CTE mismatch and prevents the assembly from deflection and internal stress.

A method of constructing a plate fin heat exchanger includes joining a first side bar formed from a nickel-iron alloy to a first end of a fin element formed from a nickel-iron alloy through a first nickel-iron alloy bond, and joining a second side bar formed from a nickel-iron alloy to a second end of the fin element through a second nickel-iron alloy bond to create a first layer of the plate fin heat exchanger. The fin element defines a fluid passage.

A workpiece is described, and includes a substrate, a cable, and a cover piece. A portion of the cable is joined to the substrate employing a vibration welding tool, and the cover piece is interposed between the portion of the cable and the vibration welding tool during the joining.

The method for manufacturing a heat exchanger plate includes a lid groove closing process to insert a lid plate into a lid groove formed at a periphery of a concave groove opening to a surface of a base member; and a primary joining process to perform friction stirring while relatively moving a primary joining rotary tool equipped with a stirring pin along a butting portion of a side wall of the lid groove and a side surface of the lid plate, and in the primary joining process, the rotating stirring pin is inserted into the butting portion, and the friction stirring is performed in a state of only the stirring pin being in contact with the base member and the lid plate.

A method for the additive manufacturing of an object and a system for manufacturing an object. The method includes depositing a first foil layer, the first foil layer including a first body section, a first support section connected to the first body section, and a second support section connected to the first body section; depositing a second foil layer, the second foil layer comprising a second body section, a third support section, and a fourth support section; aligning the second foil layer and the first foil layer; and applying at least one of heat and pressure to the first foil layer and the second foil layer to form the object comprising the first body section and the second body section.

The disclosed method relates to manufacturing a heat exchanger which causes no brazing defects, and a heat exchanger manufactured by the method. The method relates to manufacturing a heat exchanger having an aluminum alloy tube defining a cooling-medium flowing passage and a copper alloy tube defining a water flowing passage, wherein a heat exchange is carried out between a cooling medium flowing through the cooling-medium flowing passage and water flowing through the water flowing passage. The aluminum alloy tube and the copper alloy tube are brazed to each other at a temperature of less than 548° C.

A lift-off method for transferring an optical device layer in an optical device wafer to a transfer substrate, the optical device layer being formed on the front side of an epitaxy substrate through a buffer layer. A transfer substrate is bonded through a bonding layer to the front side of the optical device layer of the optical device wafer, thereby forming a composite substrate. A pulsed laser beam having a wavelength transmissive to the epitaxy substrate and absorptive to the buffer layer is applied from the back side of the epitaxy substrate to the buffer layer, thereby breaking the buffer layer, and the epitaxy substrate is peeled from the optical device layer, thereby transferring the optical device layer to the transfer substrate. Ultrasonic vibration is applied to the composite substrate in transferring the optical device layer.