Patent classifications
B23K20/002
Method for welding electrical conductors by means of ultrasound and ultrasonic metal welding device
The invention relates to an ultrasonic metal welding device and a method for welding electrical conductors using a compression chamber that is adjustable at least in height and that is delimited on opposite sides by a section of a sonotrode as a first delimiting surface and by at least one section of a counter electrode (156) as a second delimiting surface, wherein for welding, the counter electrode and the sonotrode are displaced relative to one another. The counter electrode used is one that comprises sections (152, 154) of geometrically different working surfaces or is composed of at least two sections that are displaceable relative to one another.
Ultrasonic bonding method
In an ultrasonic bonding method, three ultrasonic bonding head units are disposed above a bonding target. At this time, initial heights in the three ultrasonic bonding head units are set to different heights from each other. Thereafter, a batch multiple lowering operation by a lifting-lowering servomotor and ultrasonic vibration operations by the three ultrasonic bonding head units are executed. At this time, a lowering speed V6 of the batch multiple lowering operation, an operation time T6 (min) of the ultrasonic vibration operation, and an adjustment gap length Δg among the initial heights are set to satisfy {T6<Δg/V6}.
Roll-bonded laminate, method for producing the same, and heat radiation reinforcement member for electronic equipment
This invention provides a roll-bonded laminate composed of a hard copper layer and a stainless steel layer, which is sufficient both in radiation performance and strength. A roll-bonded laminate 1A is composed of a copper layer 10A and a stainless steel layer 20A, in which thickness of the roll-bonded laminate 1A is 0.02 mm to 0.4 mm, hardness of the copper layer 10A is 70 Hv or higher, and 180° peel strength of the roll-bonded laminate 1A is 6 N/20 mm or more.
Method for production of a component by atomic diffusion bonding
A method for producing a component from two plates, which are electrically isolating, at least one is optically transparent, and between them at least one planar conductor section and at least one isolator section are formed, comprises bonding the plates at mutually facing bonding faces, wherein a metal layer is arranged therebetween, and processing the metal layer by local heating using laser radiation such that the metal layer is converted into the at least one isolator section in a part region, and the at least one conductor section is formed adjacent thereto. To form the at least one isolator section, the light path of the laser radiation and the component are moved relative to each other to convert the metal layer into the at least one isolator section over a line or area. Bonding faces of metallic bond layers are polished. The plates are bonded by atomic diffusion bonding.
Advanced Device Assembly Structures And Methods
A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.
Horn and Welding Device
A horn includes a plurality of protrusion formation parts, each of which has a plurality of protrusions that protrude from a welding surface and are arranged in a line in at least one row, the plurality of protrusion formation parts respectively configured to form pattern formation parts on an outermost electrode tab of electrode tabs of a secondary battery, and a protrusion-free part which is disposed between two protrusion formation parts of the plurality of protrusion formation parts and in which protrusions are not provided to expose the welding surface to an outside, the protrusion-free part configured to form a pattern-free part on the outermost electrode tab. The protrusion-free part has a width greater than a width of each of the protrusions.
HEATING SYSTEM FOR PRODUCTION OF A DOUBLE-LAYER TUBE
A heating system for use in the manufacture of copper coated double-layer steel tubes having a casing (10) in which the roll-wrapped tube is heated to a predefined temperature value. The heating system comprises a sensor (17) configured in an outer portion of the casing (10) such that the sensor (17) is able to determine a temperature value within the casing (10).
Method of forming gas turbine engine components
A method of forming a gas turbine engine component according to an example of the present disclosure includes, among other things, attaching a cover skin to an airfoil body, the airfoil body and the cover skin cooperating to establish pressure and suction sides of an airfoil, positioning the airfoil between first and second dies of a deforming station, heating the airfoil body to a first predefined temperature threshold between the first and second dies, and moving the first die relative to the second die to hold the airfoil between the first and second dies subsequent to the heating step, and then deforming the airfoil between the first and second dies.
ROLL-BONDED LAMINATE, METHOD FOR PRODUCING THE SAME, AND HEAT RADIATION REINFORCEMENT MEMBER FOR ELECTRONIC EQUIPMENT
This invention provides a roll-bonded laminate composed of a hard copper layer and a stainless steel layer, which is sufficient both in radiation performance and strength. A roll-bonded laminate 1A is composed of a copper layer 10A and a stainless steel layer 20A, in which thickness of the roll-bonded laminate 1A is 0.02 mm to 0.4 mm, hardness of the copper layer 10A is 70 Hv or higher, and 180° peel strength of the roll-bonded laminate 1A is 6 N/20 mm or more.
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.