A joining apparatus joins a first joining target and a second joining target to each other using laser light, and comprises a first stage, a pressurizing mechanism, a second stage, and a laser light source. The first stage is transmissive to the laser light and is located on the side of a back surface of the first joining target. The pressurizing mechanism applies a pressure to the back surface of the first joining target. The second stage includes a pressure-receiving surface for receiving the pressure from the pressurizing mechanism at a back surface of the second joining target. The laser light source applies the laser light through the first stage to a place of joining between the first joining target and the second joining target. The pressurizing mechanism includes a pressure transmission medium composed of gas or liquid and applies the pressure to the back surface of the first joining target with the transmission medium in contact with this back surface.

A joining method comprises a stacking step and a joining process step. In the stacking step, a first joining target and a second joining target are stacked in such a manner as to interpose a heat absorbing layer and a joining material layer between respective joint surfaces of the first joining target and the second joining target. In the joining process step, laser light is applied to the heat absorbing layer to heat the joining material layer with heat absorbed by the heat absorbing layer from the laser light, thereby joining the first joining target and the second joining target to each other using the joining material layer.