A joining method of joins a main body and a cover, the main body being a flat plate and made of aluminum or an aluminum alloy and including a passage through which a medium for promoting heat exchange is circulated, and the cover being a flat plate and made of aluminum or an aluminum alloy and configured to cover the passage of the main body. The method includes: a covering step of covering the main body with the cover; and a diffusion bonding step of joining the main body and the cover by diffusion bonding under a condition in which a joining temperature is 500° C. or higher and 640° C. or lower, and a joining surface pressure is 0.7 MPa or higher. Each of a joining surface of the main body and a joining surface of the cover has a flatness of 0.2 or less.

A sintering press for sintering electronic components on a substrate is provided. The sintering press includes a pressing unit having a plurality of controllable presser rods to apply sintering pressure to the electronic components to be sintered, reaction elements forming a support plane for a respective substrate, an element plate slidably supporting the reaction elements, and a heating circuit with heating elements embedded in a heating body placed around the element plate to bring the element plate to a sintering temperature. A heat diffusion plate is placed in contact with the heating body and extends onto the element plate between the reaction elements, the diffusion plate being made of a material having a higher thermal conductivity than the element plate.

A heat-resistant release sheet includes a heat-resistant release sheet to be disposed between a compression bonding target and a thermocompression head at the time of thermocompression-bonding the compression bonding target by the thermocompression head to prevent fixation between the compression bonding target and the thermocompression head, wherein surface hardness, as expressed in an indentation degree A.sub.300 given by an equation A.sub.300 (%)=(d.sub.300/t.sub.0)×100, of the heat-resistant release sheet at 300° C. is 15% or less, where to is a thickness of the heat-resistant release sheet at ordinary temperature (20° C.) and d.sub.300 is an indentation depth evaluated for the heat-resistant release sheet at 300° C. using a penetration probe by thermomechanical analysis (TMA) under the following measurement conditions: • Measurement mode: penetration mode, temperature rise measurement—Shape and tip diameter of penetration probe: columnar shape and 1 mmφ •Applied pressure: 1 MPa—Starting temperature and temperature increase rate: 20° C. and 10° C./min.

A bonded body includes a copper member and an aluminum alloy member, the copper member and the aluminum alloy member being bonded to each other, in which, in the aluminum alloy member, a Si concentration is in a range of 1.5 mass % or more and 12.5 mass % or less, an Fe concentration is 0.15 mass % or less, a Cu concentration is 0.05 mass % or less, the aluminum alloy member and the copper member are bonded to each other by solid phase diffusion bonding, and a ratio t2/t1 of a thickness t2 of a second intermetallic compound layer that is positioned on the copper member side and is made of a non-θ phase other than the θ phase to a thickness t1 of a first intermetallic compound layer that is positioned on the aluminum alloy member side and is made of a θ phase is in a range of 1.2 or more and 2.0 or less.

A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.

A device for manufacturing a plate solder according to the present invention includes a reel on which a thread solder is wound; a cutter that cuts the thread solder, provided between the reel and an end part of the thread solder extending from the reel; an aggregating part that aggregates a plurality of cut thread solders such that the plurality of thread solders are in contact with one another; and a roller that rolls the plurality of aggregated thread solders and pressure bonds them to one another to form a plate solder.

A device for manufacturing a plate solder according to the present invention includes a reel on which a thread solder is wound; a cutter that cuts the thread solder, provided between the reel and an end part of the thread solder extending from the reel; an aggregating part that aggregates a plurality of cut thread solders such that the plurality of thread solders are in contact with one another; and a roller that rolls the plurality of aggregated thread solders and pressure bonds them to one another to form a plate solder.

A metallic member bonding device includes a pressurizing unit, a current supply unit, and a deformation suppressing unit. The pressurizing unit pressurizes a first metallic member toward a hole portion of a second metallic member to press the first metallic member therein. The current supply unit supplies a welding current between the first metallic member and the second metallic member. The deformation suppressing unit suppresses deformation of one of the first metallic member and the second metallic member, the one member having a constituent metallic material with at least one of a proof stress and a melting temperature lower than that of the other member, the deformation being in a direction of a cross section crossing a direction of the press-in. Then, the deformation suppressing unit is provided in a region covering at least a plastic flow range in the press-in direction.

A metallic member bonding device includes a pressurizing unit, a current supply unit, and a deformation suppressing unit. The pressurizing unit pressurizes a first metallic member toward a hole portion of a second metallic member to press the first metallic member therein. The current supply unit supplies a welding current between the first metallic member and the second metallic member. The deformation suppressing unit suppresses deformation of one of the first metallic member and the second metallic member, the one member having a constituent metallic material with at least one of a proof stress and a melting temperature lower than that of the other member, the deformation being in a direction of a cross section crossing a direction of the press-in. Then, the deformation suppressing unit is provided in a region covering at least a plastic flow range in the press-in direction.

An exterior panel for hypersonic transport vehicles is formed of a superplastic metal alloy such as titanium for accommodating high thermal stresses of hypersonic flight. The exterior panel, designed as re-usable on such transport vehicles, includes an exterior skin configured for atmospheric exposure, and an interior skin configured for attachment to structural frame members of the transport vehicles. An intermediate skin is situated between a pair of multicellular cores; each multicellular core is sandwiched between the exterior and interior skins, one core being situated between the exterior and intermediate skins, while the other is situated between the intermediate and interior skins. An airflow channel (AFC) extends through at least one of the multicellular cores for cooling of the exterior panel. Each multicellular core is superplastic formed and diffusion bonded to the other, as well as to its respective pair of skins to form an exterior panel having a unified structure.