The invention concerns a brazing sheet comprising a core layer (5) and a braze cladding, said core layer (5) being aluminium or an aluminium alloy, said braze cladding comprising (a) a flux composite layer (2), which flux composite layer comprises a matrix of aluminium or an aluminium alloy, said matrix containing flux particles; (b) at least one filler alloy layer (1) not containing flux particles; and, (c) an aluminium or aluminium alloy layer (3) not containing flux particles, said layer forming the outermost surface of at least one side of the brazing sheet, wherein the flux composite layer (a) is positioned between said filler alloy layer (b) and said aluminium or aluminium alloy layer (c). The invention further concerns a method for its manufacturing, a cladding plate, use of the brazing sheet and a brazed heat exchanger.

A battery module includes a plurality of cylindrical battery cells respectively having electrode terminals formed at an upper portion and a lower portion thereof; a module housing including an accommodation portion having a plurality of hollow structures in which the plurality of cylindrical battery cells are inserted and accommodated; and a module bus bar including a first metal plate having a body portion located at an upper portion or a lower portion of the plurality of cylindrical battery cells to extend in a horizontal direction and a plurality of connection portions configured to extend in a horizontal direction from one side of the body portion to contact the electrode terminals of the plurality of cylindrical battery cells, and a second metal plate bonded to the body portion of the first metal plate and having a metal with a relatively higher electric conductivity than the first metal plate.

A battery module includes a plurality of cylindrical battery cells respectively having electrode terminals formed at an upper portion and a lower portion thereof; a module housing including an accommodation portion having a plurality of hollow structures in which the plurality of cylindrical battery cells are inserted and accommodated; and a module bus bar including a first metal plate having a body portion located at an upper portion or a lower portion of the plurality of cylindrical battery cells to extend in a horizontal direction and a plurality of connection portions configured to extend in a horizontal direction from one side of the body portion to contact the electrode terminals of the plurality of cylindrical battery cells, and a second metal plate bonded to the body portion of the first metal plate and having a metal with a relatively higher electric conductivity than the first metal plate.

This invention provides a relatively thick roll-bonded laminate that exhibits a high Erichsen value and excellent molding workability. Such roll-bonded laminate is composed of a stainless steel layer and a non-stainless steel metal layer, and it is characterized in that thickness T is 0.2 mm to 3 mm and a correlation between a proportion P.sub.SUS of thickness T.sub.SUS of the stainless steel layer relative to thickness T and a half width FWHM.sub.200 of a peak exhibiting a crystal plane orientation (200) determined by X-ray diffraction analysis of the stainless steel layer side satisfies the correlation represented by the formula: FWHM.sub.200≤0.0057P.sub.SUS+0.4.

This invention provides a relatively thick roll-bonded laminate that exhibits a high Erichsen value and excellent molding workability. Such roll-bonded laminate is composed of a stainless steel layer and a non-stainless steel metal layer, and it is characterized in that thickness T is 0.2 mm to 3 mm and a correlation between a proportion P.sub.SUS of thickness T.sub.SUS of the stainless steel layer relative to thickness T and a half width FWHM.sub.200 of a peak exhibiting a crystal plane orientation (200) determined by X-ray diffraction analysis of the stainless steel layer side satisfies the correlation represented by the formula: FWHM.sub.200≤0.0057P.sub.SUS+0.4.

This invention provides a roll-bonded laminate that is excellent in press workability and/or a roll-bonded laminate with improved performance and ease of handling at the time of production. More specifically, this invention relates to a roll-bonded laminate composed of a stainless steel layer and an aluminum alloy layer with the peel strength of 60 N/20 mm or higher, a roll-bonded laminate composed of a stainless steel layer and a pure aluminum layer with the peel strength of 160 N/20 mm or higher, and a roll-bonded laminate composed of a pure titanium or titanium alloy layer and an aluminum alloy layer with the peel strength of 40 N/20 mm or higher.

This invention provides a roll-bonded laminate that is excellent in press workability and/or a roll-bonded laminate with improved performance and ease of handling at the time of production. More specifically, this invention relates to a roll-bonded laminate composed of a stainless steel layer and an aluminum alloy layer with the peel strength of 60 N/20 mm or higher, a roll-bonded laminate composed of a stainless steel layer and a pure aluminum layer with the peel strength of 160 N/20 mm or higher, and a roll-bonded laminate composed of a pure titanium or titanium alloy layer and an aluminum alloy layer with the peel strength of 40 N/20 mm or higher.

This invention provides a roll-bonded laminate for an electronic device that exhibits high rigidity and a high elastic modulus and is suitable for housing applications. More specifically, this invention concerns a roll-bonded laminate for an electronic device composed of a stainless steel layer and an aluminum alloy layer, wherein thickness T.sub.Al (mm) and surface hardness H.sub.Al (HV) of the aluminum alloy layer and thickness T.sub.SUS (mm) and surface hardness H.sub.SUS (HV) of the stainless steel layer satisfy the correlation represented by Formula (1): H.sub.SUST.sub.SUS.sup.2≥(34.96+0.03×(H.sub.AlT.sub.Al.sup.2).sup.2−3.57×H.sub.AlT.sub.Al.sup.2)/(−0.008×(H.sub.AlT.sub.Al.sup.2).sup.2+0.061×H.sub.AlT.sub.Al.sup.2+1.354). This invention also concerns an electronic device housing.

This invention provides a roll-bonded laminate for an electronic device that exhibits high rigidity and a high elastic modulus and is suitable for housing applications. More specifically, this invention concerns a roll-bonded laminate for an electronic device composed of a stainless steel layer and an aluminum alloy layer, wherein thickness T.sub.Al (mm) and surface hardness H.sub.Al (HV) of the aluminum alloy layer and thickness T.sub.SUS (mm) and surface hardness H.sub.SUS (HV) of the stainless steel layer satisfy the correlation represented by Formula (1): H.sub.SUST.sub.SUS.sup.2≥(34.96+0.03×(H.sub.AlT.sub.Al.sup.2).sup.2−3.57×H.sub.AlT.sub.Al.sup.2)/(−0.008×(H.sub.AlT.sub.Al.sup.2).sup.2+0.061×H.sub.AlT.sub.Al.sup.2+1.354). This invention also concerns an electronic device housing.

A clad material includes a first layer made of stainless steel and a second layer made of Cu or a Cu alloy and roll-bonded to the first layer. In the clad material, a grain size of the second layer measured by a comparison method of JIS H 0501 is 0.150 mm or less.