Processes of joining substrates via transient liquid phase bonding (TLPB). The processes include providing an interlayer of a low melting temperature phase (LTP) that includes Sn and Bi between and in contact with at least two substrates, and heating the substrates and the interlayer therebetween at a processing temperature equal to or above 200° C. such that the interlayer liquefies and the LTP interacts with high melting temperature phases (HTPs) of the substrates to yield isothermal solidification of the interlayer. The processing temperature is maintained for a duration sufficient for the interlayer to be completely consumed and a solid bond is formed between the substrates. Also provided are assemblies formed by the above noted processes.

A method of securing an insert in a preselected region of a workpiece. An opening wall is formed in the workpiece with an opening wall surface defining an opening to produce a remainder segment of the workpiece. The opening encompasses or coincides with the preselected region. An insert is provided to fit in the opening. An insert heated portion and a remainder segment heated portion are heated to a hot working temperature, at which they are plastically deformable. While the insert is subjected to an engagement motion, to move the insert relative to the remainder segment, an insert engagement surface of the insert is pressed against the opening wall surface, for plastic deformation of the insert heated portion and of the remainder segment heated portion, creating a metallic bond between the insert and the remainder segment. The insert and the remainder segment are allowed to cool, to bond them together.

A method of securing an insert in a preselected region of a workpiece. An opening wall is formed in the workpiece with an opening wall surface defining an opening to produce a remainder segment of the workpiece. The opening encompasses or coincides with the preselected region. An insert is provided to fit in the opening. An insert heated portion and a remainder segment heated portion are heated to a hot working temperature, at which they are plastically deformable. While the insert is subjected to an engagement motion, to move the insert relative to the remainder segment, an insert engagement surface of the insert is pressed against the opening wall surface, for plastic deformation of the insert heated portion and of the remainder segment heated portion, creating a metallic bond between the insert and the remainder segment. The insert and the remainder segment are allowed to cool, to bond them together.

A method of manufacturing a hollow aerofoil component 100 for a gas turbine engine 10 comprises joining a first panel 200 to a second panel 300 using bonding, and hot forming the panels into shape. The bonding step and the hot forming step are performed in the same rig, thereby optimizing process time and component quality.

A method of manufacturing a hollow aerofoil component 100 for a gas turbine engine 10 comprises joining a first panel 200 to a second panel 300 using bonding, and hot forming the panels into shape. The bonding step and the hot forming step are performed in the same rig, thereby optimizing process time and component quality.

An exothermic reaction mold includes a reaction chamber, a weld chamber communicating with the reaction chamber and at least one user configurable port communicating with the weld chamber for receiving cables to be welded.

A method includes disposing a hydride of a transition metal on a first metallic material, where at least one of the first metallic material or a second metallic material includes a surface oxide layer. The method includes performing a diffusion bonding operation to bond the first metallic material to the second metallic material. During the diffusion bonding operation, the hydride of the transition metal chemically reacts with the surface oxide layer.

A method of bonding two components includes plating a first of the components with a first silver layer, a tin layer, and a second silver layer, plating a second of the components with silver, inserting the first and second components into a pre-heated press, and applying pressure to the components causing the components to bond. A stack of layers has a first component layer, a first silver layer, a tin layer, a second silver layer, a second component silver layer, and a second component layer.

A method of operating a thermocompression bonding system is provided. The method includes the steps of: bringing first conductive structures of a semiconductor element into contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; and moving the semiconductor element relative to the substrate along at least one substantially horizontal direction using a motion system of at least one of the semiconductor element and the substrate.

An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements