A structure and a method for mounting thermocouple on an intermetallic compounds such as TiAl by suppressing occurrence of cracks are provided. A thermocouple mounting structure is provided with a substrate, a coating formed on the substrate and a foil joined on the coating, and sandwiches a thermocouple between the substrate and the foil. A thermocouple mounting method includes forming a coating on a substrate and welding a foil on the coating, and the welding includes arranging a thermocouple so that the substrate and the foil sandwiches the thermocouple. Occurrence of cracks in the substrate formed with intermetallic compounds can be suppressed by providing a thermal spray coating between the substrate and the foil.

An electronic device includes: a first semiconductor die having a metal region; a substrate having a plurality of metal regions; a first soldered joint between the metal region of the first semiconductor die and a first metal region of the substrate, the first soldered joint having one or more intermetallic phases throughout the entire soldered joint, each of the one or more intermetallic phases formed from a solder preform diffused into the metal region of the first semiconductor die and the first metal region of the substrate; and a second semiconductor die soldered to the first or different metal region of the substrate.

A method of eliminating dissimilar metal welds has been disclosed. The method includes the steps of providing a first part having a first alloy composition; providing a second part having a second alloy composition different from the first part; connecting a containment structure to the first part; pouring a powder into the containment structure such that the powder is in contact with the first part; positioning a portion of the second part in the containment structure such that the second part compresses the powder between the first and second parts; and performing hot isostatic pressing (HIP) to consolidate the powder and join the first and second parts together.

A method of eliminating dissimilar metal welds has been disclosed. The method includes the steps of providing a first part having a first alloy composition; providing a second part having a second alloy composition different from the first part; connecting a containment structure to the first part; pouring a powder into the containment structure such that the powder is in contact with the first part; positioning a portion of the second part in the containment structure such that the second part compresses the powder between the first and second parts; and performing hot isostatic pressing (HIP) to consolidate the powder and join the first and second parts together.

A method for joining a first metal part with a second metal part, the metal parts having a solidus temperature above 1100° C., includes applying a melting depressant composition on a surface of the first metal part, the melting depressant composition including a melting depressant component that includes at least 25 wt % boron and silicon for decreasing a melting temperature of the first metal part; bringing the second metal part into contact with the melting depressant composition at a contact point on said surface; heating the first and second metal parts to a temperature above 1100° C.; and allowing a melted metal layer of the first metal component to solidify, such that a joint is obtained at the contact point. The boron at least partly originates from a boron compound selected from any of the following compounds: boric acid, borax, titanium diboride and boron nitride. The melting depressant composition and related products are also described.

Hydrogen purification devices and their components are disclosed. In some embodiments, the devices may include at least one foil-microscreen assembly disposed between and secured to first and second end frames. The at least one foil-microscreen assembly may include at least one hydrogen-selective membrane and at least one microscreen structure including a non-porous planar sheet having a plurality of apertures forming a plurality of fluid passages. The planar sheet may include generally opposed planar surfaces configured to provide support to the permeate side. The plurality of fluid passages may extend between the opposed surfaces. The at least one hydrogen-selective membrane may be metallurgically bonded to the at least one microscreen structure.

Hydrogen purification devices and their components are disclosed. In some embodiments, the devices may include at least one foil-microscreen assembly disposed between and secured to first and second end frames. The at least one foil-microscreen assembly may include at least one hydrogen-selective membrane and at least one microscreen structure including a non-porous planar sheet having a plurality of apertures forming a plurality of fluid passages. The planar sheet may include generally opposed planar surfaces configured to provide support to the permeate side. The plurality of fluid passages may extend between the opposed surfaces. The at least one hydrogen-selective membrane may be metallurgically bonded to the at least one microscreen structure.

A magnesium clad material 100 includes, when a cross-section thereof cut in a thickness direction thereof is observed, a Mg layer (11), a first Al layer (12) made of pure Al or an Al alloy, and a first joint (13) made of pure Cu or a Cu alloy and arranged between the Mg layer and the first Al layer, and the magnesium clad material has a 0.2% proof stress of 150 MPa or more as measured in a tensile test under a room temperature atmosphere.

A magnesium clad material 100 includes, when a cross-section thereof cut in a thickness direction thereof is observed, a Mg layer (11), a first Al layer (12) made of pure Al or an Al alloy, and a first joint (13) made of pure Cu or a Cu alloy and arranged between the Mg layer and the first Al layer, and the magnesium clad material has a 0.2% proof stress of 150 MPa or more as measured in a tensile test under a room temperature atmosphere.

Systems and methods form induction rotors by performing isostatic pressing (HIP) to weld clad to a shaft, which allows for scaling the manufacturing of solid steel rotors, as compared to conventional techniques. In examples, the rotors are designed for high-speed motors and may include recessed short circuit rings and/or end rings. An exemplary process molds an alloy powder into cladding such that heretofore unachievable rotor designs are achievable according to systems and methods described herein. In examples, a thin source-layer is introduced to welding zones, thereby enriching and strengthening the resulting joint at welding zones. The source-layer may be introduced by adding an intermediate layer comprising the source material between the materials being welded. The reduced alloy-depletion welding disclosed herein strengthens the welding area joints and provides for the manufacture of component designs, which were previously unachievable due to alloy-depletion weaknesses and environmental constraints.