Patent classifications
B23K20/22
DESIGN AND MANUFACTURE OF A CONFORMABLE PRESSURE VESSEL
A method of manufacturing a high-pressure fluid vessel includes forming a first portion of a high-pressure fluid vessel with a molding process. The high-pressure fluid vessel includes a stack of capsules. Each capsule includes a first domed end, a second domed end, and a semicylindrical portion extending between and connecting the first domed end to the second domed end. The method further includes forming a second portion of a high-pressure fluid vessel with the molding process. The second portion of the high-pressure fluid vessel is positioned adjacent to the first portion of the high-pressure fluid vessel. The second portion of the high-pressure fluid vessel is welded to the first portion of the high-pressure fluid vessel.
Processes and tooling associated with diffusion bonding the periphery of a cavity-back airfoil
A fixture assembly includes a first fixture portion, a second fixture portion that interfaces with the first fixture portion, and a sub-fixture movably mounted to the first fixture portion. A multiple of actuators selectively move the sub-fixture toward the second fixture portion. A method of manufacturing a fan blade includes deploying the sub-fixture from the first fixture portion to effectuate a peripheral diffusion bond to join the blade body and the cover of the fan blade.
Electromagnetic crimp terminal, manufacturing method of electromagnetic crimp terminal, and connecting terminal
An electromagnetic crimp terminal includes an electric wire and a terminal plate. The electric wire includes a conductor portion, an insulation portion which covers the conductor portion, and an exposed portion which is a part of the conductor portion exposed from the insulation portion. The terminal plate includes a crimped portion. The crimped portion is crimped onto the exposed portion. The crimped portion includes a first side edge and a second side edge. A vicinity of the first side edge and a vicinity of the second side edge overlap each other.
METHOD FOR LOW-TEMPERATURE JOINING OF METAL MATERIALS, AND JOINT STRUCTURE
A low-temperature joining method effectively suppresses reductions in the mechanical properties of a junction of various types of high-tensile steel or aluminum, and of a heat-affected zone; and produces a joint structure. A method for joining two metal materials by forming a joint interface in which the two metal materials face each other at a joint portion and plunge a rotation tool caused to rotate at a prescribed speed into the joint, the method for low-temperature joining of metal materials characterized in that the peripheral velocity of the outermost periphery of the rotation tool is set to 51 mm/s or less, whereby the recrystallization temperature inherent to the metal materials is reduced by introducing a large strain to the joint, and recrystallized grains are generated at the joint interface by setting the joining temperature to less than the recrystallization temperature inherent to the metal materials.
ADDITIVE FRICTION STIR DEPOSITION METHOD FOR MANUFACTURING AN ARTICLE
A method is provided for manufacturing an article. The method comprises depositing by additive friction stir deposition a wear-resistant material on a surface of a preform to provide an intermediate article. The preform comprises a first composition and the wear-resistant material comprises a second composition. The second composition is substantially different from the first composition. The method also comprises machining the intermediate article to remove therefrom at least a portion of the wear-resistant material.
Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus
An object of the present invention is to provide an ultrasonic bonding tool capable of bonding a lead wire, without any trouble, even to a surface of a thin-film base having a plate thickness of 2 mm or less such as a glass substrate. In the present invention, a surface portion of a chip portion (1c) of an ultrasonic bonding tool (1) used in an ultrasonic bonding apparatus has a plurality of planar portions (10) formed so as to be separated from one another, and a plurality of concavities (11) formed between the plurality of planar portions. Each of the plurality of planar portions (10) has a flatness of 2 m or less.
Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus
An object of the present invention is to provide an ultrasonic bonding tool capable of bonding a lead wire, without any trouble, even to a surface of a thin-film base having a plate thickness of 2 mm or less such as a glass substrate. In the present invention, a surface portion of a chip portion (1c) of an ultrasonic bonding tool (1) used in an ultrasonic bonding apparatus has a plurality of planar portions (10) formed so as to be separated from one another, and a plurality of concavities (11) formed between the plurality of planar portions. Each of the plurality of planar portions (10) has a flatness of 2 m or less.
Method and device for establishing a shield connection of a shielded cable
Method for forming a shield connection of a shielded cable with the steps of pushing a sleeve onto a shield of a cable, inserting the cable with the sleeve into a magnetic pulse welding coil, and energizing the magnetic pulse welding coil with a current pulse in such a way that the sleeve is joined to the shield with a material bond.
BONDING METHOD FOR CONDUCTOR OF ELECTRIC WIRE AND ELECTRIC WIRE
A bonding method for a conductor of an electric wire includes a conductor formed of a plurality of strands and a sheath covering the conductor such that the conductor is exposed to a predetermined length. The bonding method ultrasonically bonds the plurality of strands of the electric wire to each other using an anvil and a horn. When the strands are ultrasonically bonded to each other by clamping a part of the conductor exposed from the sheath between the anvil and the horn throughout a predetermined length and ultrasonically vibrating the horn, a distance from the anvil or the horn to the sheath of the electric wire is shorter than a length of the strands when the strand vibrates in a primary mode by ultrasonic vibration.
BONDING METHOD FOR CONDUCTOR OF ELECTRIC WIRE AND ELECTRIC WIRE
A bonding method for a conductor of an electric wire includes a conductor formed of a plurality of strands and a sheath covering the conductor such that the conductor is exposed to a predetermined length. The bonding method ultrasonically bonds the plurality of strands of the electric wire to each other using an anvil and a horn. When the strands are ultrasonically bonded to each other by clamping a part of the conductor exposed from the sheath between the anvil and the horn throughout a predetermined length and ultrasonically vibrating the horn, a distance from the anvil or the horn to the sheath of the electric wire is shorter than a length of the strands when the strand vibrates in a primary mode by ultrasonic vibration.