Patent classifications
B23K20/26
METHODS OF OPERATING A WIRE BONDING MACHINE, INCLUDING METHODS OF MONITORING AN ACCURACY OF BOND FORCE ON A WIRE BONDING MACHINE, AND RELATED METHODS
A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.
METHODS OF OPERATING A WIRE BONDING MACHINE, INCLUDING METHODS OF MONITORING AN ACCURACY OF BOND FORCE ON A WIRE BONDING MACHINE, AND RELATED METHODS
A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.
Friction stir welding apparatus and friction stir welding system comprising the same
The presently disclosed technology includes a friction stir welding apparatus comprising a frame, a moving platform and a parallel mechanism composed of three branch mechanisms, wherein a first branch mechanism comprises a first sliding pair, a first revolute pair, a telescopic rod and a first spherical pair connected in sequence. A second branch mechanism and a third branch mechanism both comprise a third sliding pair, a second revolute pair, a third linkage and a second spherical pair connected in sequence. The friction stir welding apparatus has high stiffness, low inertia, high dynamic performance and high accuracy, which can achieve precision welding with high requirements on processing quality and accuracy for jointing annular seams of large-scale rocket fuel storage tank barrels in the aviation field, for example. The presently disclosed technology also includes a corresponding friction stir welding system.
METHOD AND APPARATUS FOR THERMALLY JOINING THERMOPLASTIC FIBER COMPOSITE COMPONENTS, AND COVER FOR A PRESSURIZATION DEVICE SUITABLE FOR THIS PURPOSE
An apparatus for thermally joining thermoplastic fiber composite components includes a pressurization arrangement for jointly covering, at least in a region of a joining zone, thermoplastic fiber composite components to be joined and applying pressure to the thermoplastic fiber composite components to press the thermoplastic fiber composite components against one another, at least in the joining zone, the pressurization arrangement being flexible, at least in some section or sections. A welding device is configured for welding the fiber composite components in the joining zone during pressurization. The pressurization arrangement and welding device are configured to weld the thermoplastic fiber composite components in a pressurized state in the joining zone. The pressurization arrangement is configured to maintain pressurization independently of the welding device until the joining zone solidifies. A cover is also disclosed for a pressurization device for thermally joining thermoplastic fiber composite components.
PRESSURE WELDING DEVICE AND PRESSURE WELDING METHOD
A pressure welding method and a pressure welding device are provided. The pressure welding device includes a plastification device (7), an upsetting device (8) and component mountings (34,35,36,37), for the components (2,3,3′,4) to be welded together, and a machine frame (12). The pressure welding device (1) further includes a machine head (13,14) with a component mounting (34, 35) and an associated additional component mounting (36, 37) and the machine head (13) is moveably arranged on the machine frame (12). The pressure welding device includes a machining device (18), for the welding part (5,5′), which is associated with the machine head (13,14) or the additional component mountings (36, 37). An adjusting device (17) generates a relative movement between the machine head (13,14) and the associated additional component mounting (36,37) for machining the welding part (5,5′).
CLAMPING SYSTEM, WIRE BONDING MACHINE, AND METHOD FOR BONDING WIRES
A clamping system, a wire bonding machine and a method for bonding wires are provided. An exemplary clamping system includes a clamping device. The clamping device includes: at least one linear guide rail; a first clamping rod arranged perpendicular to the linear guide rail; and a second clamping rod arranged perpendicular to the linear guide rail and parallel to the first clamping rod.
CLAMPING SYSTEM, WIRE BONDING MACHINE, AND METHOD FOR BONDING WIRES
A clamping system, a wire bonding machine and a method for bonding wires are provided. An exemplary clamping system includes a clamping device. The clamping device includes: at least one linear guide rail; a first clamping rod arranged perpendicular to the linear guide rail; and a second clamping rod arranged perpendicular to the linear guide rail and parallel to the first clamping rod.
Method for calibrating wire clamp device
A method for calibrating a wire clamp device includes: preparing a wire clamp device provided with a pair of arm parts having tips for clamping a wire, the arms extending from the tips toward base ends, and a drive part provided with a piezoelectric element for drive, connected to the base ends of the pair of arm parts and opening/closing the tips of the pair of arm parts; a step of detecting, by electrical continuity between the tips, a timing at which the pair of arm parts enters a closed state when the piezoelectric element for drive is driven, and acquiring a reference voltage; and a step of calibrating, on the basis of the reference voltage, an application voltage to be applied to the piezoelectric element for drive. Thus, it is possible to perform accurate and stable wire bonding.
Semiconductor wire bonding machine cleaning device and method
A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.
DEVICE FOR WELDING ROD-SHAPED CONDUCTORS
The invention relates to a device for welding rod-shaped conductors (14), comprising a compression chamber for receiving joining sections (13) of the conductors to be joined together, the compression chamber being limited in a first axial direction (z-axis) on two opposite sides by an active surface of a sonotrode (16) transmitting ultrasonic vibrations in the direction of the z-axis and by a counter surface of a counter electrode (18), the device having a knife device which is provided with a drive device and comprises a knife (24) movable in the direction of the z-axis, said knife having a cutting edge which can be moved past the compression chamber, wherein a drive motor of the drive device is arranged in an installation space arranged below the sonotrode, the drive motor being connected to a knife holder (26) via a deflection gear (31) in order for the knife to be able to perform a cutting motion, the knife being moveable in the direction of the z-axis.