A method of impact welding a flyer to a hollow component is provided. The method includes providing the component made of a first material and including a cavity where a weld site is disposed on a first side of the component. An incompressible material is packed against a second side of the component opposite the first side facing the cavity. A flyer made of a second material is positioned onto the weld site. The flyer is then impact welded to the component. The incompressible material prevents the deformation of the component during the impact welding. A method of impact welding a cover plate to a component is provided as well as a support system for welding repair of hollow components.

A stir pin includes a base end portion configured to be held rotatably about a first axis, a stirring portion provided to project from a shoulder member to be rotatable about the first axis together with the base end portion, and an intermediate portion including a second portion connected to the stirring portion to be rotatable about the first axis together with the stirring portion and having a second diameter passing through the first axis, and a first portion provided between and connected to the base end portion and the second portion to be rotatable about the first axis together with the base end portion and the second portion. The first portion has an end surface to which the second portion is connected and which has a maximum diameter larger than the second diameter. The end surface has a ring-shaped receiving surface configured to receive a material waste.

A stir pin includes a base end portion configured to be held rotatably about a first axis, a stirring portion provided to project from a shoulder member to be rotatable about the first axis together with the base end portion, and an intermediate portion including a second portion connected to the stirring portion to be rotatable about the first axis together with the stirring portion and having a second diameter passing through the first axis, and a first portion provided between and connected to the base end portion and the second portion to be rotatable about the first axis together with the base end portion and the second portion. The first portion has an end surface to which the second portion is connected and which has a maximum diameter larger than the second diameter. The end surface has a ring-shaped receiving surface configured to receive a material waste.

A bonding apparatus has a bonding tool for bonding a wire to a bonding surface, a bonding tool retainer configured to releasably retain the bonding tool, a bonding tool holder configured to hold at least one bonding tool, a bonding tool manipulator configured to transfer said bonding tool between said bonding tool holder and said bonding tool retainer, and a bonding tool guide configured to guide said bonding tool to be received by said bonding tool retainer during transfer by said bonding tool manipulator.

A method for loading feedstock bars into an additive friction stir deposition machine (AFSD) is described. The method comprises containing a plurality of feedstock bars in a container disposed adjacent to a spindle of the additive friction stir deposition machine. The method further comprises moving one feedstock bar of the plurality of feedstock bars into axial alignment with the spindle of the additive friction stir deposition machine.

A method for loading feedstock bars into an additive friction stir deposition machine (AFSD) is described. The method comprises containing a plurality of feedstock bars in a container disposed adjacent to a spindle of the additive friction stir deposition machine. The method further comprises moving one feedstock bar of the plurality of feedstock bars into axial alignment with the spindle of the additive friction stir deposition machine.

A device for heating and determining the actual temperature of a bonding tool of an ultrasonic bonder, comprising the bending tool, which has a first end face, a second end face, a lateral surface, which connects the first end face to the second end face, and an absorption region, comprising a temperature measuring unit for determining an actual temperature of the bonding tool at a temperature measuring point, which is provided on the lateral surface of the bonding tool and preferably at a tip of the bonding tool, and comprising a laser generator, a laser beam being provided with the aid of the laser generator, and the laser beam striking the bonding tool in the absorption region, and the bonding tool being heated as a result of the absorption of the laser beam.

A device for heating and determining the actual temperature of a bonding tool of an ultrasonic bonder, comprising the bending tool, which has a first end face, a second end face, a lateral surface, which connects the first end face to the second end face, and an absorption region, comprising a temperature measuring unit for determining an actual temperature of the bonding tool at a temperature measuring point, which is provided on the lateral surface of the bonding tool and preferably at a tip of the bonding tool, and comprising a laser generator, a laser beam being provided with the aid of the laser generator, and the laser beam striking the bonding tool in the absorption region, and the bonding tool being heated as a result of the absorption of the laser beam.

An apparatus for detecting the temperature of a bonding tool during laser-assisted ultrasonic bonding, comprising an automatic bonding machine having the bonding tool, having a displacement and/or positioning module for the bonding tool and having a device for exciting the bonding tool to ultrasonically vibrate, comprising a laser generator for providing a laser beam, and comprising an optical waveguide for guiding the laser beam from the laser generator to the bonding tool, wherein the optical waveguide has a multi-part design, that a deflecting and beam-splitting unit is provided between at least two adjacent parts of the optical waveguide and that furthermore a temperature sensor is provided.

An apparatus for detecting the temperature of a bonding tool during laser-assisted ultrasonic bonding, comprising an automatic bonding machine having the bonding tool, having a displacement and/or positioning module for the bonding tool and having a device for exciting the bonding tool to ultrasonically vibrate, comprising a laser generator for providing a laser beam, and comprising an optical waveguide for guiding the laser beam from the laser generator to the bonding tool, wherein the optical waveguide has a multi-part design, that a deflecting and beam-splitting unit is provided between at least two adjacent parts of the optical waveguide and that furthermore a temperature sensor is provided.