A multi-position clamp is disclosed for positioning and holding a portable friction welding tool adjacent a substrate for friction welding a plurality of fixtures in a precise pattern referenced from a fixed position on a substrate. The clamp has a clamp base temporarily securable at the fixed position on the substrate, a traveling mount comprising a tool mount for receiving said portable friction welding tool, and a connection to the clamp base allowing relative movement of the tool mount over the substrate. Index stops help install the plurality of fixtures in the pattern and an articulated fixture loading system allow positioning and loading successive fixtures without disengaging and removing said portable friction welding tool from connection with the clamp base.

A multi-position clamp is disclosed for positioning and holding a portable friction welding tool adjacent a substrate for friction welding a plurality of fixtures in a precise pattern referenced from a fixed position on a substrate. The clamp has a clamp base temporarily securable at the fixed position on the substrate, a traveling mount comprising a tool mount for receiving said portable friction welding tool, and a connection to the clamp base allowing relative movement of the tool mount over the substrate. Index stops help install the plurality of fixtures in the pattern and an articulated fixture loading system allow positioning and loading successive fixtures without disengaging and removing said portable friction welding tool from connection with the clamp base.

Apparatus and method for tool mark free stich bonding. In some embodiments, a method for wire bonding can include feeding a wire through a capillary tip and attaching a first end of the wire to a first location, thereby forming a ball bond. The method can further include moving the capillary tip towards a second location while the wire feeds out of the capillary tip. The method can further include attaching a second end of the wire to the second location while preventing contact between the capillary tip and the second location, thereby forming a stitch bond without a tool mark at the second location.

An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The weld head assembly is moveable along a plurality of substantially horizontal axes. The sonotrode is configured to operate during a welding operation at a bond force of between 5-500 kg, and with a sonotrode tip motion amplitude of between 5-150 microns.

An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The weld head assembly is moveable along a plurality of substantially horizontal axes. The sonotrode is configured to operate during a welding operation at a bond force of between 5-500 kg, and with a sonotrode tip motion amplitude of between 5-150 microns.

A bonding apparatus is provided. This bonding apparatus uses images captured by an imaging apparatus and performs a packaging process for a semiconductor chip and additional processes other than the packaging process. The bonding apparatus is provided with: an aperture switching mechanism provided in an optical system of the imaging apparatus and capable of switching between a first aperture and a second aperture that has an aperture hole diameter greater than that of the first aperture; and a control unit which controls the aperture switching mechanism to switch to either the first aperture or the second aperture. The control unit performs the packaging process using an image captured by switching to the first aperture and performs the additional processes using an image captured by switching to the second aperture.

A bonding apparatus is provided. This bonding apparatus uses images captured by an imaging apparatus and performs a packaging process for a semiconductor chip and additional processes other than the packaging process. The bonding apparatus is provided with: an aperture switching mechanism provided in an optical system of the imaging apparatus and capable of switching between a first aperture and a second aperture that has an aperture hole diameter greater than that of the first aperture; and a control unit which controls the aperture switching mechanism to switch to either the first aperture or the second aperture. The control unit performs the packaging process using an image captured by switching to the first aperture and performs the additional processes using an image captured by switching to the second aperture.

An ultrasound sonotrode (101), the first end of which is adapted to be connected to a mechanical vibrations source, equipped with a working tip (105,205,405,805) at the opposite end of the sonotrode (101), equipped with a body (104) with a cooling jacket (103), sealed at the place of contact with the body (104) of the sonotrode (101) with the use of the first seal (106) and the second seal (107), characterized in that according to the invention the first seal (106) is placed at a distance less than or equal to 20 mm from the node of the standing wave excited in the sonotrode in the working conditions, and the second seal (107,207,407,507,607) is equipped with a resilient element (108,208,408,508,608) and is located at a distance less than or equal to 20 mm from the working tip (105,205 405,805). A method for metal alloying, in which the material is melted on the working tip (105, 205, 405, 805) of the sonotrode excited to mechanical vibrations, according to the invention characterized in that a sonotrode according to the invention is used.

An ultrasound sonotrode (101), the first end of which is adapted to be connected to a mechanical vibrations source, equipped with a working tip (105,205,405,805) at the opposite end of the sonotrode (101), equipped with a body (104) with a cooling jacket (103), sealed at the place of contact with the body (104) of the sonotrode (101) with the use of the first seal (106) and the second seal (107), characterized in that according to the invention the first seal (106) is placed at a distance less than or equal to 20 mm from the node of the standing wave excited in the sonotrode in the working conditions, and the second seal (107,207,407,507,607) is equipped with a resilient element (108,208,408,508,608) and is located at a distance less than or equal to 20 mm from the working tip (105,205 405,805). A method for metal alloying, in which the material is melted on the working tip (105, 205, 405, 805) of the sonotrode excited to mechanical vibrations, according to the invention characterized in that a sonotrode according to the invention is used.

A welding device may include a frame, a welding assembly, a fastening bracket, a protective pressure plate, a first drive mechanism, and a second drive mechanism; the welding assembly may include a first welding head and a second welding head that are arranged opposite each other, and the first welding head may be fastened on the frame; the fastening bracket may be movably provided on the frame, and the second welding head may be fastened on the fastening bracket; the protective pressure plate may be fastened on the fastening bracket or the second welding head; and the first drive mechanism may be drivingly connected to the fastening bracket and configured to drive the fastening bracket so that the second welding head may reach a position of a welding point and the protective pressure plate may press against a to-be-welded member.