A method for treating a coating on a scrolling substrate by a treatment unit generating a laser beam, the method including producing a pattern including several lines or portions extending in the scrolling direction and/or the direction orthogonal to the scrolling direction, the pattern being repeated to cover treat the surface of the substrate.

A device for heat treating a coating deposited on a substrate includes a treatment module opposite which the substrate runs, the treatment module including a laser source generating a laser beam of energy, a splitter module to split the beam into a multitude of secondary beams, having an energy En to treat the coating, that have the form of a point, a scanner allowing each secondary beam to be displaced in the running direction according to a first amplitude and first velocity and/or in a direction orthogonal to the running direction according to second amplitude and second velocity; and a displacement system to create, in operation, a relative displacement movement between the substrate and the or each treatment module.

Provided herein are manufacturing methods, e.g., comprising: (1a) forming a layer, including: depositing a starting material including a mixture of a metal and a sacrificial material; and applying a laser beam to the deposited starting material to consolidate the deposited starting material and form the layer; (1b) optionally repeating (1a) one or more times; and (1c) at least partially removing the sacrificial material to form a porous metal part.

A laser pipe cutting device is provided. It includes a cutting head, a lathe bed, a first chuck, a second chuck and a third chuck; the first chuck is a fixed chuck for positioning axially and radially a pipe fitting; the second chuck is a rolling chuck for positioning radially the pipe fitting; and a fixed clamping disc and a rolling clamping disc are arranged on the third chuck at both ends. In the scheme, the third chuck integrates both the rolling clamping function and the fixed clamping function to achieve larger supporting weight and more accurate clamping precision, so that the chucks can drive a thin pipe fitting to rotate at a higher speed, the cutting efficiency is improved, and no-dead-angle and zero-tailing cutting is achieved.

A method of manufacturing an optionally shaped chip from a substrate having a crystalline structure includes establishing a projected dicing line on the substrate representing a contour of a chip to be fabricated from the substrate, and establishing a straight division assisting line contacting the contour of the chip for assisting in dividing the substrate. A division initiating point is formed after the projected dicing line is established and a laser beam is applied along the contour of the chip and the division assisting line while positioning a focused spot of the laser beam in the substrate at a predetermined position spaced from an upper surface of the substrate, thereby forming division initiating points in the substrate. The substrate is divided by applying external forces to the substrate in which the division initiating points have been formed, to divide the substrate along the division initiating points.

A decorative part and a method for producing a decorative part, wherein the decorative part is in particular a lining part of a motor vehicle. The decorative part has a decorative coat which is provided on the rear side with a reinforcing layer and/or on the visible side with a transparent coating. In order to improve the durability or the optical properties, in particular, of a decorative part provided with a light guide for transilluminating and/or backlighting the decorative coat, the decorative part is post processed by a laser treatment.

The present invention discloses a solder paste laser induced forward transfer device and method. The device comprises a laser, a beam shaping module, an optical path adjustment module, a solder paste transfer module and a computer control system, wherein the laser is connected to the beam shaping module, followed by the optical path adjustment module, and the solder paste transfer module is located below the optical path adjustment module. The beam shaping module comprises a beam expanding lens, an aperture, a flat-top beam shaper and a spatial light modulator. The optical path adjustment module comprises a two-dimensional galvanometer and an f-θ lens. The solder paste transfer module consists of a transparent substrate, a solder paste film, a clamp, a Z-axis lifting table, a receiving substrate, and an XYZ precise moving platform. The computer control system consists of a computer and drivers of other devices. The device and method can achieve mask-free, non-contact and high-precision solder paste transfer, thereby greatly shortening the production cycle and reducing the production cost.

A cleaning method involves, in a first step, emitting a first laser light toward the surface of a steel material targeted for cleaning to clean the surface of the steel material. Next, in a second step, a second laser light is emitted toward the surface of the steel material to remove an oxide layer formed on the surface of the steel material due to irradiation with the first laser light. In this step, the oxide layer formed on the surface of the steel material is removed, by emitting the second laser light at a power in a range that does not cause a new oxide layer to form on the surface of the steel material.

A substrate dividing method includes preparing a substrate that is formed with division start points along streets and that has a protective sheet attached to a surface on one side thereof and rolling a roller on a surface on the other side of the substrate, to attach an expanding tape. Next, suction by a holding table is cancelled, and, in a state in which a slight gap is formed between a holding surface of the holding table and the protective sheet, the roller is brought into contact with the expanding tape and rolled, thereby extending cracks extending from the division start points while causing the substrate to sink into the gap through the protective sheet with the division start points as starting points, and the expanding tape is expanded to widen the chip intervals with the division start points as starting points.

The present invention relates to ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays, as well as methods of making and/or using ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays. Such ultrafast laser inscribed structures are particularly adapted to condense broad band radiation, thus allowing increased sensing efficiencies to be obtained from imaging and/or sensing apparatuses. Such ultrafast laser inscribed structures can be efficiently produced by the processes provided herein.