An element chip manufacturing method includes a step of preparing a substrate including a semiconductor layer and a wiring layer formed on the semiconductor layer and having a plurality of element regions and a dicing region defining the element regions, a laser grooving step of irradiating a laser beam to the wiring layer at the dicing region, to form an aperture exposing the semiconductor layer, and an individualization step of etching the semiconductor layer exposed from the aperture, with plasma, to divide the substrate into a plurality of element chips. The laser grooving step including a step of irradiating a first laser beam, to form a first groove exposing the semiconductor layer in the dicing region, and a step of irradiating a second laser beam, with a beam center positioned outside a side wall of the first groove, to widen the first groove into the aperture.

A laser crystallizing apparatus includes a first light source unit configured to emit a first input light having a linearly polarized laser beam shape. A second light source unit is configured to emit a second input light having a linearly polarized laser beam shape. A polarization optical system is configured to rotate the first input light and/or the second input light at a predetermined rotation angle. An optical system is configured to convert the first input light and the second input light, which pass through the polarization optical system, into an output light. A target substrate is seated on a stage and output light is directed onto the target substrate. A monitoring unit is configured to receive the first input light or the second input light from the polarization optical system and measure a laser beam quality thereof.

The disclosed technology generally relates to consumable electrode wires and more particularly to consumable electrode wires having a core-shell structure, where the core comprises aluminum. In one aspect, a welding wire comprises a sheath having a steel composition and a core surrounded by the sheath. The core comprises aluminum (Al) at a concentration between about 3 weight % and about 20 weight % on the basis of the total weight of the welding wire, where Al is in an elemental form or is alloyed with a different metal element. The disclosed technology also relates to welding methods and systems adapted for using the aluminum-comprising electrode wires.

A gas inlet element for a CVD reactor includes a cylindrical main body, which together with an outer wall, forms a gas outlet face. The outer wall surrounds at least one gas distribution chamber. A plurality of gas outlet openings originating in the gas distribution chamber open out into the gas outlet face. A cooling device includes a plurality of cooling channels running adjacently but separately in the outer wall, and the gas outlet openings extend between the cooling channels.

An ingot is processed by applying exciting light, and detecting fluorescence occurring from an upper surface of the ingot. A distribution of the number of photons of the fluorescence on the upper surface of the ingot is stored as two-dimensional data in association with XY coordinate positions, and a Z-coordinate position at which the two-dimensional data is obtained is also stored. A laser beam forms a peeling layer by irradiating the ingot while positioning the condensing point of the laser beam at a depth corresponding to the thickness of a wafer from the upper surface of the ingot. A wafer is separated from the ingot with the peeling layer as a starting point, and three-dimensional data is generated representing the distribution of the number of photons of the fluorescence in the whole of the ingot on the basis of two-dimensional data at each Z-coordinate position of the ingot.

A mask includes a mask sheet including an upper surface and a lower surface facing the upper surface, the mask sheet including an opening passing through the upper surface and the lower surface; and a mask frame that supports the mask sheet, the mask sheet includes a protrusion adjacent to the opening and protruding from the lower surface, and a recess adjacent to the protrusion and recessed from the lower surface toward the upper surface of the mask sheet.

A method for producing a detachment area in a solid body in described. The solid body has a crystal lattice and is at least partially transparent to laser beams emitted by a laser. The method includes: modifying the crystal lattice of the solid by a laser beam, wherein the laser beam penetrates through a main surface of a detachable solid portion of the solid body, wherein a plurality of modifications are produced in the crystal lattice, wherein the modification are formed in a plane parallel to the main surface and at a distance from one another, wherein as a result of the modifications, the crystal lattice cracks the regions surrounding the modifications sub-critically in at least the one portion, and wherein the subcritical cracks are arranged in a plane parallel to the main surface.

A system and method is disclosed for forming a graded index (GRIN) on a substrate. In one implementation the method may involve applying a metal layer to the substrate. A fluence profile of optical energy applied to the metal layer may be controlled to substantially ablate the metal layer to create a vaporized metal layer. The fluence profile may be further controlled to control a size of metal nanoparticles created from the vaporized metal layer as the vaporized metal layer condenses and forms metal nanoparticles, the metal nanoparticles being deposited back on the substrate to form a GRIN surface on the substrate.

A method for manufacturing a continuous casting mold in which cracking and spalling are less likely to occur in a filling laminate. The method includes filling a plurality of concave portions formed on an inner surface of a copper-made mold copper plate or a copper alloy-made mold copper plate used for continuously casting steel at least in a region including a meniscus position of molten steel in a casting process with a metal having a thermal conductivity different from that of the mold copper plate.

An electronic device includes a support member and a mount member mounting on the support member. The support member and the mount member are sealed by a resin member. The support member includes a surface having a laser irradiation mark. The mount member includes a surface having a rough portion with an accumulation of material of the support member.