A method of producing a micromachined workpiece by laser micromachining includes applying a protective layer (SS) to a surface (OF) of the workpiece (WS) and machining the surface in a machining area by a laser beam (LS) through the protective layer, wherein the protective layer (SS) is produced using a coating fluid (SF) containing an at least partially volatile carrier liquid (TF) in which metallic and/or ceramic particles (PT) are dispersed; the coating fluid (SF) is applied to the surface (OF) such that at least the machining area (MA) is covered with a protective coating fluid layer (SSF); the applied coating is dried to reduce the content of carrier liquid (TF) such that a protective layer (SS) forms, which is essentially composed of the particles (PT) of the applied coating fluid or of these particles and a reduced content of the carrier liquid relative to the coating fluid; and machining of the machining areas is carried out by a laser beam (LS) irradiated through the protective layer onto the workpiece (WS).

An illuminated film-covered keyboard includes: a backlit keyboard module which includes a plurality of keys that are light-permeable, and at least one backlight source; a frame body disposed on the backlit keyboard module, the frame body including a key area, wherein the top surface of each of the plurality of keys is exposed at the key area; and a cover film disposed at the key area and on top of the top surface of each of the plurality of keys, wherein the cover film includes a light-permeable film, a base color layer, a light-shielding layer that is opaque, and a protection layer disposed on a side of the light-shielding layer opposing the base color layer, and wherein the portions of the light-shielding layer that respectively correspond to each of the plurality of keys are removed so as to form a plurality of light-transparent patterns.

A method for the gap-free joining of two workpieces is provided. The method comprises the following steps: a. the workpieces to be joined are brought into contact with one another so that a joining point is formed, b. the joining point is geometrically fixed by means of a film, c. the workpieces are joined in a gap-free manner, wherein the step a. and the step b. can be interchanged.

A laser machining apparatus includes, a processing chamber, a window disposed in a surface of the processing chamber, a substrate carrier disposed inside the processing chamber and facing the window, a laser irradiator which irradiates a laser onto the substrate carrier through the window, a protector supplier disposed on a side of the processing chamber, a protector retriever disposed on an opposite side of the processing chamber opposite to the side of the processing chamber, and a protector which connects the protector supplier with the protector retriever, where at least a portion of the protector is disposed between the substrate carrier and the window in the processing chamber.

A method for fabricating a display device is provided. A laser having a power density is provided to a substrate coupling body. The substrate coupling body includes a first substrate and a second substrate coupled to the first substrate. The second substrate is separated from the first substrate. An optical property of the first substrate separated from the second substrate is measured. The power density of the laser is adjusted based on the optical property of the first substrate.

A laser processing apparatus ablates the upper surface of a plate-shaped workpiece by using a laser beam passed through a water-soluble protective film formed on the upper surface of the plate-shaped workpiece. A nozzle applies the laser beam to the upper surface of the plate-shaped workpiece. The processing nozzle includes a debris capturing chamber for capturing debris scattering due to the application of the laser beam. A capturing space is defined in the debris capturing chamber, and an air discharge port and a suction port are opposed to each other in the capturing space. Air is discharged from the air discharge port toward the suction port so as to produce an air flow perpendicular to the optical path of the laser beam, so that the debris is sucked into the suction port by this air flow.

A method for manufacturing an object including the steps of forming layers by adding successive layers of material to form the object by selective laser melting (SLM), and inducing plastic deformation and residual stress into solidified material of at least one of the successive layers of material to improve mechanical properties and a fatigue resistance of the object, wherein the plastic deformation and the residual stress are induced by a laser.

An element manufacturing method in which a section of a substrate that is irradiated with laser light can be covered efficiently. A plurality of protrusions of an intermediate product are lined up in a first direction on a substrate, and a sealing mechanism includes one pair of rollers that rotate around a rotational axis extending in a second direction orthogonal to the first direction. The paired rollers are lined up spacedly in the first direction. In a sealing step using the sealing mechanism, a section of a lid member that is being tensioned between the paired rollers is in close contact with a part of the intermediate product. In an irradiation step, light passes through the section of the lid member that is being tensioned between the paired rollers, and reaches the intermediate product.

The method of and device for cutting brittle materials with tailored edge shape and roughness are disclosed. The methods can include directing one or more tools to a portion of brittle material causing separation of the material into two or more portions, where the as-cut edge has a predetermined and controllable geometric shape and/or surface morphology. The one or more tools can comprise energy (e.g., a femtosecond laser beam or acoustic beam) delivered to the material without making a physical contact.

Embodiments described herein relate to apparatus and methods of thermal processing. More specifically, apparatus and methods described herein relate to laser thermal treatment of semiconductor substrates by increasing the uniformity of energy distribution in an image at a surface of a substrate.