The invention relates to a device for roughening cylinder bores using a beam tool and offering a very high level of process reliability even for a large quantity.

Provided, among other things, is a method of cutting and folding a planar substrate with a focused laser beam, directed from above the substrate, to form a shape with features in 3-dimensions, the method comprising: (a) executing from above laser cuts to the planar substrate so as to provide one or more a releasable segments; (b) executing from above one or more laser-executed upward folds to bend all or a portion of a releasable segment; and (c) executing from above one or more laser-executed downward folds to bend all or a portion of a releasable segment; wherein the cuts and folds are structured so that precursors to the 3D shape remain attached to the substrate while sufficient cuts and folds are made to form the 3D shape, and wherein the planar substrate is immobile during said steps (a) through (c), or is only moved in the plane of the substrate.

A laser system includes a controller, a laser source, a laser scanner, and a laser containment apparatus. The laser containment apparatus includes a mounting structure for the laser scanner, a shroud assembly coupled to the mounting structure, and a seal interface coupled to the shroud assembly at an opposite end from the laser scanner. The shroud assembly surrounds a working volume of the laser scanner and includes a vacuum port connected to a vacuum source and a purge port that guides purge gas from a purge gas source toward the laser scanner. A distal end of the seal interface is formed of a pliable material that compresses to seal the shroud assembly to a target surface of a workpiece upon establishment of a negative pressure differential between a vacuum pressure inside the shroud assembly and ambient atmospheric pressure.

A terminal fixing method, for fixing one or more terminals to a plurality of lands provided on a substrate by laser welding, includes: constructing the plurality of lands by one or more terminal installation lands on which the terminals are installed and one or more dummy lands each larger than each of the terminal installation lands; irradiating each of divided laser beams emitted from a laser oscillator toward a corresponding land of two or more lands in the plurality of lands by the laser welding; and constructing the two or more lands by two or more terminal installation lands in the terminal installation lands, or one or more terminal installation lands in the terminal installation lands and the one or more dummy lands.

A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.

The invention relates to a method for forming a laser-welded connection, in which two parts to be joined (11; 11a, 12; 12a) are connected to one another under the effect of a laser beam (1) in a joining region (30; 30a) to form a weld (2), wherein one part to be joined (11; 11a) consists of a material transparent to laser radiation and the other part to be joined (12; 12a) consists of a material absorbent to laser radiation, and wherein the two parts to be joined (11; 11a, 12; 12a) form a receptacle (25; 25a; 25b) for a component (13; 13a; 13b; 14) separate from the parts to be joined (11; 11a, 12; 12a).

Methods for forming holes in a substrate by reducing back reflections of a quasi-non-diffracting beam into the substrate are described herein. In some embodiments, a method of processing a substrate having a first surface and a second surface includes applying an exit material to the second surface of the substrate, wherein a difference between a refractive index of the exit material and a refractive index of the substrate is 0.4 or less, and focusing a pulsed laser beam into a quasi-non-diffracting beam directed into the substrate such that the quasi-non-diffracting beam enters the substrate through the first surface. The substrate is transparent to at least one wavelength of the pulsed laser beam. The quasi-non-diffracting beam generates an induced absorption within the substrate that produces a damage track within the substrate.

A protective film agent for laser dicing that includes a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed and in which the content of sodium (Na) of the solution is equal to or lower than 100 ppb in weight ratio. Preferably, the solution further includes an antioxidant.

A laser-based measurement device includes a laser transmitter; a laser receiver; an optical device configured to guide a laser beam emitted by the laser transmitter out of the laser-based measurement device and guide the laser beam reflected by an external environment in the laser receiver; and a driving device including a first magnetic member connected to the optical device and a second magnetic member. The driving device is configured to drive the optical device to vibrate through interaction between the first magnetic member and the second magnetic member, to change a guiding direction of the laser beam passing through the optical device.

A device for laser-induced marking of an article having a marking surface comprising a non-flat portion to be marked, the device comprising: a first laser unit for emitting and scanning first laser light over a first transfer area; a first foil unit for providing a first laser transfer foil at the first transfer area; a carrier for providing the article at the first transfer area, the article having a marking surface comprising a non-flat surface area; a first hard adaptor that is transparent for the first laser light, the first hard adapter having a first contacting surface that is essentially a negative of the non-flat surface area of the marking surface; and a contacting unit for bringing the first laser transfer foil in contact with the marking surface by causing the first contacting surface to move one of the first laser transfer foil and the marking surface towards one another.