A grinding apparatus conveys a wafer from a first rough grinding unit and a first finish grinding unit to a first laser beam irradiation unit by a turntable. Thus, in one grinding apparatus, the wafer can be ground and damage of the wafer caused due to the grinding can be repaired easily and rapidly. Therefore, it is possible to execute the grinding of the wafer and the repair of the damage efficiently and favorably.

In an embodiment, a semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate is provided. The semiconductor processing tool comprises a transfer module, where the transfer module comprises a track robot for handling the substrate, and a loadlock attached to the transfer module. In an embodiment, the loadlock comprises a linear transfer system for handling the substrate. In an embodiment, the processing tool further comprises a processing chamber attached to the loadlock, wherein the linear transfer system of the loadlock is configured to insert and remove the substrate from the processing chamber.

A laser processing machine includes a guide member with which a laser head is engaged so as to be movable to one side in a conveying direction, a moving device configured to move the laser head along the guide member, a counterweight which is movably engaged to the other side of the guide member in the conveying direction and moves along the guide member in a direction opposite to a moving direction of the laser head in conjunction with the laser head moved by the moving device, and a control device which controls the moving device to move the counterweight to a position facing the grease feeding device and to perform grease feeding to an engaged portion between the counterweight and the guide member.

An additive manufacturing system is disclosed that comprises two or more lasers for precisely heating a fiber-reinforced thermoplastic feedstock and a fiber-reinforced thermoplastic workpiece in preparation for depositing and tamping the feedstock onto the workpiece. The system employs feedforward, a variety of sensors, and feedback to ensure that the feedstock and workpiece are properly heated.

Exemplary methods of fabricating a faceplate for a processing chamber may include drilling a first portion of each of a plurality of apertures in a first surface of a faceplate. Each first portion may extend at least partially through a thickness of the faceplate. The methods may include detecting a center of each first portion using a laser drilling apparatus. The methods may include drilling a diffuser portion in each of the plurality of apertures using the laser drilling apparatus. Each diffuser portion is centered with respect to a respective one of the first portions.

A temperature control method for additive manufacturing includes directing an energy beam of a first energy source toward a material and fusing at least a portion of the material to form a cladding layer, forging the cladding layer with a micro-forging device, and detecting a first internal effect parameter of the cladding layer at a forging position where is forged by the micro-forging device. The first internal effect parameter includes at least one of a stress or a strain of the cladding layer. The method also includes calculating a first calculated temperature of the cladding layer at the forging position based on the first internal effect parameter and adjusting the at least one of the first energy source and the micro forging device if the first calculated temperature does not fall within a desired temperature range.

A wafer processing method includes forming a start point of division along division lines, providing, on a front surface of the wafer, a protective member for protecting the front surface of the wafer, grinding a back surface of the wafer to a desired thickness, forming division grooves in the division lines to divide the wafer into individual device chips, providing an expandable sheet to the back surface of the wafer and removing the protective member from the front surface of the wafer, coating the front surface of the wafer with an adhesive liquid having flowability, expanding and shrinking the sheet so as to allow the adhesive liquid to enter each of the division grooves and to discharge the adhesive liquid from the division grooves, and removing the adhesive liquid from the front surface of the wafer to clean a side surface of each of the division grooves.

A method of manufacturing a terminal-attached electric wire includes: installing an electric wire including a core wire including a plurality of element wires to a terminal having a conductor coupling part having a pair of barrel pieces, the core wire being installed between the pair of barrel pieces; bending the pair of barrel pieces to cause the pair of barrel pieces to wrap around and cover the core wire in a circumferential direction to form a slit extending in an axial direction between the pair of barrel pieces, with respect to the circumferential direction; melting the element wires of the core wire by emitting laser light toward the core wire through the slit; and adhering the element wires melted with the laser light to the conductor coupling part.

Methods and systems for laser cutting of components are disclosed herein. Examples are specifically suited for laser cutting relatively large components of e.g. a vehicle framework such as a unitary side panel of a vehicle door. Multiple robots may perform laser cutting operations substantially simultaneously.

A coiling machine includes a laser heating machine configured to irradiate a wire formed into a helical shape with laser light to thereby heat a part of the wire, and cutting components configured to cut a portion of the wire after the irradiation of the laser light is stopped, a temperature of the portion being higher than before irradiated with the laser light.