A weldment manufacturing method includes drilling that forms a hole on a workpiece, feeding a filler material to the hole and putting the filler material on a bottom of the hole, and melting the filler material by emitting a laser beam to the hole while scanning with the laser beam, so as to fill the hole with the melted filler material. By repeating the feeding and the melting, a weld repairing portion filling the hole is formed.

A laser cutting method cuts a planar material using an associated laser cutting device. In a first step the material to be cut is weakened along a provided cutting line by irradiation by a pulsed first laser beam. In a second step, the material to be cut is locally heated by irradiation by a second laser beam in the region of the cutting line in order to produce material stress. In the second step, the material to be cut is heated only in one place or in a plurality of spaced apart places on the cutting line.

A method of additive manufacturing includes providing a substrate material at a location proximate a surface of a part and forming the substrate material into an additive layer on top of the surface by exposing the substrate material to a first laser beam having a first power level. After forming the additive layer on the part, the method includes cooling at least a portion of the additive layer from a first temperature reached at the completion of the forming step to a second temperature. After cooling, the method includes exposing the additive layer to a second laser beam having a second power level, wherein the second power level is lower than the first power level.

A wafer producing method for producing a wafer from an ingot, the ingot being previously formed with a separation layer along which the wafer is to be separated from the ingot. The wafer producing method includes a first ultrasonic vibration applying step of applying ultrasonic vibration to a given area of the ingot at a high density to thereby form a partially broken portion where a part of the separation layer is broken, a second ultrasonic vibration applying step of applying the ultrasonic vibration to the whole area of the ingot larger than the given area at a low density, after performing the first ultrasonic vibration applying step, thereby forming a fully broken portion where the separation layer is fully broken in such a manner that breaking starts from the partially broken portion, and a separating step of separating the wafer from the ingot along the fully broken portion.

An apparatus of assembling a cell stack including a plurality stacked battery cells and a conduction block having a busbar electrically connected to cell leads of the plurality of battery cells may include, a jig base including a rear base and a front base integrally formed with the rear base, a bending knife which is slidably provided in the jig base, may include a frontal surface to selectively contact with at least one of the cell leads, and is elastically supported by a first plate spring formed on a first side surface of the rear base, a jig plate provided external to the jig base and configured to slide along the jig base in a front and rear direction thereof, and a bending link pivotally engaged with a frontal end portion of the jig plate and configured to rotate to be perpendicular to the jig plate while pressurizing the at least one of the cell leads.

A production system and method of using the same for forming filtration tubes. The system includes: a six-axis robotic arm that moves tubes between sub-systems. The arm moves an unprocessed tube from an input-output subsystem, to an inspection system, a laser cutting system, and optional post-processing system. The inspection may include a laser and/or camera that scans a surface of a tube to determine abnormalities, defects, and/or quality issues. The laser cutting system cuts pores, holes, or slots into and through a wall of the tube, that passes inspection, to form a filtration tube used to filter solids from fluids. The post-processing system may post-process and/or clean the tube after cutting. If the tube fails inspection, it is moved to a reject bin or tray. The arm moves completed filtration tubes to a finished tube bin or tray.

An additive manufacturing system is disclosed that comprises two or more lasers for precisely heating a fiber-reinforced thermoplastic feedstock and a fiber-reinforced thermoplastic workpiece in preparation for depositing and tamping the feedstock onto the workpiece. The system employs feedforward, a variety of sensors, and feedback to ensure that the feedstock and workpiece are properly heated.

An additive manufacturing system is disclosed that comprises two or more lasers for precisely heating a fiber-reinforced thermoplastic feedstock and a fiber-reinforced thermoplastic workpiece in preparation for depositing and tamping the feedstock onto the workpiece. The system employs feedforward, a variety of sensors, and feedback to ensure that the feedstock and workpiece are properly heated.

A system and method for making vias in a laminated printed circuit board (PCB). A drill having both a mechanical drill and a laser drill is used to make the via. The mechanical drill is moved over a location in the PCB where a blind via is desired. The mechanical drill drills to a point where a tip of a bit of the mechanical drill is a predetermined distance above a target interconnect layer. Then the drill is moved such that the laser drill is located over the via where the mechanical drill had drilled the via. The laser drill then ablates the resin remaining above the target interconnect layer.

An additive manufacturing machine that includes a wire supply including a wire drive configured to advance a wire at a wire feed rate and a wire heater configured to apply resistive heating to heat the wire. The additive manufacturing machine includes an additive head for emitting a laser beam to weld the wire to a substrate, a sensor configured to detect a weld parameter, and a controller operatively connected to the wire supply, additive head, and sensor. The controller is configured to determine a failure mode of the weld as the laser beam welds the wire to the substrate based at least in part upon the weld parameter. In response to determining the failure mode, the controller is configured to adjust at least one of the wire feed rate, the resistive heating, and a power of the laser beam as the laser beam welds the wire to stabilize the weld.