Patent classifications
B23K26/0093
Reinforcing structural components
A method for manufacturing structural steel components with local reinforcement is provided. The method comprises selecting at least a zone of the component to be reinforced, providing a steel blank and deforming the blank in a press tool to form a product, wherein the blank and/or the product comprises a groove in the zone to be reinforced, the groove comprising an inner surface and an outer surface. The method further comprises depositing a reinforcement material on the inner surface of groove and locally heating the reinforcement material and the groove of the steel blank or product, to mix the melted reinforcement material with the melted portion of the steel blank or product.
Coating removal devices and methods for removing coatings from sheets of glass, preferably laminated sheets of glass
A decoating method for the edge decoating of glass sheets, the glass sheets having at least on one of their two glass surfaces a protective coating in the form of a peel-off protective film or in the form of a polymer protective layer that cannot be peeled off, and preferably having a functional coating situated under the protective coating, the protective film being partially mechanically removed, in particular ground away, for the edge decoating, in the form of at least one film strip, laser traces being introduced into the protective film before the mechanical removal of the film strip, and the laser traces being introduced in such a way that the film strip is removed in the form of individual film strip partial pieces separated from one another by the laser traces; or the polymer protective layer being removed using laser radiation.
MULTI-STEP METHOD FOR MACHINING BLIND OPE1NING IN CERAMIC COMPONENT
A method of machining includes removing material from a target region of a ceramic component to form a blind opening in the ceramic component via removing a bulk of the material by a laser machining operation and then removing a remainder of the material by a mechanical machining operation.
HYBRID MATERIAL PROCESSING METHOD AND SYSTEM
The present invention relates to a hybrid material processing method includes steps of: emitting a laser beam toward an intended-to-be-modified area intended on a workpiece by a laser to perform a property modification for the intended-to-be-modified area; applying an optical image positioning assisted equipment to perform a precise positioning for a modified area or a positioning marker on the workpiece, so as to align a machine tool to the modified area; and driving the machine tool to perform a processing for the modified area.
Method for creating a press connection arrangement, press connection arrangement and method for creating a clamping connection as well as the clamping connection itself and the use thereof
The invention relates to a method for creating a press connection arrangement and a clamping connection, the method including a plurality of steps, as well as a press connection arrangement and a clamping connection per se.
LASER SUBTRACTIVE MANUFACTURING OF AN OVERSIZED MIM BLANK
Types of metal component parts including a casing, a bezel, a buckle, parts for a watch band, etc. are made with the Metal Injection Molding (MIM) process. Each type of metal component part can be derived from an instance of a MIM blank corresponding to that particular type of metal component part formed from its corresponding injection molding tool. The MIM blank formed for the metal component part from the injection molding tool then has a portion of the MIM blank subtracted through a laser subtraction process to form an interim shape and geometry of the instance of the metal component part. The laser subtraction process is applied to the instance of the MIM blank for the metal component part when the instance of the MIM blank has not yet been sintered and hardened to a finished shape and geometry for that metal component part for the watch design.
Wafer manufacturing apparatus
A wafer manufacturing apparatus includes a chuck table configured to hold an SiC ingot by a suction surface with a wafer to be manufactured on an upper side, an ultrasonic oscillating unit configured to oscillate an ultrasonic wave, a water supply unit, and a peeling unit configured to suck and hold the wafer to be manufactured, and peel the wafer to be manufactured. The chuck table includes a porous plate forming the suction surface and a base supporting the porous plate, and sucks and holds the SiC ingot even in a state in which an area of a second surface of the SiC ingot is smaller than an area of the suction surface, and the water flows on the suction surface exposed on the periphery of the SiC ingot.
AN APPARATUS OF LASER-PROCESSING AND CORRESPONDING METHOD OF LASER-PROCESSING
The present application relates to an apparatus (10) for laser processing, comprising at least two laser sources, which are different from one another and are configured for supplying respective laser beams having wavelengths different from one another, a laser head (20), which can be operated as end tool of a laser machine tool (90) that can be configured for carrying out at least one type of laser processing operation that can be selected from a set of types of laser processing operations, and a set of orientable optical components (16) so as to provide a set of selectable optical paths for directing a laser beam supplied by a laser source of said at least two laser sources, and a control unit (30) coupled to the at least two laser sources, to the set of orientable optical components (16), and to the laser head (20) and configured for controlling the at least two laser sources, the set of orientable optical components (16), and the laser head (20) according to the type of laser processing operation selected from the set of types of laser processing operations, i.e., so as to supply and direct a laser beam associated to the respective type of processing operation onto a region of a work surface (110). The laser head (20) comprises a set of nozzles (40, 42, 44, 46) configured for directing at least one processing material onto the working region (110), which comprises at least one nozzle (40) configured for directing jets of powder of at least one material, preferably powder of metal material (in brief metal powder), as well as comprising at least one of the following: a) a first nozzle (42) configured for directing a metal wire onto the working region, preferably metal wire for laser welding; and b) a second nozzle (46) configured for directing an assist gas onto the working region, preferably an assist gas for laser welding, and wherein the control unit (30) is coupled to the set of nozzles and is configured for controlling at least one nozzle of said set of nozzles (40, 42, 44, 46) according to the type of associated and selected laser processing operation so as to control said at least one nozzle so that it will direct respective processing materials onto the working region (110) simultaneously with direction of the laser beam (L) associated to the type of laser processing operation selected.
MATERIAL DEPOSITION FOR FLUID INJECTORS
A method of making a fluid injector for a gas turbine engine includes depositing material onto a piece of tube stock. The method includes machining the deposited material into a fluid injector component. Depositing can include laser cladding the material onto the piece of tube stock. The method can include placing or flowing braze into a braze joint location between the deposited material and another fluid injector component and forming the braze into a braze joint in the braze joint location.
ADHESIVE BONDED COMPOSITE-TO-METAL HYBRID VANES AND METHOD OF MANUFACTURE
The present disclosure provides methods and systems for composite-to-metal hybrid bonded structures compromising the laser surface treatment on titanium alloys to promote adhesive bond performance. For example, a computer may be programmed to set a laser path corresponding to a predetermined geometric pattern. A laser may be coupled to the computer and apply a pulsed laser beam to a contact surface of the titanium alloy along the predefined geometric pattern. The laser may generate an open pore oxide layer on the contact surface of the substrate with a thickness of 100 and 500 nm. The open pore oxide layer may have a topography corresponding to the predefined geometric pattern. The topography may contain high degree of open pore structure and promote adhesive bond performance. Adhesive, primer or composite resin matrix may fully infiltrate into the open pore structures. Adhesive and composite laminate may co-cure to form composite-to-titanium hybrid bonded structures.