A laser processing system that can effectively blow out a material of a workpiece that is melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system includes a nozzle having an emission opening that emits a jet of the assist gas along an optical axis of the laser beam, the nozzle forming a maximum point of velocity of the jet at a position away from the emission opening and is configured such that during processing of the workpiece by the laser beam, a nozzle is disposed with respect to a process portion of the workpiece W, at a target position determined based on a position of the maximum point.

The laser irradiation step includes: removing zinc plating layers respectively disposed on the surfaces of the galvanized steel sheets by the laser irradiation; and melting the surfaces of the galvanized steel sheets of which the zinc plating layers have been removed, and the roller pressurizing step includes pressurizing the galvanized steel sheets by the rollers while the surfaces of the galvanized steel sheets that have been melted are in contact with each other such that the galvanized steel sheets are joined together.

A numerical control device controls an additive manufacturing apparatus that manufactures a modeled object by irradiating a wire, which is a material fed by a driving force of a rotary motor, which is a driving unit, with a beam, and applying the molten material to a workpiece. The numerical control device includes an error detecting unit that detects an error in the height of the workpiece in the height direction in which the material is deposited. The numerical control device includes a condition adjusting unit, which is an adjustment unit that adjusts the supply amount of the material on the basis of the error.

A laser processing apparatus includes a liquid supply mechanism at an upper portion of a holding unit. The liquid supply mechanism includes: a liquid chamber provided with a transparent plate located with a gap formed between the transparent plate and an upper surface of a workpiece held by the holding table; a liquid supply nozzle adapted to supply a liquid to the gap from one side of the liquid chamber; and a liquid discharge nozzle adapted to recover the liquid from the other side of the liquid chamber, to produce a flow of the liquid. A laser beam applying unit includes a condenser adapted to focus a laser beam emitted by a laser oscillator, to apply the laser beam to the workpiece held by the holding table through the transparent plate and the liquid supplied to the gap.

A laser processing apparatus includes a debris discharging unit disposed in a space between a beam condenser and a workpiece on a chuck table, for drawing and discharging plasma or debris produced at a processing spot on the workpiece by a laser beam applied to a face side of the workpiece. The debris discharging unit includes a dust collecting unit and a suction source connected to the dust collecting unit. The dust collecting unit includes a slanted portion, a ceiling, a bottom wall, and a pair of side walls.

A laser processing apparatus includes a debris discharging unit disposed in a space between a beam condenser and a workpiece on a chuck table, for drawing and discharging plasma or debris produced at a processing spot on the workpiece by a laser beam applied to a face side of the workpiece. The debris discharging unit includes a dust collecting unit and a suction source connected to the dust collecting unit. The dust collecting unit includes a slanted portion, a ceiling, a bottom wall, and a pair of side walls.

A device for material processing by laser radiation, including a source of laser radiation emitting pulsed laser radiation for interaction with the material, optics focusing the pulsed processing laser radiation to a center of interaction in the material, and a scanning unit shifting the positions of the center of interaction within the material. Each processing laser pulse interacting with the material in a zone surrounding the center of interaction assigned to the laser pulse so that material is separated in the zones of interaction. A control unit controls the scanning unit and the source of laser radiation such that a cut surface is produced in the material by sequential arrangement of zones of interaction. The control unit controls the source of laser radiation and the scanning unit such that adjacent centers of interaction are located at a spatial distance a ≤10 μm from each other.

A device for material processing by laser radiation, including a source of laser radiation emitting pulsed laser radiation for interaction with the material, optics focusing the pulsed processing laser radiation to a center of interaction in the material, and a scanning unit shifting the positions of the center of interaction within the material. Each processing laser pulse interacting with the material in a zone surrounding the center of interaction assigned to the laser pulse so that material is separated in the zones of interaction. A control unit controls the scanning unit and the source of laser radiation such that a cut surface is produced in the material by sequential arrangement of zones of interaction. The control unit controls the source of laser radiation and the scanning unit such that adjacent centers of interaction are located at a spatial distance a ≤10 μm from each other.

The invention relates to an apparatus 100 for 3D shaping of a workpiece 101 by material ablation with a laser beam 102. The apparatus 100 comprises a machining unit 103, which is configured to provide a pressurized fluid jet 104 onto the workpiece 101 and to couple the laser beam 102 into the fluid jet 104 towards the workpiece 101. Further, the apparatus 100 includes a motion controller 105 configured to set an x-y-z-position of the workpiece 101 relative to the machining unit 103. It also includes a measuring unit 107 configured to measure a z-position of the point of incidence 108 of the pressurized fluid jet 104 on the workpiece 101 in the z-direction.

A superimposing position correction device includes an image acquisition unit, a difference image generation unit, a processing plan image generation unit, a subregion generation unit, a similar shape search unit, a representative point extraction unit, a projection matrix calculation unit and a superimposition display unit.