Provided is a wafer processing method for dividing a wafer having devices formed on a front side thereof into individual device chips, the front side being partitioned by a plurality of crossing division lines having a testing metal pattern formed in part thereof into a plurality of regions where the respective devices are formed. The method includes a first modified layer forming step of applying a laser beam of a wavelength having a transmitting property to the wafer with a focal point of the laser beam positioned inside the wafer at a first depth from the back side, thereby forming a first modified layer along a division line, and a second modified layer forming step of applying the laser beam with the focal point positioned at a second depth shallower than the first depth, thereby forming a second modified layer along the same division line.

Provided is a wafer processing method for dividing a wafer having devices formed on a front side thereof into individual device chips, the front side being partitioned by a plurality of crossing division lines having a testing metal pattern formed in part thereof into a plurality of regions where the respective devices are formed. The method includes a first modified layer forming step of applying a laser beam of a wavelength having a transmitting property to the wafer with a focal point of the laser beam positioned inside the wafer at a first depth from the back side, thereby forming a first modified layer along a division line, and a second modified layer forming step of applying the laser beam with the focal point positioned at a second depth shallower than the first depth, thereby forming a second modified layer along the same division line.

A laser welding method of the present disclosure includes a first step and a second step. In the first step, a first end of a first workpiece is positioned such that the first end of the first workpiece is overlapped on a second end of a second workpiece to form a corner joint. In the second step, the first end forming the corner joint is irradiated from above with a laser beam. Additionally, the first end is positioned to protrude relative to the second workpiece in the first step.

A laser welding method of the present disclosure includes a first step and a second step. In the first step, a first end of a first workpiece is positioned such that the first end of the first workpiece is overlapped on a second end of a second workpiece to form a corner joint. In the second step, the first end forming the corner joint is irradiated from above with a laser beam. Additionally, the first end is positioned to protrude relative to the second workpiece in the first step.

A tool for laser beam processing is provided. The tool includes an upper tool and a lower tool, which are able to be advanced toward one another by way of a press, such that at least one component is able to be fixed in a predefined position between the upper tool and the lower tool. At least one laser beam exit surface, which is part of an inner surface of the upper tool or lower tool, and at least one laser beam guide, into which laser radiation is able to be coupled and is able to be directed through the laser beam exit surface onto a processing location on the component are provided. A control device, which enables and/or disables the coupling of laser radiation into the at least one laser beam guide depending on the advancing movement between upper tool and lower tool is provided. Furthermore, a laser beam processing apparatus and a method for laser beam processing are also provided.

A tool for laser beam processing is provided. The tool includes an upper tool and a lower tool, which are able to be advanced toward one another by way of a press, such that at least one component is able to be fixed in a predefined position between the upper tool and the lower tool. At least one laser beam exit surface, which is part of an inner surface of the upper tool or lower tool, and at least one laser beam guide, into which laser radiation is able to be coupled and is able to be directed through the laser beam exit surface onto a processing location on the component are provided. A control device, which enables and/or disables the coupling of laser radiation into the at least one laser beam guide depending on the advancing movement between upper tool and lower tool is provided. Furthermore, a laser beam processing apparatus and a method for laser beam processing are also provided.

According to one implementation, a laser peening processing device includes a laser peening processing device includes a laser oscillator, a nozzle and an inclining structure. The laser oscillator emits laser light. The nozzle condenses and irradiates the laser light toward a surface to be processed of a workpiece, with injecting liquid toward the surface to be processed. The inclining structure inclines at least one of the nozzle and the workpiece to make an injection direction of the liquid be different from a normal direction of the surface to be processed. The air bubbles arising by at least one of collision between the liquid and the surface to be processed and shock by irradiation of the laser light on the surface to be processed are flowed in a direction depending on an inclined direction of the surface to the injection direction of the liquid.

According to one implementation, a laser peening processing device includes a laser peening processing device includes a laser oscillator, a nozzle and an inclining structure. The laser oscillator emits laser light. The nozzle condenses and irradiates the laser light toward a surface to be processed of a workpiece, with injecting liquid toward the surface to be processed. The inclining structure inclines at least one of the nozzle and the workpiece to make an injection direction of the liquid be different from a normal direction of the surface to be processed. The air bubbles arising by at least one of collision between the liquid and the surface to be processed and shock by irradiation of the laser light on the surface to be processed are flowed in a direction depending on an inclined direction of the surface to the injection direction of the liquid.

A measuring system (40) serves for equipping or retrofitting a device (1) for manufacturing a three-dimensional object (2) by selective layerwise solidification of a building material (15). The device (1) includes an irradiator (18) for selectively irradiating a layer of the building material (15) applied in a working plane (7) of the device (1) at locations corresponding to a cross-section of the object (2) to be manufactured for solidifying the irradiated locations. The irradiator (18) comprises at least two irradiation units (31), preferably laser arrays, and each irradiation unit (31) can be projected onto a pixel in the working plane (7) and can be at least switched on and off. The measuring system (40) includes at least one camera (41) for determining and evaluating the radiation (19) emitted by the irradiator (18) and/or the position and/or orientation of the irradiation unit(s) (31) in absolute and/or relative to one another, and at least one distance sensor (42) for detecting an extension in a direction (z) perpendicular to the working plane (7).

A jig assembly for laser welding includes a jig body having a first penetration portion through which laser light for welding is capable of passing; a contact member connected to the jig body to contact a welding target, the contact member having a second penetration portion through which the laser light passing through the first penetration portion is capable of passing toward the welding target; a tilting unit having a hinge structure to connect the jig body and the contact member to each other; and an elastic member interposed between the jig body and the contact member to apply an elastic force to provide close contact between the contact member and the welding target.