A method for forming a gradient metallic body can include forming a first metallic deposit by providing a first quantity of metal feedstock and selectively applying energy via an energy source to the first quantity of metal feedstock, and iteratively forming additional metallic deposits by providing an additional quantity of metal feedstock contiguous with a previously formed metallic deposit and selectively applying energy via the energy source to the additional quantity of metal feedstock. The energy applied via the energy source while forming the additional metallic deposits is iteratively varied such that the gradient metallic body is formed and comprises a first end, a second end, and a middle portion, wherein a material characteristic of the gradient metallic body transitions in the middle portion between the first end and the second end.

A method for processing a wafer in which patterns including a metal layer are formed on streets. The method includes: a step of applying a laser beam along the streets formed with the patterns to form laser processed grooves while removing the patterns; a step of forming cut grooves having a depth in excess of a finished thickness of the wafer, inside the laser processed grooves; a step of grinding the back surface side of the wafer to thin the wafer to the finished thickness and to expose the cut grooves to the back surface of the wafer, thereby dividing the wafer into a plurality of device chips; a step of removing a crushed layer formed on the back surface side of the wafer; and a step of forming a strain layer on the back surface side of the wafer by plasma processing using an inert gas.

A method for processing a wafer in which patterns including a metal layer are formed on streets. The method includes: a step of applying a laser beam along the streets formed with the patterns to form laser processed grooves while removing the patterns; a step of forming cut grooves having a depth in excess of a finished thickness of the wafer, inside the laser processed grooves; a step of grinding the back surface side of the wafer to thin the wafer to the finished thickness and to expose the cut grooves to the back surface of the wafer, thereby dividing the wafer into a plurality of device chips; a step of removing a crushed layer formed on the back surface side of the wafer; and a step of forming a strain layer on the back surface side of the wafer by plasma processing using an inert gas.

A rolling type 3D printing device for recycling powders and an operation method thereof are provided. The rolling type 3D printing device has a rolling mechanism, at least one optical module, and a powder conveying module. The rolling mechanism holds a workpiece and receives powders. Cylindrical or cone workpieces can be laminated by the rolling type 3D printing device through the design of the rolling mechanism.

A rolling type 3D printing device for recycling powders and an operation method thereof are provided. The rolling type 3D printing device has a rolling mechanism, at least one optical module, and a powder conveying module. The rolling mechanism holds a workpiece and receives powders. Cylindrical or cone workpieces can be laminated by the rolling type 3D printing device through the design of the rolling mechanism.

For producing a welded ring, a band having a length corresponding to the circumference of the ring is bent to form a ring and its two ends are welded together. The band ends to be welded together have an offset in the circumferential direction of the ring, the offset lying in the plane of the band. The welding is performed form both lateral edges of the ring from the outside up to the offset. This avoids an overlapping weld of a welding quality that is different at the centre of the ring from that at the edges.

In some embodiments, an ophthalmic laser system may be provided that does not include a traditional laser console. Instead, the treatment device may be configured to house the treatment light source within the device handle. Additionally, in some embodiments, the handheld treatment device may include a user interface, such as dials and buttons, for adjusting various parameters of the therapeutic light. With certain embodiments, the self-contained handheld treatment device may be operated independent of an AC power source. For example, in some embodiments, the handheld treatment device may be battery powered. Additionally, the handheld treatment device may be disposable or may utilize replaceable distal tips in certain embodiments. Certain embodiments may be particularly designed for transscleral cyclophotocoagulation. Also, treatment guides are provided that may be configured to couple with a treatment device to align the device with a target tissue of the eye.

A dividing method of a workpiece includes a dicing tape sticking step of sticking a dicing tape to the workpiece. A first laser processing step includes irradiating the workpiece with a laser beam with such a wavelength as to be absorbed by the workpiece along a first direction to form first laser-processed grooves. A first expanding step includes expanding the dicing tape in a second direction to enlarge the width of the first laser-processed grooves. A second laser processing step includes irradiating the workpiece with the laser beam with such a wavelength as to be absorbed by the workpiece along the second direction to form second laser-processed grooves, and a second expanding step includes expanding the dicing tape in the first direction to enlarge the width of the second laser-processed grooves.

A dividing method of a workpiece includes a dicing tape sticking step of sticking a dicing tape to the workpiece. A first laser processing step includes irradiating the workpiece with a laser beam with such a wavelength as to be absorbed by the workpiece along a first direction to form first laser-processed grooves. A first expanding step includes expanding the dicing tape in a second direction to enlarge the width of the first laser-processed grooves. A second laser processing step includes irradiating the workpiece with the laser beam with such a wavelength as to be absorbed by the workpiece along the second direction to form second laser-processed grooves, and a second expanding step includes expanding the dicing tape in the first direction to enlarge the width of the second laser-processed grooves.

A chuck table holding a frame unit including a workpiece is securely placed in an opening of an annular frame by a tape. A transparent holder having a holding surface holds the workpiece with the tape interposed therebetween. A frame body is erected around and surrounding the holder, the frame body having a plurality of suction holes that are open in an inner circumferential surface of the frame body. The frame body has an inside diameter equal to or smaller than an inside diameter of the annular frame. While an opening of the frame body is being covered by the tape, a suction force is transmitted through the suction holes into the frame body, discharging air from between the tape and the holding surface to bring the tape into intimate contact with the holding surface thereby securing the workpiece of the frame unit to the holding surface.