The invention includes a system and method of using a laser for singulation of a polymer resin mold compound substrate into packages or chips by a laser ablation process. A metal jig used for holding the substrate includes trenches to allow the laser beam to penetrate during cutting. Built-in piping allows water to circulate in a base around the jig to cool the substrate during cutting. The laser beam can pass through a cutting nozzle along with compressed gas or air to cool the substrate and remove debris. A pulsed laser beam can be used in the cutting process, so that a combination of passes at different speeds and laser parameters can be achieved. This allows single pass singulation of units at high speed.

The invention includes a system and method of using a laser for singulation of a polymer resin mold compound substrate into packages or chips by a laser ablation process. A metal jig used for holding the substrate includes trenches to allow the laser beam to penetrate during cutting. Built-in piping allows water to circulate in a base around the jig to cool the substrate during cutting. The laser beam can pass through a cutting nozzle along with compressed gas or air to cool the substrate and remove debris. A pulsed laser beam can be used in the cutting process, so that a combination of passes at different speeds and laser parameters can be achieved. This allows single pass singulation of units at high speed.

Methods for repairing a coated part with holes extending therethrough are disclosed. In one embodiment, a method comprises receiving a part where a coating on a first side of the part at least partially obstructs a first opening of a hole on the first side of the part. Measured hole data indicative of a position of a second opening of the hole on a second side of the part opposite the first side is then acquired. Based on the measured hole data, the first opening of the hole is cleared of the coating by laser drilling via the second opening of the hole.

Methods for repairing a coated part with holes extending therethrough are disclosed. In one embodiment, a method comprises receiving a part where a coating on a first side of the part at least partially obstructs a first opening of a hole on the first side of the part. Measured hole data indicative of a position of a second opening of the hole on a second side of the part opposite the first side is then acquired. Based on the measured hole data, the first opening of the hole is cleared of the coating by laser drilling via the second opening of the hole.

A laser transmission characteristic value determination method for determining an appropriate transmission characteristic value of a laser so that a marked letter becomes a predetermined font size or more when marking a letter on a surface of a heat shrinkable tube formed on the outer periphery of a battery cell.

The present invention relates to a laser lift-off method of wafer. The method includes the steps as follows: focusing laser in an inside for a wafer (10) to form a plurality of cracking points (19), the plurality of cracking points (19) are located on a separating surface (20); and exerting, under a temperature of 400K to 0K, forces with opposite directions to opposite sides of the wafer (10), thereby dividing the wafer (10) into two pieces along the separating surface (20).

The present invention relates to a laser lift-off method of wafer. The method includes the steps as follows: focusing laser in an inside for a wafer (10) to form a plurality of cracking points (19), the plurality of cracking points (19) are located on a separating surface (20); and exerting, under a temperature of 400K to 0K, forces with opposite directions to opposite sides of the wafer (10), thereby dividing the wafer (10) into two pieces along the separating surface (20).

A superimposing position correction device includes an image acquisition unit, a difference image generation unit, a processing plan image generation unit, a subregion generation unit, a similar shape search unit, a representative point extraction unit, a projection matrix calculation unit and a superimposition display unit.

A laser operating machine for additive manufacture of objects, via a process of laser thermal treatment of metal powders, in particular via fusion, comprising a movement structure (11), which is mobile in a working space (100) that comprises a working surface (110), said machine operating according to a first cartesian system of axes of movement (X, Y, Z) and being configured for supporting a moving element (12) comprising one or more nozzles (34) for emitting jets of powder to be treated thermally onto a working substrate (100, 110), and an optical laser assembly (20) for conveying a laser beam (L) to form a laser spot (S) focused on said working substrate (100, 110) in order to carry out thermal treatment of said powders. According to the invention, said moving element (12) comprises: an upper portion (12a) associated in a fixed way to said movement structure (11), said optical laser assembly (20) being set in said upper portion (12a); and a lower portion (12b), set in which is a tool-carrier frame (30), arranged on which are said one or more nozzles (34) for emitting jets of powder, and in that said nozzles (34) are arranged on said frame (30) so that longitudinal axes (U) thereof form an angle of inclination () with respect to said vertical axis (I) such that jets (PJ) of said nozzles (34) intersect in a powder-deposition point (PD), said machine (10) comprising actuator means for varying said angle of inclination () of said longitudinal axes (U) of said one or more nozzles (34); said optical laser assembly (20) being set in the moving element (12) so as to send the laser beam (L) onto the working surface (110) passing within perimeter defined by said plurality of nozzles (34) emitting jets of powder.

A laser operating machine for additive manufacture of objects, via a process of laser thermal treatment of metal powders, in particular via fusion, comprising a movement structure (11), which is mobile in a working space (100) that comprises a working surface (110), said machine operating according to a first cartesian system of axes of movement (X, Y, Z) and being configured for supporting a moving element (12) comprising one or more nozzles (34) for emitting jets of powder to be treated thermally onto a working substrate (100, 110), and an optical laser assembly (20) for conveying a laser beam (L) to form a laser spot (S) focused on said working substrate (100, 110) in order to carry out thermal treatment of said powders. According to the invention, said moving element (12) comprises: an upper portion (12a) associated in a fixed way to said movement structure (11), said optical laser assembly (20) being set in said upper portion (12a); and a lower portion (12b), set in which is a tool-carrier frame (30), arranged on which are said one or more nozzles (34) for emitting jets of powder, and in that said nozzles (34) are arranged on said frame (30) so that longitudinal axes (U) thereof form an angle of inclination () with respect to said vertical axis (I) such that jets (PJ) of said nozzles (34) intersect in a powder-deposition point (PD), said machine (10) comprising actuator means for varying said angle of inclination () of said longitudinal axes (U) of said one or more nozzles (34); said optical laser assembly (20) being set in the moving element (12) so as to send the laser beam (L) onto the working surface (110) passing within perimeter defined by said plurality of nozzles (34) emitting jets of powder.