The invention relates to a method for collision avoidance of a laser machining head (102) in a machining space (106) of a laser machining tool (100), having the steps of: —Monitoring a workpiece (112) in the machining space (106) with at least one optical sensor; —Capturing images of the workpiece (112); —Detecting a change in an image of the workpiece (112); —Recognising whether the change comprises an object standing upright relative to the workpiece (112); —Checking for a collision between the upright object and the laser machining head (102) based on a predetermined cutting plan and/or the current position (1016) of the laser machining head; —Controlling the drives for moving the laser machining head (102) for collision avoidance in case of recognised risk of collision.

Method and system for a laser welding process employing the use of a single pulsed fiber laser source configured to generate a radiative output with a wavelength spectrum extending from about 1.8 microns to about 2.6 microns. In a specific case, the laser output from the single pulsed fiber laser source is focused onto the interface of the two pieces of materials at least one of which includes any of glasses, inorganic crystals, and semiconductors.

An additive manufacturing method wherein an object is manufactured by powder being applied layer-by-layer by an application device onto a base along a buildup surface and being bonded in regions to form a matrix. To provide an efficient additive powder bed method, a position of the base is checked by at least one measurement with a sensor device and the position of the base is automatically corrected at least in relation to the application device based on the at least one measurement.

A system and method of enhanced automated welding of a first workpiece and a second workpiece are provided. The method comprises providing a system for intelligent robot-based welding of the first workpiece and the second workpiece. The method further comprises determining a geometrical location of the first workpiece and the second workpiece to be welded at a welding sequence based a predetermined process variable. The method further comprises adjusting the predetermined process variable based on the geometrical location of the first and second workpieces to define an actual process variable. The method further comprises welding a first portion of the first and second workpieces with the actual process variable to define a first welded portion. The method further comprises determining a weld quality of the first welded portion.

A process of forming a non-optically detectable authentication marking (210,320, 410,535) in a diamond (200,300). Authentication marking (210,320,410,535) is formed adjacent the outer surface of an article formed from a diamond material having intrinsic optical centers. Method includes the step of applying an image of predesigned authentication marking(210,320,410,535) to a region (201,310,530) of a diamond (200,300) at or adjacent the surface of the diamond (200,300) by way of a direct laser writing; wherein the fluorescence background of the diamond material from intrinsic optical center is suppressed by authentication marking(210,320, 410, 535) under fluorescent imaging, such that the non-optically detectable identifiable authentication marking (210,320,410,535) is viewable against the fluorescence background at the region (201,310,530) of the diamond (200,300) where the authentication marking (210,320,410,535) is applied.

A processing apparatus processes an object by irradiating the object with a processing light, and includes: a combining optical system that combines an optical path of the processing light from the processing light source and an optical path of a first measurement light from a measurement light source; an irradiation optical system that irradiates the object with processing light and the first measurement light through the combining optical system; a position change apparatus that changes a position of the irradiation optical system relative to the object; an imaging apparatus a position of which is changed together with the irradiation optical system and which captures an image of the object; and a detection apparatus that detects, through the irradiation optical system and the combining optical system, a second measurement light generated from the object due to the first measurement light with which the object is irradiated through the irradiation optical system.

The present invention provides a heat transfer equipment at rapid rate of thermal diffusion across the temperature gradient. The present invention further provides a method of manufacturing of a heat transfer equipment. The various embodiments of the present invention provide various methods for manufacturing of heat transfer equipment by affixing the loop or a solid member (201) containing crests and troughs on the surface of the central hollow member (101) by use of laser weld (301). The invention would provide much higher strength to the equipment and have much higher temperature sensitivity.

A method of manufacturing a thinned wafer by separating a residual wafer from the thinned wafer, the method including: a weak layer forming step of forming a planar weak layer WL along one surface WFA of a semiconductor wafer WF to divide the semiconductor wafer WF into a thinned wafer WF1 and a residual wafer WF2 with the weak layer WL as a boundary; and a separating step of supporting at least one of a thinned wafer WF1 side and a residual wafer WF2 side of the semiconductor wafer WF and separating the thinned wafer WF1 and the residual wafer WF2 from each other, wherein the separation of the thinned wafer WF1 and the residual wafer WF2 gradually progresses from one end WFF in an outer edge of the semiconductor wafer WF toward the other end WFR in the outer edge of the semiconductor wafer WF.

A method of manufacturing a thinned wafer by separating a residual wafer from the thinned wafer, the method including: a weak layer forming step of forming a planar weak layer WL along one surface WFA of a semiconductor wafer WF to divide the semiconductor wafer WF into a thinned wafer WF1 and a residual wafer WF2 with the weak layer WL as a boundary; and a separating step of supporting at least one of a thinned wafer WF1 side and a residual wafer WF2 side of the semiconductor wafer WF and separating the thinned wafer WF1 and the residual wafer WF2 from each other, wherein the separation of the thinned wafer WF1 and the residual wafer WF2 gradually progresses from one end WFF in an outer edge of the semiconductor wafer WF toward the other end WFR in the outer edge of the semiconductor wafer WF.

The present disclosure provides three-dimensional (3D) objects, 3D printing processes, as well as methods, apparatuses and systems for the production of a 3D object. Methods, apparatuses and systems of the present disclosure may reduce or eliminate the need for auxiliary supports. The present disclosure provides three dimensional (3D) objects printed utilizing the printing processes, methods, apparatuses and systems described herein.