An apparatus for removing a portion of a coating system present in a multi-glazed window including: a decoating component to focus a laser source at a focus distance; two motors to move the decoating component along the X and Y axis; one optical system to detect on which interface the coating system is localized, and to estimate a distance between the decoating component and the detected interface; a third motor to control the position of the decoating component along a Z axis; and a displacement control unit of the third motor to displace the decoating component of a displacement distance equal to the difference between the estimated distance and said the distance in order to focus the decoating component on the detected interface.

Described are a method and laser plotter for processing a job for cutting, engraving, marking and/or lettering a flat workpiece having at least one housing with a processing chamber formed for positioning a workpiece. The chamber has at least one irradiation source in the form of a laser and a control unit for controlling the sledge, which may be operated via a belt drive and has a focusing unit arranged movably thereon. Between the sledge and a processing surface of the processing chamber, an extraction bar is arranged for extracting the exhaust gases or vapors, respectively, produced by a laser beam during the processing of the workpiece. One or more extraction openings of the extraction bar are arranged or aligned, respectively, parallel to the processing surface for generating a horizontal extraction flow.

A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, cutting the workpiece along an intended cut line. In the cutting the workpiece, a dry etching process is performed from a front surface toward a rear surface of the workpiece while the workpiece is fixed on a support member at least under its own weight or by suction, to form a groove from the front surface to reach the rear surface of the workpiece.

A processing system includes: a processing apparatus for processing an object; a rotation apparatus for rotating a holding part holding the object; a movement apparatus for moving at least one of the processing apparatus and the holding part; a measurement apparatus for measuring at least a part of the object held by the holding part; and a control apparatus for controlling the movement apparatus and the rotation apparatus based on a measured result by the measurement apparatus to rotate the holding part and to move at least one of the processing apparatus and the holding part

A machining device for duplex gear of high-precision reducer for robot includes a laser welding device, a laser rotary support, a rotary mechanism and a rotary platform, the rotary mechanism being installed with a reducer body, wherein a center of a central gear is fixedly connected with a rotating shaft; sets of duplex gears are evenly disposed around the central gear; the gear of each set of duplex gear which is connected with the central gear are connected to an output gear ring from outside; a fixed gear ring is disposed above the output gear ring; a rotating frame is disposed at ends, close to the top of the reducer, of rotating shafts of the sets of duplex gears and the rotating shaft of the central gear.

A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprising a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure a sound generated by the jet impinging on an object; and a position acquisition section configured to acquire information representing the position of the maximum point based on output data of the measuring instrument.

Systems and methods here may be used for a laser inscriber or engraver of a gemstone using software feedback loops and multiple cameras to auto focus the system and automate the inscription.

Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.