A rail apparatus, a laser apparatus, and a laser machining device are provided in the present disclosure. The rail apparatus includes a rail frame assembly and a mounting assembly. The rail frame assembly includes a rail frame and a guide shaft fixed to the rail frame. The mounting assembly includes a mounting base and a pulley. The pulley defines a sliding groove. The sliding groove is slidably connected with the guide shaft. The laser apparatus includes a base, a laser, and a focusing member. The laser is disposed on the base and is configured to emit a laser light. The focusing member is movably disposed on the base and has a focusing end. The laser apparatus is operable in a retracting state and an extending state. The laser machining device includes the rail apparatus and the laser apparatus.

An apparatus for manufacturing a composite article from a composite material. The apparatus comprising: a pulsed broadband radiation source comprising a flashlamp and a light guide adapted to guide light emitted by the pulsed broadband radiation source to a target area. The light guide comprises at least a portion ahead of the pulsed broadband radiation source, relative to the target area, comprising a light transmitting material.

A carrier tape hole processing device using laser drilling is provided. The carrier tape hole processing device includes a carrier tape formed in a band shape, a work unit configured to move the carrier tape while supporting the carrier tape, a laser drilling module disposed above the work unit and configured to irradiate a laser beam to the carrier tape placed on the work unit, a position recognition unit configured to detect a position and a moving speed of the carrier tape placed on the work unit, and a control unit configured to adjust a position of the laser beam irradiated by the laser drilling module. The control unit adjusts an irradiation position of the laser beam such that the laser beam follows the carrier tape according to the moving speed of the carrier tape detected by the position recognition unit.

A unit vector calculating unit of a laser machining device obtains a unit vector based on respective current rotational positions of an A-axis and a B-axis. A movement command calculating unit, a speed command calculating unit, or a torque command calculating unit generates a command signal for maintaining a gap amount at a constant value, based on the unit vector, and the gap amount between a machining nozzle and a workpiece. With a servo control unit, on the basis of the command signal, an X-axis motor, a Y-axis motor, and a Z-axis motor are controlled, whereby the machining nozzle is moved relatively in three-dimensional directions with respect to the workpiece.

A laser cut-and-machined product made from a plated steel plate. A cut face of the plated steel plate is coated with plating-layer-containing metal of a top surface of the plated steel plate that is melted and/or evaporated at the time of laser cutting and machining.

A laser processing device includes an optical scanning unit that scans laser light; a condenser lens that condenses the laser light onto a workpiece; a plasma light sensor that detects plasma light from the workpiece; and a control unit configured to generate processing position data for the laser light for processing the workpiece, wherein the control unit causes the optical scanning unit to scan the laser light and causes the plasma light sensor to acquire a detection result of detecting the plasma light from the workpiece, and the control unit generates the processing position data for the laser light for processing the workpiece on the basis of the detection result.

Various aspects of the present disclosure are directed toward utilizing pulsed laser light to melt and displace material along a surface. As may be consistent with one or more embodiments, material at respective regions of a surface is melted and displaced using pulsed laser light. The melting and displacement at different ones of the regions is carried out to facilitate different displacement at each region. Such an approach may be used by varying characteristics, such as fluence, of the pulsed laser light at each region. In this contexts, surfaces can be smoothed, and structures can be formed on the surface.

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

A desktop laser cutter configured to cut a cylindrical workpiece includes a laser, a cutting head that receives an electromagnetic beam from the laser and emits a cutting beam, and a gantry that supports the cutting head relative to a base plate of the laser cutter housing. The gantry can be actuated to move the cutting head within a plane that is parallel to the baseplate. The cutting head emits the cutting beam in a direction parallel to the plane. In use, the cutting head is disposed side-by-side with the workpiece and the cutting beam is applied to a side of the workpiece that faces a sidewall of the laser cutter housing. The workpiece is supported by the gantry to rotate an amount that is a function of movement of the cutting head in a direction parallel to the plane.

The present disclosure relates to the field of Chemical Vapor Deposition (CVD) diamonds and their processing after fabrication. In particular, the present disclosures provides a method for coring and slicing a CVD diamond product, wherein the CVD diamond product comprises a CVD diamond and graphitized material covering several side-faces of the diamond. The method is carried out by an apparatus that provides a laser beam coupled into a fluid jet. The method comprises, for the coring, cutting the product with the laser beam to remove the graphitized material from the side-faces of the diamond. Further, the method comprises, for the slicing, cutting off one or more slices from the diamond with the laser beam.