A laser automatic focusing equipment for a laser engraving machine is provided. It includes a lifting mechanism, a laser assembly disposed at a lower end of a side of the lifting mechanism, and a lifting motor fixedly disposed on an upper end of the side of the lifting mechanism and is in transmission connection with the lifting mechanism. The laser assembly includes a heat sink, a laser disposed in the heat sink, a distance sensor disposed in the heat sink and on a side of the laser, and a contact device disposed in the heat sink and at a bottom of the laser. The whole focusing process is controlled by a program without human intervention, with high accuracy, no manual operation and no laser irradiation risk. It is suitable for focusing of engraving materials with different hardness and different materials by adding the contact device.

Provided are a machining device (10), a machining unit, and a machining method that irradiate a workpiece (8) with a laser beam to perform cutting or boring machining of the workpiece (8). The invention has a laser output device (12), a guiding optical system (14) that guides a laser beam, and an irradiating head (16) that guides a laser beam and irradiates the workpiece (8) with the laser beam. The irradiating head (16) integrally rotates a first prism (52) and a second prism (54) with a rotation mechanism, thereby rotating a light path of the laser beam around a rotational axis of the rotation mechanism and irradiating the workpiece (8) while rotating the position of irradiation to the workpiece. A control device (22) calculates an allowable rotational frequency range of the laser beam on the basis of the relationship between an allowable thickness of a remelted layer of the workpiece (8) and a rotational frequency, or the relationship between an allowable thickness of an oxidization layer of the workpiece and the rotational frequency, determines a rotational frequency included in the allowable rotational frequency range as the rotational frequency of the rotation mechanism, and rotates the rotation mechanism at the determined rotational frequency, thereby enabling high-precision machining to be performed with a simple configuration.

An additive manufacturing system includes an ultrasonic inspection system integrated in such a way as to minimize time needed for an inspection process. The inspection system may have an ultrasonic phased array integrated into a build table for detecting defects in each successive slice of a workpiece and such that each slice may be re-melted if and when defects are detected.

A laser descaling device and process includes a first laser sending a ray to the product to be descaled, reflected rays being intercepted by sensors that send collected information into a processing unit that calculates the absorption of the ray by the surface of the product, deduces the emissivity of the oxidized surface in the direction of the reflected rays, and correlates this emissivity with reference information prerecorded inside the processing unit; a second laser sends a ray onto the surface of the product, the spots of the rays covering the entire surface to be descaled, the second laser being controlled by a control unit receiving information provided by the processing unit making it possible to determine the operating parameters to be imposed on the second laser to obtain the descaling of the surface of the product, compared with experimental results prerecorded in the control unit.

An apparatus for cutting brittle material comprises an aspheric focusing lens, an aperture, and a laser-source generating a beam of pulsed laser-radiation. The aspheric lens and the aperture form the beam of pulsed laser-radiation into an elongated focus having a uniform intensity distribution along the optical axis of the aspheric focusing lens. The elongated focus extends through the full thickness of a workpiece made of a brittle material. The workpiece is cut by tracing the optical axis along a cutting line. Each pulse or burst of pulsed laser-radiation creates an extended defect through the full thickness of the workpiece.

Provided is a laser machining system that is able to carry out machining accurately even when a workpiece joint meanders. A laser machining system according to one embodiment of the present disclosure is provided with: a laser machining head having a laser optical system that has a Galvano scanner, and a tracking sensor for detecting a joint in a workpiece; a machining robot for positioning the laser machining head; a holding robot for holding the workpiece; a machining robot control unit for controlling the machining robot so as to move the laser machining head along a joint according to a design; a holding robot control unit for controlling the holding robot so as to move the workpiece such that the distance between the position of the joint as detected by the tracking sensor and the middle of the detection range of the tracking sensor remains within a prescribed range; and a Galvano scanner control unit for controlling the Galvano scanner so as to set the irradiation position of the laser light at a position that is offset by the movement amount of the workpiece from the position of the joint as detected by the tracking sensor.

Provided is a laser machining system that is able to carry out machining accurately even when a workpiece joint meanders. A laser machining system according to one embodiment of the present disclosure is provided with: a laser machining head having a laser optical system that has a Galvano scanner, and a tracking sensor for detecting a joint in a workpiece; a machining robot for positioning the laser machining head; a holding robot for holding the workpiece; a machining robot control unit for controlling the machining robot so as to move the laser machining head along a joint according to a design; a holding robot control unit for controlling the holding robot so as to move the workpiece such that the distance between the position of the joint as detected by the tracking sensor and the middle of the detection range of the tracking sensor remains within a prescribed range; and a Galvano scanner control unit for controlling the Galvano scanner so as to set the irradiation position of the laser light at a position that is offset by the movement amount of the workpiece from the position of the joint as detected by the tracking sensor.

A manufacturing process of an element chip comprises a preparing step for preparing a substrate having first and second sides opposed to each other, the substrate containing a semiconductor layer, a wiring layer and a resin layer formed on the first side, and the substrate including a plurality of dicing regions and element regions defined by the dicing regions. Also, the manufacturing process comprises a laser grooving step for irradiating a laser beam onto the dicing regions to form grooves so as to expose the semiconductor layer along the dicing regions. Further, the manufacturing process comprises a dicing step for plasma-etching the semiconductor layer along the dicing regions through the second side to divide the substrate into a plurality of the element chips. The laser grooving step includes a melting step for melting a surface of the semiconductor layer exposed along the dicing regions.

A process for the continuous production of thin-walled, radially closed hollow profiles which are composed of nonferrous metals and have a small cross section comprises supply of a flat strip of the nonferrous metal to a forming apparatus (212) at a first supply speed, where the thickness of the strip corresponds to the wall thickness of the hollow profile. The forming apparatus (212) is configured for continuous forming of the flat strip supplied into a shape corresponding to the hollow profile. After forming, two opposite edges of the flat strip rest flush against one another in a contact region. A welding apparatus (216) continuously welds the edges which rest flush against one another by means of a laser which emits light having a wavelength of less than 600 nm. The laser heats a point in a welding region which has a diameter which is less than 20% of the cross-sectional dimension of the hollow profile. The welded hollow profile is taken off from the welding region, provided in a corrugator (225) with parallel or helical corrugation in sections and taken up in an uptake device (226).

A three-dimensional measuring device is a three-dimensional measuring device that performs three-dimensional measurement of an object using a laser beam. The three-dimensional measuring device includes a laser emitter disposed in a movable section of a robot and configured to irradiate a region including the object with the laser beam, a laser emission controller configured to control driving of the laser emitter, an image capturing device configured to image the object, on which the laser beam is irradiated, and acquire image data, and a point cloud generator configured to generate, based on the image data, three-dimensional point cloud of the region including the object. The laser emitter includes a laser beam source and a diffuser configured to diffuse the laser beam emitted from the laser beam source.