Patent classifications
B23K26/14
Method for Realizing High-Speed Cladding of Hollow Offset-Focus Annular Laser
A method for realizing high-speed cladding of hollow offset-focus annual laser. The method includes the following steps: dividing laser into annual light, and forming an offset-focus annual light spot after the annual light is focused, which acts on a surface of a matrix; during cladding for the surface of the matrix, selecting laser parameters according to different materials; after every cladding, making a shift by 20-80% of the diameter of the light spot in a vertical direction of a scanning speed of the laser; in the cladding process, selecting shielding gas for protection, and blowing the shielding gas to the molten powder in the air to spray the molten powder in air towards the surface of the matrix at a certain speed so that the cladding layer and the matrix are bonded firmly, and cladding the surface of the matrix to form a coating layer.
SYSTEM AND METHOD FOR CONTROLLING GAS FLOW TEMPERATURE IN ADDITIVE MANUFACTURING
An additive manufacturing system including an enclosure defining a build chamber, a powder bed within the build chamber, an energy source for directing a heat at the powder bed to melt a portion of the powder, a gas flow system connected to the enclosure, a gas outlet for directing gas into the build chamber for removing soot from the powder bed, and a temperature control module for controlling a build chamber temperature and a gas temperature.
Method for providing a flow for an additive manufacturing device
In a method of providing a flow for a process chamber of a device for producing a three-dimensional object by layer-wise application and selective solidification of a building material in a build area a process gas is supplied to the process chamber in a lower altitude region of the process chamber, wherein the process chamber includes a gas inlet for introducing the process gas into the process chamber and a gas outlet for discharging the process gas from the process chamber. The gas inlet and the gas outlet are provided in the lower altitude region of the process chamber and the process gas flows in a main flow from the gas inlet to the gas outlet, and wherein a secondary flow is located in a sub-region of the lower altitude region, which sub-region is located above a bottom surface of the process chamber surrounding the build area.
Multifunctional laser processing apparatus
A multifunctional laser processing apparatus includes a hollow milling shaft, a light path tool holder, a tool-holder-type melting module, a laser light source, and a temperature sensor. The hollow milling shaft includes a first light path channel and a connection portion. The light path tool holder can be connected to the connection portion. The light path tool holder has a second light path channel communicating with the first light path channel. The tool-holder-type melting module can be connected to the connection portion. The tool-holder-type melting module has a third light path channel communicating with the first light path channel. The laser light source is configured to emit a laser light beam toward the first light path channel. The temperature sensor is disposed on an outer surface of the hollow milling shaft and is configured to sense a temperature of a work piece during a multifunctional processing process.
High power laser tunneling mining and construction equipment and methods of use
There are provided high power laser and laser mechanical earth removing equipment, and operations using laser cutting tools having stand off distances. These equipment provide high power laser beams, greater than 1 kW to cut and volumetrically remove targeted materials and to remove laser affected material with gravity assistance, mechanical cutters, fluid jets, scrapers and wheels. There is also provided a method of using this equipment in mining, road resurfacing and other earth removing or working activities.
High power laser tunneling mining and construction equipment and methods of use
There are provided high power laser and laser mechanical earth removing equipment, and operations using laser cutting tools having stand off distances. These equipment provide high power laser beams, greater than 1 kW to cut and volumetrically remove targeted materials and to remove laser affected material with gravity assistance, mechanical cutters, fluid jets, scrapers and wheels. There is also provided a method of using this equipment in mining, road resurfacing and other earth removing or working activities.
ANNULAR HOLLOW OFFSET-FOCUS LASER CLADDING DEVICE
An annular hollow offset-focus laser cladding device, including a housing, a conical reflector arranged in the housing, an annular off-axis parabolic focusing mirror opposite to and arranged coaxially with the conical reflector, a nozzle installed below the conical reflector and a powder-spraying tube connected to a lower end of the nozzle. A top of the housing is provided with a light entrance; the conical reflector faces the light entrance; The powder-spraying tube is coaxial with the annular hollow offset-focusing light reflected by the annular off-axis parabolic focusing mirror; a collimating protective gas jacket is arranged on a periphery of the powder-spraying tube, and the collimating protective gas jacket is located between the annular hollow offset-focused light and the powder-spraying tube; the annular off-axis parabolic focusing mirror is configured to create a horizontally offset of parent parabola focus.
Laser processing method and laser processing apparatus
A laser processing method includes a first step of irradiating a surface of a composite material with a laser to form a hole processing groove on the composite material by scanning first paths from an outside corresponding to an inner peripheral surface side of a through hole to be formed to an inside corresponding to a center side of the through hole to be formed, the first paths extending across a width direction of the hole processing groove; and a second step of irradiating and penetrating through the hole processing groove with the laser to form the through hole by scanning second paths from the outside to the inside after the first step, the second paths extending across the width direction of the hole processing groove. The laser used at the first step has a smaller heat input amount per unit time than the laser used at the second step.
Laser processing method and laser processing apparatus
A laser processing method includes a first step of irradiating a surface of a composite material with a laser to form a hole processing groove on the composite material by scanning first paths from an outside corresponding to an inner peripheral surface side of a through hole to be formed to an inside corresponding to a center side of the through hole to be formed, the first paths extending across a width direction of the hole processing groove; and a second step of irradiating and penetrating through the hole processing groove with the laser to form the through hole by scanning second paths from the outside to the inside after the first step, the second paths extending across the width direction of the hole processing groove. The laser used at the first step has a smaller heat input amount per unit time than the laser used at the second step.
Laser metal wire deposition
A wire dispenser for a laser metal wire deposition machine comprises a longitudinal duct for guiding a wire from a proximal end to a distal end of the duct. A nozzle unit is connected to the distal end of the duct and has a through bore for receiving the wire from the distal end of the duct and for discharging the wire adjacent to a laser metal wire deposition site. The nozzle unit includes a cooling circuit for a cooling liquid.