Patent classifications
B23K26/16
Reel-to-reel laser ablation methods and devices in FPC fabrication
A reel-to-reel method to laser-ablate a circuitry pattern on the fly in a reel-to-reel machine as part of a process to fabricate a printed flexible circuit. The laser ablation method includes using an appropriate laser to irradiate a metal sheet thus ablating the edges of an intended circuitry pattern. Slugs can be removed by using an optional sacrificial liner, and the slugs can be optionally ablated into smaller parts first. The laser ablation can also include an optional method of creating tie bars to provide structural support to the web of circuitry patterns.
Reel-to-reel laser ablation methods and devices in FPC fabrication
A reel-to-reel method to laser-ablate a circuitry pattern on the fly in a reel-to-reel machine as part of a process to fabricate a printed flexible circuit. The laser ablation method includes using an appropriate laser to irradiate a metal sheet thus ablating the edges of an intended circuitry pattern. Slugs can be removed by using an optional sacrificial liner, and the slugs can be optionally ablated into smaller parts first. The laser ablation can also include an optional method of creating tie bars to provide structural support to the web of circuitry patterns.
CUTTING DEVICE AND CUTTING METHOD
A cutting device includes: a conveyance unit that conveys a continuous body of a plurality of electrode plates; a laser scanning unit that scans the continuous body with laser light; and a control unit that controls the laser scanning unit. The control unit controls a laser scanning unit so as to scan the continuous body while performing intermit irradiation with laser light, thereby forming a plurality of unit cutting sections that are continuous and dividing the continuous body into a first portion and a second portion. The unit cutting sections have a main line section extending along the boundary of the first portion and the second portion, and a bent section that bends and extends from an end of the main line section.
Method and arrangement for the liquid-assisted laser texturing of moving steel strip
A method and arrangement for the texturing of a moving steel strip wherein a texture is applied to a surface of a moving steel strip by ablation by means of a single laser beam or a plurality of laser beams directed at the surface of the moving steel strip and wherein a liquid is supplied on the moving steel strip over a surface area on the moving steel strip that covers the working area of the single laser beam or the plurality of laser beams on the moving steel strip.
Method and arrangement for the liquid-assisted laser texturing of moving steel strip
A method and arrangement for the texturing of a moving steel strip wherein a texture is applied to a surface of a moving steel strip by ablation by means of a single laser beam or a plurality of laser beams directed at the surface of the moving steel strip and wherein a liquid is supplied on the moving steel strip over a surface area on the moving steel strip that covers the working area of the single laser beam or the plurality of laser beams on the moving steel strip.
LASER PLOTTER AND METHOD FOR OPERATING A LASER PLOTTER
Described are a method and laser plotter for processing a job for cutting, engraving, marking and/or lettering a flat workpiece having at least one housing with a processing chamber formed for positioning a workpiece. The chamber has at least one irradiation source in the form of a laser and a control unit for controlling the sledge, which may be operated via a belt drive and has a focusing unit arranged movably thereon. Between the sledge and a processing surface of the processing chamber, an extraction bar is arranged for extracting the exhaust gases or vapors, respectively, produced by a laser beam during the processing of the workpiece. One or more extraction openings of the extraction bar are arranged or aligned, respectively, parallel to the processing surface for generating a horizontal extraction flow.
LASER PLOTTER AND METHOD FOR OPERATING A LASER PLOTTER
Described are a method and laser plotter for processing a job for cutting, engraving, marking and/or lettering a flat workpiece having at least one housing with a processing chamber formed for positioning a workpiece. The chamber has at least one irradiation source in the form of a laser and a control unit for controlling the sledge, which may be operated via a belt drive and has a focusing unit arranged movably thereon. Between the sledge and a processing surface of the processing chamber, an extraction bar is arranged for extracting the exhaust gases or vapors, respectively, produced by a laser beam during the processing of the workpiece. One or more extraction openings of the extraction bar are arranged or aligned, respectively, parallel to the processing surface for generating a horizontal extraction flow.
Laser cutting system for cutting articles and forming filtration tubes
A laser cutting system for cutting articles, such as tubes, and method of using the same. The laser cutting system can cut slots, holes, and/or pores into each article or tube to form filtration tubes, for example. The system includes a delivery system for delivering a laser beam from a laser source, at least one mirror, a focusing objective lens, a gas source, and a delivery nozzle. A first stage holds each article in a longitudinal direction, and may rotate the article axially during delivery of the gas and laser beam towards the article and move the article longitudinally relative to the delivery nozzle. A second stage is provided in the system for moving the delivery nozzle relative to the article being held by the first stage. A controller controls actuation of the laser beam and the gas source, and movement of the first stage and the second stage.
Debris-free laser ablation processing assisted by condensed frost layer
Laser ablation processing method for debris-free and efficient removal of materials comprises the step of using a refrigeration device to condense the water vapor and form a thin frost layer on the materials at temperatures below the freezing point. The residual debris produced during the ablation process deposits on the frost layer that covers the material, which is easily removed when the frost layer melts. At the same time, the frost layer in the laser irradiation area melts to a liquid layer, which can effectively reduce the deposition of debris on the inner wall of the groove and thus improve the efficiency and quality of laser ablation. The method is applicable to debris-free laser processing on an arbitrary curved surface.
Debris-free laser ablation processing assisted by condensed frost layer
Laser ablation processing method for debris-free and efficient removal of materials comprises the step of using a refrigeration device to condense the water vapor and form a thin frost layer on the materials at temperatures below the freezing point. The residual debris produced during the ablation process deposits on the frost layer that covers the material, which is easily removed when the frost layer melts. At the same time, the frost layer in the laser irradiation area melts to a liquid layer, which can effectively reduce the deposition of debris on the inner wall of the groove and thus improve the efficiency and quality of laser ablation. The method is applicable to debris-free laser processing on an arbitrary curved surface.