There is provided a laser processing method for performing laser processing on a wafer having a functional layer on a substrate. The laser processing method includes a blackening step of emitting a pulsed laser beam of a wavelength transparent to the functional layer from a laser oscillator and blackening the functional layer by irradiating the functional layer with the pulsed laser beam of energy equal to or higher than a processing threshold value at which the functional layer is processed such that an overlap ratio of the pulsed laser beam successively applied to the functional layer is equal to or more than 90% and less than 100%, and a groove processing step of forming a laser-processed groove by irradiating the blackened functional layer with the pulsed laser beam and making the blackened functional layer absorb the pulsed laser beam, after performing the blackening step.

The invention relates to apparatuses and correspondent method of laser beam processing for various materials with strong light absorption and scattering. The apparatuses can be used for medical no incision laser surgery, long distance underwater or atmosphere light communication, less attenuation light energy delivery in optical turbid media, and so on. This invention is a new use of the imaging method using multiple beam interference to create destructive interference in the beam propagation path to reduce the illumination light intensity and so to reduce absorption and scattering of the materials, and to create constructive interference to produce high composite light intensity which forms an inner light layer to illuminate, process the inner object in the materials. The apparatuses are practicable and have great performance. Compared with the traditional apparatuses, for example, the created laser scalpel can treat tissue at depths of more than 5 cm in human body without incision and with high 3D precision of about 1 μm. The effective light energy delivery distance is more than 1000 m in clear seawater.

The invention relates to apparatuses and correspondent method of laser beam processing for various materials with strong light absorption and scattering. The apparatuses can be used for medical no incision laser surgery, long distance underwater or atmosphere light communication, less attenuation light energy delivery in optical turbid media, and so on. This invention is a new use of the imaging method using multiple beam interference to create destructive interference in the beam propagation path to reduce the illumination light intensity and so to reduce absorption and scattering of the materials, and to create constructive interference to produce high composite light intensity which forms an inner light layer to illuminate, process the inner object in the materials. The apparatuses are practicable and have great performance. Compared with the traditional apparatuses, for example, the created laser scalpel can treat tissue at depths of more than 5 cm in human body without incision and with high 3D precision of about 1 μm. The effective light energy delivery distance is more than 1000 m in clear seawater.

A protective film agent for laser dicing that includes a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed and in which the content of sodium (Na) of the solution is equal to or lower than 100 ppb in weight ratio. Preferably, the solution further includes an antioxidant.

An optical device includes a unitary substrate of optically transparent material. The unitary substrate has formed therein at least one collection lens and channel, the channel for receiving an optical fibre and arranged to align the optical fibre inserted therein such that the collection lens couples light collected by the collection lens into the optical fibre.

An optical device includes a unitary substrate of optically transparent material. The unitary substrate has formed therein at least one collection lens and channel, the channel for receiving an optical fibre and arranged to align the optical fibre inserted therein such that the collection lens couples light collected by the collection lens into the optical fibre.

A method includes directing a laser beam onto a phase-adjustment device such that the laser beam downstream the phase-adjustment device is a modified Airy beam having a modified Airy beam focal region having a main lobe and a plurality of side lobes. The main lobe has a lobe aspect ratio of 1.2 or greater.

A method includes directing a laser beam onto a phase-adjustment device such that the laser beam downstream the phase-adjustment device is a modified Airy beam having a modified Airy beam focal region having a main lobe and a plurality of side lobes. The main lobe has a lobe aspect ratio of 1.2 or greater.

A method of manufacturing a display device includes attaching a protective film onto a display panel that includes a display area and a pad area, where the protective film includes an adhesive layer and a protective layer disposed on the adhesive layer, half-cutting the protective film along a cutting line between the display area and the pad area such that a total thickness of the protective layer and a partial thickness of the adhesive layer are cut, irradiating a partially cut portion of the adhesive layer with a laser beam along at least a portion of the cutting line, and detaching a portion of the protective film that corresponds to the pad area along the cutting line.

A method of manufacturing a display device includes attaching a protective film onto a display panel that includes a display area and a pad area, where the protective film includes an adhesive layer and a protective layer disposed on the adhesive layer, half-cutting the protective film along a cutting line between the display area and the pad area such that a total thickness of the protective layer and a partial thickness of the adhesive layer are cut, irradiating a partially cut portion of the adhesive layer with a laser beam along at least a portion of the cutting line, and detaching a portion of the protective film that corresponds to the pad area along the cutting line.