A method of making a customized item from a single piece of quartz, the method comprising the steps of providing a piece of quartz of sufficient size and shape to form the item, carving the item out of the single piece of quartz into a desired shape, etching information into the item and applying a coating to the information after the step of etching the information to form the customized item. A customized item is also provided comprising a body formed of a single piece of quartz, the body shaped into a configuration simulating a home or a sports object, and including personalized information etched into the quartz and a coating over the personalized information to enhance visibility.

A blade repair method is provided and includes operating a deposition head to deposit additional materials onto base materials while moving the deposition head relative to the base materials, arranging a temperature regulating assembly to remain aside the base materials in a trailing position relative to the deposition head and controlling operations of the temperature regulating assembly during deposition head movements and during depositional operations of the deposition head to control temperatures of at least the base materials and the additional materials during at least the deposition head movements and the depositional operations.

A blade repair method is provided and includes operating a deposition head to deposit additional materials onto base materials while moving the deposition head relative to the base materials, arranging a temperature regulating assembly to remain aside the base materials in a trailing position relative to the deposition head and controlling operations of the temperature regulating assembly during deposition head movements and during depositional operations of the deposition head to control temperatures of at least the base materials and the additional materials during at least the deposition head movements and the depositional operations.

A workpiece-separating device includes: a holding member that detachably holds a workpiece among a layered body in which the workpiece that includes a circuit board and a supporting body that allows laser beams to pass therethrough are layered with each other via a separating layer that peelably alters with absorption of the laser beams; a laser irradiation part that performs irradiation of Gaussian beams pulse-oscillated as the laser beams toward the separating layer through the supporting body of the layered body held by the holding member; and a controlling part that controls an operation of the laser irradiation part, wherein the controlling part controls a distance between centers of the adjacent Gaussian beams of the laser beams pulse-oscillated from the laser irradiation part to be less than three times of a standard deviation when a relationship between a beam diameter and irradiation intensity is assumed as a normal distribution.

A substrate having a first surface with at least one division line and an opposite second surface is processed by attaching a protective sheeting to the first surface and applying a laser beam to the protective sheeting to form a plurality of alignment marks in the protective sheeting. The substrate has a backside layer on the second surface. A laser beam is applied to the substrate from the side of the first surface. The substrate is transparent to the laser beam and the focal point of the laser beam is located inside the substrate which is closer to the second surface than to the first surface, to form a plurality of alignment marks in the backside layer. Substrate material is removed along the division line from the side of the second surface. The alignment marks are used for aligning the substrate material removing means relative to the division line.

A laser irradiation method of irradiating, with a pulse laser beam, an irradiation object in which an impurity source film is formed on a semiconductor substrate includes: reading fluence per pulse of the pulse laser beam with which a rectangular irradiation region set on the irradiation object is irradiated and the number of irradiation pulses the irradiation region is irradiated, the fluence being equal to or larger than a threshold at or beyond which ablation potentially occurs to the impurity source film when the irradiation object is irradiated with pulses of the pulse laser beam in the irradiation pulse number and smaller than a threshold at or beyond which damage potentially occurs to the surface of the semiconductor substrate; calculating a scanning speed Vdx; and moving the irradiation object at the scanning speed Vdx relative to the irradiation region while irradiating the irradiation region with the pulse laser beam at the repetition frequency f.

A wafer processing method for processing a wafer with devices formed in regions on a side of a front surface of the wafer, the regions being defined by first scheduled division lines and second scheduled division lines includes a first modified layer forming step and a second modified layer forming step. in the first modified layer forming step, a laser beam is irradiated with its focal point set at a height leveled with a height of a first region located inside the wafer on the side of the front surface of the wafer, whereby first modified layers are formed. In the second modified layer forming step, the laser beam is irradiated with its focal point set at a height leveled with a height of a second region located inside the wafer on a side of a back surface of the wafer, whereby second modified layers are formed.

Provided is a PSA film comprising a resin film as a substrate and a PSA layer provided at, least on one face of the resin film. The PSA film includes a laser beam absorbent that comprises, as a constituent element, a metal having a specific heat of less than 900 J/kg.Math.K and a heat conductivity of less than 200 W/m.Math.K. The PSA film has a laser beam absorbance of 20% or higher in the wavelength range between 900 nm and 1100 nm.

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.