Laser patterning methods utilize a laser absorbent hard mask in combination with wet etching to form patterned solar cell doped regions to improve cell efficiency by avoiding laser ablation of an underlying semiconductor substrate associated with ablation of an overlying transparent passivation layer.

Laser patterning methods utilize a laser absorbent hard mask in combination with wet etching to form patterned solar cell doped regions to improve cell efficiency by avoiding laser ablation of an underlying semiconductor substrate associated with ablation of an overlying transparent passivation layer.

Embodiments are directed to a method for processing a film, which includes: (A) a step wherein protective films are temporarily bonded to both surfaces of a film that is a material to be processed, thereby obtaining a film to be processed to both surfaces of which the protective films are bonded; and (B) a step wherein the film to be processed to both surfaces of which the protective films are bonded is cut using a laser having a wavelength at which the protective films have an absorbance of 50% or more. Other embodiments are directed to a method for processing a film, which includes: (A) a step wherein protective films are temporarily bonded to both surfaces of a film that is a material to be processed, thereby obtaining a film to be processed to both surfaces of which the protective films are bonded; and (B′) a step wherein the film to be processed to both surfaces of which the protective films are bonded is cut using a laser having a wavelength at which the film to be processed has an absorbance of 50% or more and the protective films have an absorbance of 50% or more.

Embodiments are directed to a method for processing a film, which includes: (A) a step wherein protective films are temporarily bonded to both surfaces of a film that is a material to be processed, thereby obtaining a film to be processed to both surfaces of which the protective films are bonded; and (B) a step wherein the film to be processed to both surfaces of which the protective films are bonded is cut using a laser having a wavelength at which the protective films have an absorbance of 50% or more. Other embodiments are directed to a method for processing a film, which includes: (A) a step wherein protective films are temporarily bonded to both surfaces of a film that is a material to be processed, thereby obtaining a film to be processed to both surfaces of which the protective films are bonded; and (B′) a step wherein the film to be processed to both surfaces of which the protective films are bonded is cut using a laser having a wavelength at which the film to be processed has an absorbance of 50% or more and the protective films have an absorbance of 50% or more.

A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

The present invention concerns a laser cutting method, the method comprising the steps of providing a workpiece of a metallic workpiece material, directing a laser beam onto a surface of the workpiece and moving the laser beam relative to the metal workpiece to create a laser cut. According to an aspect of the invention, a supplemental material is provided at the position of incidence. In this, the supplemental material is capable of reducing the melting temperature of the workpiece material when combined with the workpiece material. For example, the workpiece material and the supplemental material may together form a eutectic system.

The present invention concerns a laser cutting method, the method comprising the steps of providing a workpiece of a metallic workpiece material, directing a laser beam onto a surface of the workpiece and moving the laser beam relative to the metal workpiece to create a laser cut. According to an aspect of the invention, a supplemental material is provided at the position of incidence. In this, the supplemental material is capable of reducing the melting temperature of the workpiece material when combined with the workpiece material. For example, the workpiece material and the supplemental material may together form a eutectic system.

A method for processing surfaces of metal materials, and to a method for roughening a surface of a metal material by using a laser shock forming technology and an application thereof. According to the method, based on a pulse-laser-induced force effect, a micron-imprint mold and a nano-imprint mold are first prepared, and then the molds are used as a template to present surface microstructures of the imprint molds on a surface of a to-be-processed material. The method is simple and efficient. In addition, compared with a conventional method, a micron-structures and nano-structures can be quantitatively prepared on a surface of a metal material, and the surface roughness and the preparation scope are accurate and controllable and can be pre-designed.

A method for processing surfaces of metal materials, and to a method for roughening a surface of a metal material by using a laser shock forming technology and an application thereof. According to the method, based on a pulse-laser-induced force effect, a micron-imprint mold and a nano-imprint mold are first prepared, and then the molds are used as a template to present surface microstructures of the imprint molds on a surface of a to-be-processed material. The method is simple and efficient. In addition, compared with a conventional method, a micron-structures and nano-structures can be quantitatively prepared on a surface of a metal material, and the surface roughness and the preparation scope are accurate and controllable and can be pre-designed.