Method for structuring a substrate (11) and comprising the following steps: —providing a device (100) comprising a light source (33), an optical system (2) for obtaining an outgoing light beam (7) spatially offset in relation to the incoming light beam (1), and capable of modifying this spatial offset, focusing means (9) for focusing the outgoing light beam (7), a substrate holder (59), a movement device (60) for generating a movement (41) between the outgoing light beam (7) and the substrate (11); —providing and placing the substrate (11) on the substrate holder (59); —etching the substrate with the focused outgoing light beam (7) having an angle of attack (107) greater than 1° for any spatial offset between outgoing light beam (7) and incoming light beam (1) imposed by the optical system (2).

A semiconductor device, including a semiconductor element, and a first wiring member and a second wiring member bonded to each other and being electrically connected to the semiconductor element. The first wiring member has an irradiation area for receiving irradiation of a laser beam. The semiconductor device also includes a protection member disposed on an area of the second wiring member opposite the irradiation area of the first wiring member, the protection member having a melting point higher than a melting point of at least one of the first wiring member and the second wiring member including the area on which the protection member is disposed.

A method for the manufacture of a cold-rolled steel sheet of thickness e.sub.f between 0.5 mm and 3 mm is provided. At least two hot-rolled sheets of thickness e.sub.i are supplied and butt welded, so as to create a welded joint (S1) with a direction perpendicular to the direction of hot rolling. The at least two hot-rolled sheets are pickled by continuous passage through a bath, then the assembly is cold rolled, in a step (L1), to an intermediate thickness e.sub.int, the direction of cold rolling (DL.sub.1) coinciding with the direction of hot rolling. The cold rolling is carried out with a reduction ratio ${\mathrm{.Math.}}_1=\mathrm{Ln}\left(\frac{e_i}{e_{\mathrm{int}}}\right)$
such that: $0.35\le \frac{\mathrm{Ln}\left(\frac{\mathrm{ei}}{e\mathrm{int}}\right)}{\mathrm{Ln}\left(\frac{ei}{ef}\right)}\le 0.65,$
then the welded joint (S1) is removed so as to obtain at least two intermediate cold-rolled sheets. Then the two intermediate cold-rolled sheets are butt welded, so as to create a welded joint (S2), the dire

In various embodiments, a workpiece is processed utilizing one or more output beams emitted from a step-core optical fiber and formed from one or more input beams that may have non-circular beam shapes. In various embodiments, an input beam may be a variable-power laser beam having a laser-beam numerical aperture (NA) that varies as a function of the power of the laser beam. The step-core optical fiber may have an outer core NA that is greater than or equal to the laser-beam NA at a laser power of approximately 100%, an inner core NA that is less than or equal to the outer core NA, and an inner core NA that is greater than or equal to the laser-beam NA at a power of 50%.

Provided is a flip-chip laser bonding system for bonding a semiconductor chip in the form of a flip chip to a substrate using a laser beam. In the flip-chip laser bonding system, the semiconductor chip is laser-bonded to the substrate while pressure is applied to the semiconductor chip. Accordingly, even a semiconductor chip that is bent or is capable of being bent can be bonded to a semiconductor chip without contact failure.

A display device includes: a first substrate in which a display area and a non-display area disposed outside the display area are defined; a second substrate facing the first substrate; and a cell seal disposed on the non-display area, where the cell seal includes a bonding filament connecting the first substrate and the second substrate to each other.

A stent that includes a stent body and one or more weld joints, wherein the weld joints include a radiopaque material, and a method of making a stent that includes using a radiopaque filler material in a welding process.

A stent that includes a stent body and one or more weld joints, wherein the weld joints include a radiopaque material, and a method of making a stent that includes using a radiopaque filler material in a welding process.

A combined optical system for determining temperature of the surface of an object or material and its distance with respect to a predetermined reference point associated with the system includes an optical radiation source emitting optical probe radiation at a predetermined wavelength or in a predetermined wavelength range, a source control unit controlling switching of the source from an operative condition, in which it emits optical probe radiation, to an inoperative condition, in which it does not emit optical probe radiation, optical detectors acquiring scattered optical radiation and thermally emitted optical radiation from the surface of the object or material, and a processing unit determining the distance of the surface of the object/material based on scattered optical probe radiation when the source is operative, and the local temperature of the surface of the object/material on the basis of thermally emitted optical radiation when the source is inoperative.

The present disclosure provides a battery pack including a plurality of cylindrical battery cells forming a clamping part by coupling a cap assembly on one opened surface of a cylindrical can and forming a first electrode terminal and a second electrode terminal on a top surface of the clamping part and a top end central portion of the cap assembly, respectively, and a first electrode terminal connecting plate simultaneously coupled to upper end surfaces of the clamping parts of the battery cells in a state in which cylindrical battery cells are laterally arranged so that the cap assemblies of the cylindrical battery cells head in the same direction. The first electrode terminal connecting plate includes a welding plate having a relatively thin thickness to be welded on the upper end surface of the clamping part of the cap assembly, and a conductive plate coupled to a top surface of the welding plate, which is opposite to the cap assembly, and having a relatively thick thickness in comparison with that of the welding plate for smooth current flow between first electrode terminals of the upper end surface of the clamping part.