A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit including a stage, a laser emission unit, a beam transmission plate, and a beam transmission plate transfer unit.

A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit including a stage, a laser emission unit, a beam transmission plate, and a beam transmission plate transfer unit.

A manufacturing method includes the steps of: preparing a battery case having an opening; fabricating an assembly by inserting a wound electrode body and a lid which includes a terminal connected to the wound electrode body and which closes the opening into the battery case; sandwiching the battery case by a pressing jig in a state where the opening faces downward to close a gap between the battery case and the lid; disposing the assembly so that the terminal faces upward by inverting the assembly in a state where the battery case is sandwiched by the pressing jig; and welding the lid and the battery case to each other in a state where the terminal faces upward and the battery case is sandwiched by the pressing jig.

A manufacturing method includes the steps of: preparing a battery case having an opening; fabricating an assembly by inserting a wound electrode body and a lid which includes a terminal connected to the wound electrode body and which closes the opening into the battery case; sandwiching the battery case by a pressing jig in a state where the opening faces downward to close a gap between the battery case and the lid; disposing the assembly so that the terminal faces upward by inverting the assembly in a state where the battery case is sandwiched by the pressing jig; and welding the lid and the battery case to each other in a state where the terminal faces upward and the battery case is sandwiched by the pressing jig.

A display device includes: a first substrate in which a display area and a non-display area disposed outside the display area are defined; a second substrate facing the first substrate; and a cell seal disposed on the non-display area, where the cell seal includes a bonding filament connecting the first substrate and the second substrate to each other.

A substrate processing system includes a pre-alignment apparatus having a pre-alignment stage configured to hold a processing target substrate and a detector configured to detect a center position and a crystal orientation of the processing target substrate held by the pre-alignment stage; and a laser processing apparatus having a laser processing stage configured to hold the processing target substrate and a laser processing head configured to radiate and concentrate a laser beam for processing the processing target substrate to the processing target substrate held by the laser processing stage. The pre-alignment apparatus is disposed above the laser processing apparatus.

A bonding method of a semiconductor device is disclosed. The method includes steps of forming a plurality of holes on two bonding parts of a main substrate, respectively; disposing a semiconductor device on the main substrate, and aligning the two bonding parts with two conduction parts of the semiconductor device; aligning a laser to the conduction parts and operating the laser to emit a laser beam from a lower part of the main substrate, wherein the laser beam passes through the holes of the bonding part to strike on the conduction part, so as to melt each conduction part to bond with the bonding part. With configuration of the holes, the conduction parts and the bonding part can be smoothly bonded by using laser, so as to achieve the purpose of transferring the semiconductor device.

A bonding method of a semiconductor device is disclosed. The method includes steps of forming a plurality of holes on two bonding parts of a main substrate, respectively; disposing a semiconductor device on the main substrate, and aligning the two bonding parts with two conduction parts of the semiconductor device; aligning a laser to the conduction parts and operating the laser to emit a laser beam from a lower part of the main substrate, wherein the laser beam passes through the holes of the bonding part to strike on the conduction part, so as to melt each conduction part to bond with the bonding part. With configuration of the holes, the conduction parts and the bonding part can be smoothly bonded by using laser, so as to achieve the purpose of transferring the semiconductor device.

A system and method for laser sealing an edge portion of a covering of an architecture-structure covering is disclosed. In one embodiment, after cutting a covering of an architectural-structure covering to an appropriate size, lasering the cut edge portions or surfaces of the covering to seal the cut edge portions or surfaces of the covering to prevent fraying. The beam of the laser may be positioned to contact the cut edge portions or surfaces of the covering in a plane of the fabric. Subsequently, the beam of the laser scans or moves across the surface of the cut edge portion of the covering. In use, the beam of the laser is arranged and configured to apply heat to the surface of the fabric material at discrete points or spots to vaporize any loose fibers located along the cut edge portion of the covering.

Laser processing systems that employ multi-camera vision subsystems and associated methods of use and manufacture are disclosed herein. In some embodiments, a method for processing one or more materials or compositions of materials with a laser processing system comprises generating, via a first camera carried by the laser processing system, a first preview image of one or more materials to be processed. The first preview image comprises an image of an entire material processing field. The method also comprises generating, via a second camera carried by the laser processing system, a second preview image. The second preview image comprises an image of only a selected portion of the material processing field from the first preview image. Based on the second preview image, the method further comprises modifying a design file relative to a material to be processed.