A method of acupuncture needle packaging includes inserting an acupuncture needle body of an acupuncture needle including an acupuncture needle handle at an upper portion thereof into an acupuncture needle tube starting from the acupuncture needle handle; disposing the acupuncture needle in the acupuncture needle tube in a state in which the upper portion of the acupuncture needle handle is exposed to an exterior of the acupuncture needle tube; ascending the upper portion of the acupuncture needle handle exposed to the exterior using a pressing jig; irradiating a laser to an area where the acupuncture needle tube and the acupuncture needle handle abut each other; and coupling the acupuncture needle handle and the acupuncture needle tube by thermally deforming the area where the acupuncture needle tube and the acupuncture needle handle abut each other with a heat generated by the laser.

In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.

An optical module includes an optical semiconductor chip having a first surface that includes a laser beam irradiation region and a cleavage region, an optical fiber optically coupled to the first surface, and a support member having a second surface bonded to the first surface, and configured to support the optical fiber. The optical semiconductor chip has an optical signal input and output part located in the cleavage region, and the second surface is bonded to the first surface within the cleavage region.

The present invention discloses a method for welding Fe—Al intermetallic compound microporous material and a welded part made thereby, and the present invention relates to the field of welding technology. For the problem in the prior art that there is great difficulty in welding between Fe—Al microporous material and dense stainless steel, the method for welding Fe—Al intermetallic compound microporous material, in accordance with the present invention, comprises the following steps: turning on “welding torch fuel-gas” of a fusion-welding machine, and turning on welding shielding gas in a shield; adjusting welding parameters of the welding machine and parameter of the welding shielding gas in the shield for a fusion welding process; switching on the welding machine, and using welding wire as welding filler for welding Fe—Al intermetallic compound microporous material to dense stainless steel; and, cooling after completion of the welding.

The present invention discloses a method for welding Fe—Al intermetallic compound microporous material and a welded part made thereby, and the present invention relates to the field of welding technology. For the problem in the prior art that there is great difficulty in welding between Fe—Al microporous material and dense stainless steel, the method for welding Fe—Al intermetallic compound microporous material, in accordance with the present invention, comprises the following steps: turning on “welding torch fuel-gas” of a fusion-welding machine, and turning on welding shielding gas in a shield; adjusting welding parameters of the welding machine and parameter of the welding shielding gas in the shield for a fusion welding process; switching on the welding machine, and using welding wire as welding filler for welding Fe—Al intermetallic compound microporous material to dense stainless steel; and, cooling after completion of the welding.

A solder device includes a light source, a solder module, an optical guiding assembly, a sensor and a feedback controller. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The optical guiding assembly, the sensor and the feedback controller are integrated as a system controller. Therefore, the volume and weight of the solder module are compacted.

A manufacturing method for manufacturing a separator for a fuel cell includes a step of applying a laser beam to a surface of a plate-shaped metal plate having a rectangular shape such that an application range of the laser beam extends linearly. In the step, the laser beam is applied such that the application range includes a high-energy region in which energy to be given by the laser beam per unit distance in a direction where the application range extends linearly is high, and a low-energy region in which the energy is low. The high-energy region includes a first region, a second region, a third region, and a fourth region. The first region and the second region extend in parallel to one of long sides of the rectangular shape. The third region and the fourth region extend in parallel to the other one of the long sides.

A manufacturing method for manufacturing a separator for a fuel cell includes a step of applying a laser beam to a surface of a plate-shaped metal plate having a rectangular shape such that an application range of the laser beam extends linearly. In the step, the laser beam is applied such that the application range includes a high-energy region in which energy to be given by the laser beam per unit distance in a direction where the application range extends linearly is high, and a low-energy region in which the energy is low. The high-energy region includes a first region, a second region, a third region, and a fourth region. The first region and the second region extend in parallel to one of long sides of the rectangular shape. The third region and the fourth region extend in parallel to the other one of the long sides.

A method of assembling together a first part and at least one second part that are made of materials compatible with bonding by molecular adhesion includes a step of pressing a first surface of the first part against a second surface of the second part so as to create molecular bonds at an interface between the parts, and a step of consolidating the interface bonding as created in this way by heat treatment. The consolidation includes a step of emitting a power laser beam towards an impact point forming a portion of the outline of the interface, and a step of moving the impact point along the outline of the interface.

A display device includes: a first substrate in which a display area and a non-display area disposed outside the display area are defined; a second substrate facing the first substrate; and a cell seal disposed on the non-display area, where the cell seal includes a bonding filament connecting the first substrate and the second substrate to each other.