A method of manufacturing a shaft of a surgical instrument including forming a proximal segment of the shaft to include one or more features for operably engaging the shaft to a first component of the surgical instrument, forming a distal segment of the shaft to include one or more features for operably engaging the shaft to a second component of the surgical instrument and forming an intermediate segment of the shaft. The proximal segment is welded to a proximal end of the intermediate segment; and the distal segment is welded to a distal end of the intermediate segment. The proximal and distal segments are welded to the intermediate segment such that the one or more features thereof are aligned in a pre-determined orientation relative to one another.

The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a laser unit that irradiates a laser beam to the substrate supported by the support unit, the laser unit includes an irradiation member that irradiates the laser beam, a lens disposed on a travel path of the laser beam irradiated by the irradiation member to be rotatable, and a reflection member having an inclined surface for changing the travel path of the laser beam that passed through the lens.

A rotor for use in an aircraft engine, that has been repaired by (a) welding together a first portion of a damaged blade of the rotor and a second portion of metal to form a weld nugget, (b) compressively stressing the weld nugget throughout its volume, and (c) heat treating the compressively stressed weld nugget to recrystallize metal therein.

A rotor for use in an aircraft engine, that has been repaired by (a) welding together a first portion of a damaged blade of the rotor and a second portion of metal to form a weld nugget, (b) compressively stressing the weld nugget throughout its volume, and (c) heat treating the compressively stressed weld nugget to recrystallize metal therein.

A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.

A laser processing device for processing workpieces such as by welding includes a laser processing head and a workpiece clamping claw defining an opening through which the laser beam is focused on the workpiece. Each of the laser processing head and the clamping claw have respective shielding portions and movable relative to each other to selectively form a light-tight housing about a portion of the beam extending between the laser head and the clamping claw.

A laser processing device for processing workpieces such as by welding includes a laser processing head and a workpiece clamping claw defining an opening through which the laser beam is focused on the workpiece. Each of the laser processing head and the clamping claw have respective shielding portions and movable relative to each other to selectively form a light-tight housing about a portion of the beam extending between the laser head and the clamping claw.

A process of fabricating a shield, a process of preparing a component, and an erosion shield are disclosed. The process of fabricating the shield includes forming a near-net shape shield. The near-net shape shield includes a nickel-based layer and an erosion-resistant alloy layer. The nickel-based layer is configured to facilitate secure attachment of the near-net shaped to a component. The process of preparing the component includes securing a near-net shape shield to a substrate of a component.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Embodiments of the present disclosure provide a mask assembly and a manufacturing method thereof. The mask assembly includes: a frame; a mask provided with a mask area and connection areas positioned on opposite sides of the mask area; and a plurality of first connection parts in each connection area, wherein the plurality of first connection parts in each connection area are arranged in M rows and N columns, each row includes a plurality of first connection parts, each column includes at least one first connection part, and in the same connection area, the first connection parts of any two adjacent rows are arranged in a staggered manner, where each of M and N is an integer larger than 1, and the mask is fixed to the frame via the plurality of first connection parts.