The present disclosure relates to a method for operating and controlling a laser device for engraving, marking, lettering and/or cutting a flat workpiece, in which at least one beam source in the form of a laser is used in a housing of the laser device. The workpiece is deposited in a defined manner on a processing table in the processing chamber of the housing and a laser beam emitted by the beam source is sent via deflecting elements to at least one focusing unit, from which the laser beam is deflected in the direction of the workpiece and focused for processing. Control is effected by means of control software which runs in a control unit and in which a so-called job is processed, so that the workpiece is processed line by line by adjustment of a movement system.

The present disclosure relates to a method for operating and controlling a laser device for engraving, marking, lettering and/or cutting a flat workpiece, in which at least one beam source in the form of a laser is used in a housing of the laser device. The workpiece is deposited in a defined manner on a processing table in the processing chamber of the housing and a laser beam emitted by the beam source is sent via deflecting elements to at least one focusing unit, from which the laser beam is deflected in the direction of the workpiece and focused for processing. Control is effected by means of control software which runs in a control unit and in which a so-called job is processed, so that the workpiece is processed line by line by adjustment of a movement system.

A method of forming an integrated circuit is described. The method first positions a semiconductor wafer in a processing chamber, and second, laser anneals at least a portion of the semiconductor wafer. The laser annealing includes tracing a first laser beam, in a first path having a first direction, across the at least a portion of the semiconductor wafer, tracing a second laser beam, in a second path having a second direction, opposite to and colinear with the first direction, across the at least a portion of the semiconductor wafer.

Methods and apparatus for extending the lifetime of optical components are disclosed. A beam of laser energy directed along a beam path that intersects a scan lens, through which it can be transmitted. The beam path can be deflected within a scan region of the scan lens to process a workpiece with the laser energy transmitted by the scan lens. The scan region can be shifted to a different location within the scan lens, e.g., to delay or avoid accumulation of laser-induced damage within the scan lens, while processing a workpiece.

A method of processing an object with a light beam includes the following steps: projecting a light beam onto the object via a first scanner so as to produce a heated area by locally heating the object; displacing the heated area along a track on the object; capturing images of a first portion of the object with a first camera, via the first scanner; and capturing images of a second portion of the object with a second camera, via a second scanner.

The first scanner and the second scanner are operated so that the first camera captures images of the heated area, whereas the second camera captures images of portions of the object behind and/or ahead of the heated area.

The invention relates to a laser scanning system and associated method. In a disclosed arrangement the method comprises using a laser source to produce a laser beam; using a scanning module to scan the laser beam over the surface of a substrate; and using a redirecting unit at a position in a beam path of the laser beam between the scanning module and the substrate to control the direction of incidence of the laser beam onto the substrate, wherein: the laser beam is scanned over a predetermined region on the substrate in such a way that each portion of the region is exposed by the laser beam from a plurality of different directions of incidence.

After remelting in a suitable mold for reducing grain boundaries, an oxidation-resistant material is epitaxially grown so that the oxidation resistance of a repaired material or also of a new part is improved.

A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.

The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a laser unit that irradiates a laser beam to the substrate supported by the support unit, the laser unit includes an irradiation member that irradiates the laser beam, a lens disposed on a travel path of the laser beam irradiated by the irradiation member to be rotatable, and a reflection member having an inclined surface for changing the travel path of the laser beam that passed through the lens.

The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a laser unit that irradiates a laser beam to the substrate supported by the support unit, the laser unit includes an irradiation member that irradiates the laser beam, a lens disposed on a travel path of the laser beam irradiated by the irradiation member to be rotatable, and a reflection member having an inclined surface for changing the travel path of the laser beam that passed through the lens.