Provided is a laser mark printing method and a method of producing a laser-marked silicon wafer that can reduce the machining strain left around dots constituting a laser mark. In a method of printing a laser mark having a plurality of dots on a silicon wafer, the plurality of dots are formed using laser light having a wavelength in the ultraviolet region.

In a first aspect, the invention relates to a laser treatment head comprising an input for a laser bundle, and further provided with a lens system for focusing the laser bundle and a scanning system for deflecting the laser bundle according to a one-dimensional or two-dimensional touch pattern. In particular, the laser treatment head further comprises an directional body configurable relative to the casing between at least a first position and a second position, for variably emitting the deflected laser bundle with said touch pattern, in at least a first or a second emission direction. In further aspects, the invention relates to a laser treatment device and a laser treatment process.

In a first aspect, the invention relates to a laser treatment head comprising an input for a laser bundle, and further provided with a lens system for focusing the laser bundle and a scanning system for deflecting the laser bundle according to a one-dimensional or two-dimensional touch pattern. In particular, the laser treatment head further comprises an directional body configurable relative to the casing between at least a first position and a second position, for variably emitting the deflected laser bundle with said touch pattern, in at least a first or a second emission direction. In further aspects, the invention relates to a laser treatment device and a laser treatment process.

The present application relates to an apparatus (10) for laser processing, comprising at least two laser sources, which are different from one another and are configured for supplying respective laser beams having wavelengths different from one another, a laser head (20), which can be operated as end tool of a laser machine tool (90) that can be configured for carrying out at least one type of laser processing operation that can be selected from a set of types of laser processing operations, and a set of orientable optical components (16) so as to provide a set of selectable optical paths for directing a laser beam supplied by a laser source of said at least two laser sources, and a control unit (30) coupled to the at least two laser sources, to the set of orientable optical components (16), and to the laser head (20) and configured for controlling the at least two laser sources, the set of orientable optical components (16), and the laser head (20) according to the type of laser processing operation selected from the set of types of laser processing operations, i.e., so as to supply and direct a laser beam associated to the respective type of processing operation onto a region of a work surface (110). The laser head (20) comprises a set of nozzles (40, 42, 44, 46) configured for directing at least one processing material onto the working region (110), which comprises at least one nozzle (40) configured for directing jets of powder of at least one material, preferably powder of metal material (in brief metal powder), as well as comprising at least one of the following: a) a first nozzle (42) configured for directing a metal wire onto the working region, preferably metal wire for laser welding; and b) a second nozzle (46) configured for directing an assist gas onto the working region, preferably an assist gas for laser welding, and wherein the control unit (30) is coupled to the set of nozzles and is configured for controlling at least one nozzle of said set of nozzles (40, 42, 44, 46) according to the type of associated and selected laser processing operation so as to control said at least one nozzle so that it will direct respective processing materials onto the working region (110) simultaneously with direction of the laser beam (L) associated to the type of laser processing operation selected.

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer, the mask including a layer covering and protecting the integrated circuits. The mask and a portion of the semiconductor wafer are patterned with a laser scribing process to provide a patterned mask and to form trenches partially into but not through the semiconductor wafer between the integrated circuits. Each of the trenches has a width. The semiconductor wafer is plasma etched through the trenches to form corresponding trench extensions and to singulate the integrated circuits. Each of the corresponding trench extensions has the width.

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer, the mask including a layer covering and protecting the integrated circuits. The mask and a portion of the semiconductor wafer are patterned with a laser scribing process to provide a patterned mask and to form trenches partially into but not through the semiconductor wafer between the integrated circuits. Each of the trenches has a width. The semiconductor wafer is plasma etched through the trenches to form corresponding trench extensions and to singulate the integrated circuits. Each of the corresponding trench extensions has the width.

A laser module includes a laser source and at least one air knife. The laser source is configured to be coupled to a robotic arm of a robotic device, and emit a laser beam for processing a workpiece having a workpiece surface. The air knife is configured to be coupled to the robotic arm, and discharge an airflow sheet in a direction toward a laser spot where the laser beam impinges the workpiece surface, for clearing contaminants generated by impingement of the laser beam.

A machine tool arranged to deliver an energy source through a processing head onto a work-piece, wherein; the machine-tool has a clamping mechanism arranged to temporarily receive the processing-head, or another machining or processing-head, to process a work-piece; the processing-head comprising one or more guiding mechanisms arranged to direct the energy source onto a work-piece and a processing-head docking-manifold arranged to have connected thereto one or more media to be, in use, supplied to the processing-head to facilitate processing of the work-piece; wherein the processing-head docking-manifold allows the one or more media to be supplied to the processing-head when the processing-head is connected to the clamping mechanism; and wherein the machine-tool also comprises at least one mechanism arranged to move a supply docking-manifold into and/or out of connection with the processing-head docking-manifold such that when the two manifolds are connected the or each media is supplied to the processing head.

A machine tool arranged to deliver an energy source through a processing head onto a work-piece, wherein; the machine-tool has a clamping mechanism arranged to temporarily receive the processing-head, or another machining or processing-head, to process a work-piece; the processing-head comprising one or more guiding mechanisms arranged to direct the energy source onto a work-piece and a processing-head docking-manifold arranged to have connected thereto one or more media to be, in use, supplied to the processing-head to facilitate processing of the work-piece; wherein the processing-head docking-manifold allows the one or more media to be supplied to the processing-head when the processing-head is connected to the clamping mechanism; and wherein the machine-tool also comprises at least one mechanism arranged to move a supply docking-manifold into and/or out of connection with the processing-head docking-manifold such that when the two manifolds are connected the or each media is supplied to the processing head.

A laser turning system (1) for producing a component (60) having a length less than 250 mm and/or a diameter less than 10 mm, the system including a rotary spindle (3) for moving a bar of material and a galvanometric scanner (12) capable of emitting a femtosecond laser beam scanning a generating profile of the component to be machined in the bar of material.