A laser marking head and a laser marking machine are disclosed. The laser marking head includes: a laser generator, the laser generator being configured to emit laser; a first guide rail; a first sliding device, the first sliding device being sleeved on and being capable of sliding on the first guide rail; a first reflector, the first reflector being positioned on the first sliding device; a second guide rail, the second guide rail being fixed on the first sliding device and being perpendicular to the first guide rail; a second sliding device, the second sliding device being sleeved on and being capable of sliding on the second guide rail; and a second reflector, the second reflector being positioned on the second sliding device.

A laser marking head and a laser marking machine are disclosed. The laser marking head includes: a laser generator, the laser generator being configured to emit laser; a first guide rail; a first sliding device, the first sliding device being sleeved on and being capable of sliding on the first guide rail; a first reflector, the first reflector being positioned on the first sliding device; a second guide rail, the second guide rail being fixed on the first sliding device and being perpendicular to the first guide rail; a second sliding device, the second sliding device being sleeved on and being capable of sliding on the second guide rail; and a second reflector, the second reflector being positioned on the second sliding device.

A processing system includes a holding apparatus for hold an object to be rotatable; a rotation apparatus for rotating the holding apparatus; a beam irradiation apparatus for irradiating the object with an energy beam; an object measurement apparatus for measuring the object; and a control apparatus for controlling at least one of the beam irradiation apparatus and the rotation apparatus based on an information related to the object measured by the object measurement apparatus and an information of a rotational axis of the rotation apparatus, and processes the object by irradiating the object held by the holding apparatus with the energy beam from the beam irradiation apparatus.

A multi-level semiconductor device, the device including: a first level including integrated circuits; a second level including a structure designed to conduct electromagnetic waves, where the second level is disposed above the first level, where the integrated circuits include single crystal transistors; and an oxide layer disposed between the first level and the second level, where the integrated circuits include at least one processor, where the second level is bonded to the oxide layer, and where the bonded includes oxide to oxide bonds.

Methods and apparatus for extending the lifetime of optical components are disclosed. A beam of laser energy directed along a beam path that intersects a scan lens, through which it can be transmitted. The beam path can be deflected within a scan region of the scan lens to process a workpiece with the laser energy transmitted by the scan lens. The scan region can be shifted to a different location within the scan lens, e.g., to delay or avoid accumulation of laser-induced damage within the scan lens, while processing a workpiece.

A label has a topcoat layer and a sacrificial layer. The topcoat layer has a first color having a first L-value and the sacrificial layer has a second color having a second L-value. The topcoat layer comprises at least one reflective pigment and a polymeric binder and the sacrificial layer comprises at least one infrared (IR) absorbing material and a polymeric binder. The first L-value is greater than the second L-value, and the total amount of the at least one reflective pigment is from 40 wt % to 80 wt %, based on the weight of the topcoat layer.

A label has a topcoat layer and a sacrificial layer. The topcoat layer has a first color having a first L-value and the sacrificial layer has a second color having a second L-value. The topcoat layer comprises at least one reflective pigment and a polymeric binder and the sacrificial layer comprises at least one infrared (IR) absorbing material and a polymeric binder. The first L-value is greater than the second L-value, and the total amount of the at least one reflective pigment is from 40 wt % to 80 wt %, based on the weight of the topcoat layer.

Methods, devices, apparatus, and systems are described for separating workpiece parts from workpieces using a focused machining beam. The methods include creating a trough in the workpiece using the focused machining beam, the trough being created along at least one section of a contour of the at least one workpiece part to be separated from the workpiece, altering a focal position of the machining beam such that the machining beam has a smaller beam diameter on the workpiece, and creating a gap in the workpiece using the machining beam with the altered focal position along at least one section of the contour of the at least one workpiece part to be separated from the workpiece. The gap is created at least partially within the trough.

Laser cleaning equipment and a cleaning method for a shaft component are provided. The equipment includes: a supporting base assembly; two driving wheel structures on the supporting base assembly, driving wheels of each of which is configured for being close to or away from each other, and the shaft component to be cleaned is placed between the two driving wheel structures; a friction wheel structure that is tangent to driving wheel structure(s) and uses a friction force thereof to drive driving wheel structure(s) to rotate; a connection shaft assembly that coaxially passes through the friction wheel structure; a power driving mechanism, one end of which that faces toward the connection shaft assembly is in drive connection with the connection shaft assembly and is configured to drive the connection shaft assembly to rotate; and a laser cleaning mechanism configured for performing laser cleaning on the shaft component to be cleaned.

Laser cleaning equipment and a cleaning method for a shaft component are provided. The equipment includes: a supporting base assembly; two driving wheel structures on the supporting base assembly, driving wheels of each of which is configured for being close to or away from each other, and the shaft component to be cleaned is placed between the two driving wheel structures; a friction wheel structure that is tangent to driving wheel structure(s) and uses a friction force thereof to drive driving wheel structure(s) to rotate; a connection shaft assembly that coaxially passes through the friction wheel structure; a power driving mechanism, one end of which that faces toward the connection shaft assembly is in drive connection with the connection shaft assembly and is configured to drive the connection shaft assembly to rotate; and a laser cleaning mechanism configured for performing laser cleaning on the shaft component to be cleaned.