A controller performs a first process of scanning a cylindrical irradiation region including a focused spot of laser light emitted from a laser light emitter to machine a flank face side of a workpiece to manufacture a cutting tool having a plurality of cutting edges arranged in line. In the first process, the controller scans the cylindrical irradiation region along a scanning path that has periodicity and changes a machining depth to form the plurality of cutting edges. The controller further performs a second process of scanning the cylindrical irradiation region including the focused spot of the laser light emitted in a direction different from an irradiation direction of the laser light in the first process to machine a rake face side of the workpiece.

A laser cutting machine includes a first bearing structure and a second bearing structure, a first support structure and a second support structure, a bridge, and a laser head. Each of the first and second bearing structures includes a support structure interface. The first support structure is configured to engage the support structure interface of the first bearing structure and the second support structure is configured to engage the support structure interface of the second bearing structure. The bridge is attached to the first support structure at a first intermediate support region and to the second support structure at a second intermediate support region and is configured to move in a first direction. The laser head is configured to move along the bridge in a second direction.

A radiation pumped heater includes a ceramic substrate which is heated by a laser beam to a steady state temperature. An optical fiber is heated by conduction and radiation emitted from the ceramic substrate.

A radiation pumped heater includes a ceramic substrate which is heated by a laser beam to a steady state temperature. An optical fiber is heated by conduction and radiation emitted from the ceramic substrate.

An example method of making a component includes providing a digital model of a component to a software program, the software program operable to slice the digital model into digital layers and raster each digital layer into digital segments, the digital segments delineated by digital raster lines. The method further includes depositing a first layer of powdered material onto a platform, compacting the first layer of powered material into a first compacted layer, sintering the first compacted layer along lines corresponding to the digital raster lines using a laser, wherein the laser operates at a first power and a first scan speed, and sintering the first compacted layer along a perimeter of the first compacted layer using the laser to form a first unitary layer, wherein the laser operates at a second power and a second scan speed, wherein the ratio of the first power to the second power is less than about 3. An apparatus for making a component is also disclosed.

An example method of making a component includes providing a digital model of a component to a software program, the software program operable to slice the digital model into digital layers and raster each digital layer into digital segments, the digital segments delineated by digital raster lines. The method further includes depositing a first layer of powdered material onto a platform, compacting the first layer of powered material into a first compacted layer, sintering the first compacted layer along lines corresponding to the digital raster lines using a laser, wherein the laser operates at a first power and a first scan speed, and sintering the first compacted layer along a perimeter of the first compacted layer using the laser to form a first unitary layer, wherein the laser operates at a second power and a second scan speed, wherein the ratio of the first power to the second power is less than about 3. An apparatus for making a component is also disclosed.

A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

A laser processing method of performing laser processing on a transparent material that is transparent to ultraviolet light by using a laser processing system includes: performing relative positioning of a transfer position of a transfer image and the transparent material in an optical axis direction of a pulse laser beam so that the transfer position is set at a position inside the transparent material at a predetermined depth Zsf from a surface of the transparent material in the optical axis direction; and irradiating the transparent material with the pulse laser beam having a pulse width of 1 ns to 100 ns inclusive and a beam diameter of 10 m to 150 m inclusive at the transfer position.

The invention relates to a method for machining a transparent workpiece (4) by generating non-linear absorption of laser radiation in a laser beam focus located in a volume of the workpiece (4). The object of the invention is that of providing a method of improved precision and quality, and a corresponding device, for laser machining of workpieces. In particular, it is also intended for it to be possible for workpieces made of composite materials or of other special materials, such as filter glass, to be machined at an improved level of quality. For this purpose, the method according to the invention comprises the following steps: spectroscopic measurement of the linear absorption of the laser radiation in the workpiece (4), selecting a working wavelength at which the linear absorption is low, and machining the workpiece (4) by means of application of laser radiation at the working wavelength. The invention furthermore relates to a corresponding device for machining a transparent workpiece (4).